CN202377689U - Layered composite solder - Google Patents
Layered composite solder Download PDFInfo
- Publication number
- CN202377689U CN202377689U CN2011204895968U CN201120489596U CN202377689U CN 202377689 U CN202377689 U CN 202377689U CN 2011204895968 U CN2011204895968 U CN 2011204895968U CN 201120489596 U CN201120489596 U CN 201120489596U CN 202377689 U CN202377689 U CN 202377689U
- Authority
- CN
- China
- Prior art keywords
- metal
- layer
- based alloy
- solder
- precious metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model relates to a layered composite solder which is used for welding between metal and metal, between metal and ceramic, between ceramic and ceramic and the like. The composite solder is composed of an upper layer (1) made of precious metal-based alloy, an intermediate layer (2) made of anaerobic copper or copper-silver alloy and a lower layer (3) made of precious metal-based alloy, wherein the layer thickness ratio of the upper layer to the middle layer to the lower layer is (0.5-2): (0.5-4): (0.5-2). The precious metal-based alloy solder of the upper layer and the precious metal-based alloy solder of the lower layer is one or two of Ag, AgCu10-50, AgCu10-50 Ni0.1-0.45, AgCu23-28 In9-16, AgCu20-32 Pd5-20, Au79-81Cu19-21, Au82-83Ni17-18, AuAg2-20Cu10-55. The interlayer layer is made of oxygen-free copper or copper-silver alloy. The composite solder has good welding performance and can meet the performance requirement of the vacuum electronic industry on the solder.
Description
Technical field
The utility model relates to technical field of welding materials, specifically a kind of stratiform composite soldering of welding between mother metals such as metal and metal, metal and pottery, pottery and pottery of being used for.
Background technology
At present, the vacuum electronic industry has the part solder to adopt money base or auri solder, carries out the welding between the materials such as copper, pottery, expansion alloy.This type of solder, because of containing noble metal, thereby price is higher and the noble metal resource-constrained; For reducing the noble metal dosage in the solder; Some solders adopt formation new alloys such as adding Cd, Zn; But can not be used for the vacuum electronic industry because of elements such as the Cd that contains high-vapor-pressure, Zn exist, some solders adopt the mode of adding Sn, Si to form alloy, but because added elements such as Sn, Si; Cause material too crisp and be difficult for being shaped to strip or silk ribbon, thus big limitations their use.
The utility model content
The purpose of the utility model is to provide that a kind of to contain noble metal amount low, has low melting point, low-steam pressure, can satisfy the vacuum electronic industry requirement, and can be shaped to the stratiform composite soldering of strip or silk ribbon shape.
The composite soldering of the utility model is that the lower floor by the intermediate layer of the upper strata of precious metal-based alloy, oxygen-free copper or Kufil and precious metal-based alloy connects and composes successively, and the bed thickness ratio of upper, middle and lower-ranking is 0.5～2:0.5～4:0.5～2.
The precious metal-based alloy of upper and lower layer is Ag, AgCu
10～50, AgCu
10～50Ni
0.1～0.45, AgCu
23～28In
9～16, AgCu
20～32Pd
5～20, Au
79～81Cu
19～21, Au
82～83Ni
17～18, AuAg
2～20Cu
10～55In one or both (AgCu
10～50Copper content is weight percentage 10～50% in the expression Kufil).The intermediate layer is that oxygen-free copper or oxygen content are not more than 0. 01% Kufil CuAg
0.1～10
The stratiform composite soldering of the utility model; Be that the bilevel precious metal-based alloy band that width is suitable and the oxygen-free copper stripe or the Kufil band in intermediate layer carry out surface treatment (cleaning up); In will going up then down three-layer metal be rolled after superimposed compoundly, obtain the stratiform composite soldering through diffusion annealing and precision rolling.The stratiform composite soldering of the utility model has good welding performance.Can carry out various hot and cold pressure machine-shapings, can weld and machining, can satisfy the performance requirement of vacuum electronic industry brazing material.
The beneficial effect of the utility model is:
1, the intermediate layer of stratiform composite soldering can effectively absorb the thermal stress after the welding, further prevents mother metal (metal that is soldered is called mother metal) hot tearing.
2, the throat depth fluctuation is little, helps the dimensional accuracy control of workpiece.
3, the thermal shock load that workpiece receives can be effectively carried in the intermediate layer of stratiform composite soldering, and workpiece will obtain increase to a certain degree service life.
4, scolder has been practiced thrift noble metal dosage, and cost is lower.
Description of drawings
Fig. 1 is the stratiform composite soldering structural representation of the utility model.
Among the figure, the 1-upper strata is the precious metal-based alloy, and the 2-intermediate layer is oxygen-free copper or Kufil, and 3-lower floor is the precious metal-based alloy.
The specific embodiment
As shown in Figure 1, the stratiform composite soldering of the utility model is connected and composed by the intermediate layer 2 of upper strata 1, oxygen-free copper or the Kufil of precious metal-based alloy and the lower floor 3 of precious metal-based alloy successively; The bed thickness of upper, middle and lower-ranking is than being the arbitrary ratio in 0.5～2:0.5～4:0.5～2 scopes, for example: 1:4:1; 1:3:1; 1:2:1; 1:2.5:1; 1:0.5:1; 1:3.5:1; 1:4.5:1; 1:5:1 etc.
The precious metal-based alloy of upper and lower layer is Ag, AgCu
10～50, AgCu
10～50Ni
0.1～0.45, AgCu
23～28In
9～16, AgCu
20～32Pd
5～20, Au
79～81Cu
19～21, Au
82～83Ni
17～18, AuAg
2～20Cu
10～55In one or both (AgCu
10～50Copper content is weight percentage 10～50% in the expression Kufil).The intermediate layer is that oxygen-free copper or oxygen content are not more than 0. 01% Kufil CuAg
0.1～10
Method for making to equal wide, is cleaned upper, middle and lower layer band sub-cut with water the processing strip surface, superimposedly is rolled compoundly, after diffusion annealing, is rolled down to 0.1mm thickness again, the stratiform composite soldering.
Claims (2)
1. stratiform composite soldering; It is characterized in that this composite soldering is connected and composed by the intermediate layer (2) of upper strata (1), oxygen-free copper or the Kufil of precious metal-based alloy and the lower floor (3) of precious metal-based alloy successively, the bed thickness ratio of upper, middle and lower-ranking is 0.5～2:0.5～4:0.5～2.
2. stratiform composite soldering according to claim 1 is characterized in that the intermediate layer is that oxygen-free copper or oxygen content are not more than 0.01% Kufil CuAg
0.1～10
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204895968U CN202377689U (en) | 2011-09-08 | 2011-12-01 | Layered composite solder |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120336687 | 2011-09-08 | ||
| CN201120336687.8 | 2011-09-08 | ||
| CN2011204895968U CN202377689U (en) | 2011-09-08 | 2011-12-01 | Layered composite solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202377689U true CN202377689U (en) | 2012-08-15 |
Family
ID=46626207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204895968U Expired - Fee Related CN202377689U (en) | 2011-09-08 | 2011-12-01 | Layered composite solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202377689U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104884170A (en) * | 2012-12-21 | 2015-09-02 | 恩德斯+豪斯流量技术股份有限公司 | Measuring system having a carrier element and a sensor |
| CN108598720A (en) * | 2018-05-04 | 2018-09-28 | 昆山徳可汽车配件有限公司 | A kind of resistance brazing formula harness and its processing technology |
| CN108581269A (en) * | 2018-05-02 | 2018-09-28 | 重庆金荣金属有限公司 | A kind of copper-based medium temperature composite solder |
-
2011
- 2011-12-01 CN CN2011204895968U patent/CN202377689U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104884170A (en) * | 2012-12-21 | 2015-09-02 | 恩德斯+豪斯流量技术股份有限公司 | Measuring system having a carrier element and a sensor |
| CN104884170B (en) * | 2012-12-21 | 2017-09-15 | 恩德斯+豪斯流量技术股份有限公司 | Measuring system with carrier element and sensor |
| CN108581269A (en) * | 2018-05-02 | 2018-09-28 | 重庆金荣金属有限公司 | A kind of copper-based medium temperature composite solder |
| CN108598720A (en) * | 2018-05-04 | 2018-09-28 | 昆山徳可汽车配件有限公司 | A kind of resistance brazing formula harness and its processing technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100521248C (en) | Electrode wire for solar battery | |
| CN100577344C (en) | Active mesothermal copper base solder, and preparation method thereof | |
| CN101214591B (en) | Low silver hypoeutectic Sn-Cu-Ag lead-free solder for electronic micro connection | |
| CN101913036B (en) | CuZnTi solder for soldering diamond tool | |
| CN101670365B (en) | Preparation method of double lateral insert silver-copper composite strip | |
| CN101480744B (en) | Method for producing metal and diamond composite body | |
| CN102398123A (en) | Laminated composite solder | |
| CN106271202B (en) | A kind of composite brazing material and preparation method thereof | |
| CN202377689U (en) | Layered composite solder | |
| CN104907723B (en) | Carry the medicine core silver solder of increasing tougheness alloy | |
| CN103032120A (en) | Powder metallurgy multiple mounted cam sheet and manufacturing method thereof | |
| CN108136548A (en) | Brazing alloy | |
| CN108270135A (en) | A kind of silver alloy cladding copper alloy composite filament brush material and preparation method thereof | |
| CN103243234B (en) | A kind of Electronic Packaging soldering serial low silver leadless solder and preparation method thereof | |
| CN102489894B (en) | Novel composite welding flux | |
| CN102626838B (en) | Silver-based cadmium-free medium temperature brazing filler metal and preparation method thereof | |
| CN111468719A (en) | Silver tin oxide sheet-shaped electrical contact and preparation method thereof | |
| CN111468857B (en) | Composite solder and preparation method and application thereof | |
| CN111468718B (en) | Silver copper oxide sheet-shaped electric contact and preparation method thereof | |
| CN107199416A (en) | A kind of brass silver-less solder alloy | |
| CN100463763C (en) | Cu-P-Ag solder containing Ga, In and Ce | |
| CN108044252B (en) | Impact-resistant flux-cored composite brazing cake with spiral framework and preparation method thereof | |
| CN2460289Y (en) | Double-metal compound wire of stainless steel cladded carbon steel | |
| CN108381058A (en) | One kind high-performance solder of low-silver copper-base containing Ga and preparation method thereof | |
| CN101733576A (en) | Sn-Ag-Cu-Bi-Cr quinary alloy lead-free solder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120815 Termination date: 20121201 |