CN202353917U - Multilayer flexible printed circuit board - Google Patents
Multilayer flexible printed circuit board Download PDFInfo
- Publication number
- CN202353917U CN202353917U CN2011204431179U CN201120443117U CN202353917U CN 202353917 U CN202353917 U CN 202353917U CN 2011204431179 U CN2011204431179 U CN 2011204431179U CN 201120443117 U CN201120443117 U CN 201120443117U CN 202353917 U CN202353917 U CN 202353917U
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- China
- Prior art keywords
- line layer
- layer
- line
- circuit board
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a multilayer flexible printed circuit board. The multilayer flexible printed circuit board at least comprises a first circuit layer and a second circuit layer, which are overlapped with each other. An input port and an output port are arranged on the first circuit layer or the second circuit layer. The multilayer flexible printed circuit board is characterized in that both the first circuit layer and the second circuit layer are directly and electrically connected with the input port and the output port; a folding line is formed between the first circuit layer and the second circuit layer; and the first circuit layer and the second circuit layer are folded along the folding line so as to form an overlapping structure. The multilayer flexible printed circuit board has a simple structure, and can improve the reliability and yield of products.
Description
Technical field:
The utility model relates to a kind of multi-layer flexible printed circuit board.
Background technology:
The design of present most of multi-layer flexible printed circuit board and manufacturing are to adopt the mode that is similar to the multilayer hardboard to realize; Each layer line layer that constitutes multi-layer flexible printed circuit board is successively mutual gluing pressing cambium layer stack structure, and the connection of the circuit between each layer is to utilize the mode of the heavy copper of via hole to realize connecting.But since flexible material itself intrinsic material thermal expansion coefficient big; Exist between layer and the layer pressing via hole bad and the interlayer circuit to sink copper and be connected defectives such as open circuit; Cause the acceptance rate of multi-layer flexible printed circuit board lower, the reliability of finished product is also poor.
Summary of the invention:
The purpose of the utility model is to provide a kind of multi-layer flexible printed circuit board, and it is simple in structure, can improve reliability of products and acceptance rate.
A kind of multi-layer flexible printed circuit board; At least first line layer and second line layer that comprise mutual range upon range of setting; First line layer or second line layer are provided with input port and output port; It is characterized in that: said first line layer and second line layer all directly are electrically connected with said input port and output port, are provided with broken line between first line layer and second line layer, and first line layer and second line layer are folded to form stepped construction along said broken line.
Said input port and output port are located on second line layer; And input port and output port directly are electrically connected with second line layer, said first line layer walk around behind the said broken line directly be located at second line layer on said input port and output port be electrically connected.
Corresponding input port and output port place are provided with stiffening plate on said second line layer, and stiffening plate is between first line layer and second line layer.
The both sides of said broken line are provided with the doubling location hole of symmetry respectively at first line layer and second line layer.
Also be provided with the double faced adhesive tape adhered layer between said first line layer and the stiffening plate.
Said first line layer and/or second line layer comprise the flexible insulation bearing substrate and are located on the flexible insulation bearing substrate or interior data signal line and earth connection.
The multi-layer flexible printed circuit board of the utility model; Have following advantage: 1, its first line layer and second line layer are folded to form stepped construction along broken line; Simple in structure, there is not the bad technical problem of gluing pressing, can improve reliability of products and acceptance rate.2, second line layer directly is electrically connected with input port and output port; Said first line layer walk around behind the said broken line directly be located at second line layer on said input port and output port be electrically connected; The problem of the open circuit that brings when not existing the heavy copper of via hole to connect, electric performance stablity.3, the stickup of the setting of doubling location hole and double faced adhesive tape can make folding multi-layer flexible printed circuit board form stable stepped construction, and does not have the problem of the glue that overflows.
Description of drawings:
Fig. 1 is the utility model expanded view.
Fig. 2 is the internal wiring connection layout of the utility model expanded view.
Fig. 3 is the folding back of the utility model front view.
Fig. 4 is the right view of Fig. 3.
Fig. 5 is the A portion cross-section structure enlarged diagram of Fig. 4.
Embodiment:
Extremely shown in Figure 5 like Fig. 1; A kind of multi-layer flexible printed circuit board; At least the input port 21 and the output port 22 that comprise first line layer 1, second line layer 2, be located on second line layer 2 and directly be electrically connected with second line layer 2; Be provided with broken line 3 between said first line layer 1 and second line layer 2, folding before, first line layer 1 and second line layer 2 are in same plane and both are one-body molded; First line layer 1 and second line layer 2 can be folded to form stepped construction along broken line 3, and first line layer 1 walk around said broken line 3 backs directly be located at second line layer 2 on said input port 21 and output port 22 be electrically connected.Corresponding input port 21 is provided with stiffening plate 4 with output port 22 places on said second line layer 2, and stiffening plate 4 also is provided with double faced adhesive tape adhered layer 5 between first line layer 1 and the stiffening plate 4 between first line layer 1 and second line layer 2.The both sides of said broken line 3 are provided with the doubling location hole 6 of symmetry respectively at first line layer 1 and second line layer 2.Said first line layer 1 and second line layer 2 comprise the flexible insulation bearing substrate and are located on the flexible insulation bearing substrate or interior plurality of data holding wire and earth connection.
The above is merely the preferred embodiment of the utility model; Be not to be used for limiting the scope that the utility model is implemented; The utility model also can comprise tertiary circuit layer, the 4th line layer even multilayer line line layer more; Each line layer is folded to form stepped construction with reference to aforementioned structure, and all equal variation and modifications of being done according to the utility model claim all fall into the scope that the utility model patent contains.
Claims (6)
1. multi-layer flexible printed circuit board; At least first line layer and second line layer that comprise mutual range upon range of setting; First line layer or second line layer are provided with input port and output port; It is characterized in that: said first line layer and second line layer all directly are electrically connected with said input port and output port, are provided with broken line between first line layer and second line layer, and first line layer and second line layer are folded to form stepped construction along said broken line.
2. a kind of multi-layer flexible printed circuit board according to claim 1; It is characterized in that: said input port and output port are located on second line layer; And input port and output port directly are electrically connected with second line layer, said first line layer walk around behind the said broken line directly be located at second line layer on said input port and output port be electrically connected.
3. a kind of multi-layer flexible printed circuit board according to claim 1 and 2 is characterized in that: corresponding input port and output port place are provided with stiffening plate on said second line layer, and stiffening plate is between first line layer and second line layer.
4. a kind of multi-layer flexible printed circuit board according to claim 3 is characterized in that: the both sides of said broken line are provided with the doubling location hole of symmetry respectively at first line layer and second line layer.
5. a kind of multi-layer flexible printed circuit board according to claim 3 is characterized in that: also be provided with the double faced adhesive tape adhered layer between said first line layer and the stiffening plate.
6. a kind of multi-layer flexible printed circuit board according to claim 3 is characterized in that: said first line layer and/or second line layer comprise the flexible insulation bearing substrate and are located on the flexible insulation bearing substrate or interior data signal line and earth connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204431179U CN202353917U (en) | 2011-11-10 | 2011-11-10 | Multilayer flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204431179U CN202353917U (en) | 2011-11-10 | 2011-11-10 | Multilayer flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202353917U true CN202353917U (en) | 2012-07-25 |
Family
ID=46542870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204431179U Expired - Fee Related CN202353917U (en) | 2011-11-10 | 2011-11-10 | Multilayer flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202353917U (en) |
-
2011
- 2011-11-10 CN CN2011204431179U patent/CN202353917U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20121110 |