CN103096641B - The manufacture method of connecting sheet circuit board - Google Patents
The manufacture method of connecting sheet circuit board Download PDFInfo
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- CN103096641B CN103096641B CN201110334008.8A CN201110334008A CN103096641B CN 103096641 B CN103096641 B CN 103096641B CN 201110334008 A CN201110334008 A CN 201110334008A CN 103096641 B CN103096641 B CN 103096641B
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Abstract
The invention provides a kind of manufacture method of connecting sheet circuit board, it comprises the following steps: provide one first connecting sheet circuit board, and described first connecting sheet circuit board comprises the bad first circuit board unit of at least one electrical measurement; There is provided one second connecting sheet circuit board, described second connecting sheet circuit board comprises the second circuit Slab element of at least one electrical measurement non-defective unit, and described second circuit Slab element is identical with first circuit board unit; By cutting, remove described first circuit board unit respectively and be separated described second circuit Slab element, being coordinated by stair-stepping section by the described second circuit Slab element be separated is bonded on described first connecting sheet circuit board after removing described first circuit board unit, forms the 3rd connecting sheet circuit board.
Description
Technical field
The present invention relates to circuit board making technology, particularly relate to a kind of manufacture method of connecting sheet circuit board.
Background technology
Usually, the manufacturing process of circuit board comprises: make a connecting sheet circuit board, described connecting sheet circuit board is the circuit board having formed circuit, described connecting sheet circuit board comprises multiple circuit board unit, garbage area and micro-force sensing district, namely circuit board unit separately also has separately the region of circuit function one by one after circuit board completes, and namely garbage area needs the part removed after circuit board piece.Wherein, each described circuit board unit is connected with garbage area by micro-force sensing district, and each described circuit board unit comprises at least one piece district, and this piece district is for mounting part; In the piece district print solder paste of each described circuit board unit; At the piece district of print solder paste attachment part; By being disconnected in described micro-force sensing district, each described circuit board unit after attachment part being separated from each other, forming circuit board finished product.If have electrical measurement defective products in each described circuit board unit, then do not need print solder paste and attachment part on described defective products, to save tin cream and part, but because the position of defective products is indefinite, need according to the position of defective products on each connecting sheet circuit board, the opening of the diverse location of the steel plate of print solder paste to be covered, in addition, also need during attachment part to mount according to the position adjustment attachment program of defective products on each connecting sheet circuit board, therefore aforesaid operations can reduce the efficiency of print solder paste and attachment part greatly, for improving printing and attachment efficiency, in actual production usually can on described defective products also print solder paste and attachment part, obviously, described defective products can not use after attachment part, therefore, cause the waste of tin cream and part, and the quantity of defective products is more, waste larger.
Summary of the invention
In view of this, be necessary to provide a kind of by transplanting the method, the tin cream caused by defective products during to reduce piece and the waste of part that form a fairly large number of connecting sheet circuit board of non-defective unit.
A kind of manufacture method of connecting sheet circuit board, it comprises the following steps: provide first connecting sheet circuit board, described first connecting sheet circuit board comprises multiple circuit board unit, and one is surrounded described multiple circuit board unit and the first garbage area be connected with described multiple circuit board unit, described multiple circuit board unit comprises at least one first circuit board unit, and at least one first circuit board unit described is electrical measurement defective products; Second connecting sheet circuit board is provided, described second connecting sheet circuit board comprises multiple circuit board unit, and one is surrounded described multiple circuit board unit and the second garbage area be connected with described multiple circuit board unit, in described multiple circuit board unit, at least one is electrical measurement defective products, described multiple second connecting sheet circuit board unit comprises at least one second circuit Slab element, at least one second circuit Slab element described is electrical measurement non-defective unit, and at least one second circuit Slab element described is identical with at least one first circuit board unit described; The position that at least one first circuit board unit described is connected with described first garbage area is cut off, described first connecting sheet circuit board forms stair-stepping first section, and remove at least one first circuit board unit described; The position that at least one second circuit Slab element described is connected with described second garbage area is cut off, at least one second circuit Slab element described forms stair-stepping second section, at least second circuit Slab element described in separation, wherein, described second section and described first section match; And described second section cooperation is bonded on described first section, thus at least one second circuit Slab element described in separation is bonded on described first connecting sheet circuit board after removing at least one first circuit board unit described, form the 3rd connecting sheet circuit board.
The manufacture method tool of the connecting sheet circuit board of the technical program has the following advantages: the circuit board unit being non-defective unit by the electrical measurement in one second connecting sheet circuit board is transplanted in one first connecting sheet circuit board, non-defective unit circuit board unit quantity in described first connecting sheet circuit board is increased, the tin cream caused by defective products when can reduce piece and the waste of part; And mutually bonding with the stair-stepping section that laser cutting is formed, the adhesion between the circuit board unit of transplanting and the first connecting sheet circuit board can be increased, prevent the circuit board unit transplanted during piece from coming off.
Accompanying drawing explanation
Fig. 1 is the floor map of the first connecting sheet circuit board that the technical program embodiment provides.
Fig. 2 is the generalized section of the first connecting sheet circuit board that the technical program embodiment provides.
Fig. 3 is the floor map of the second connecting sheet circuit board that the technical program embodiment provides.
Fig. 4 is the generalized section of the first connecting sheet circuit board that the technical program embodiment provides.
Fig. 5 is the generalized section after the first circuit board unit in Fig. 2 removes.
Fig. 6 is the generalized section after the tertiary circuit Slab element in Fig. 4 is separated.
Fig. 7 is the cutaway view of the 3rd connecting sheet circuit board after the transplanting that provides of the technical program embodiment.
Main element symbol description
| First connecting sheet circuit board | 10 |
| First circuit board unit | 101 |
| Second circuit Slab element | 102 |
| First garbage area | 103 |
| First micro-force sensing district | 104 |
| First bonding pad | 1041 |
| Second bonding pad | 1042 |
| 3rd bonding pad | 1043 |
| 4th bonding pad | 1044 |
| 5th bonding pad | 1045 |
| 6th bonding pad | 1046 |
| 7th bonding pad | 1047 |
| First conductive layer | 11 |
| Second conductive layer | 12 |
| First insulating barrier | 13 |
| First cover layer | 14 |
| Second cover layer | 15 |
| Second connecting sheet circuit board | 20 |
| Tertiary circuit Slab element | 201 |
| 4th circuit board unit | 202 |
| Second garbage area | 203 |
| Second micro-force sensing district | 204 |
| 8th bonding pad | 2041 |
| 9th bonding pad | 2042 |
| Tenth bonding pad | 2043 |
| 11 bonding pad | 2044 |
| 12 bonding pad | 2045 |
| 13 bonding pad | 2046 |
| 14 bonding pad | 2047 |
| First section | 105 |
| Second section | 106 |
| 3rd section | 107 |
| 4th section | 205 |
| 5th section | 206 |
| 6th section | 207 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
The connecting sheet circuit board provided the technical program below in conjunction with drawings and Examples and the manufacture method of connecting sheet circuit board are described in further detail.
The manufacture method of described connecting sheet circuit board comprises the following steps:
The first step, provides first connecting sheet circuit board 10.
Refer to Fig. 1, for the plane graph of described first connecting sheet circuit board 10, described first connecting sheet circuit board 10 is rectangle, it comprises a square first circuit board unit 101, one with first circuit board unit 101 square second circuit Slab element 102 side by side, one is surrounded described first circuit board unit 101 and second circuit Slab element 102 and is positioned at the first garbage area 103 of described first connecting sheet circuit board 10 periphery, and the first micro-force sensing district 104, wherein, described first circuit board unit 101 is electrical measurement non-defective unit, described second circuit Slab element 102 is electrical measurement defective products.Described first circuit board unit 101, second circuit Slab element 102 and the first garbage area 103 all have space between any two with spaced, interconnected between described first circuit board unit 101, second circuit Slab element 102 and the first garbage area 103 of described first micro-force sensing district 104, makes described first circuit board unit 101, second circuit Slab element 102 and the first garbage area 103 one-tenth as a whole.Described first micro-force sensing district 104 comprises the first to the 7th bonding pad 1041,1042,1043,1044,1045,1046,1047, bonding pad the 1041,1042,1043,1044,1045,1046,1047, described first to the 7th all in strip.Wherein, described first circuit board unit 101 is connected with described first garbage area 103 by the described first to the 3rd bonding pad 1041,1042,1043; Described first circuit board unit 101 is connected with described second circuit Slab element 102 by described 4th bonding pad 1044; Described second circuit Slab element 102 is connected with described first garbage area 103 by described 5th to the 7th bonding pad 1045,1046,1047.Described first to the 3rd bonding pad 1041,1043,1042 is symmetrical along the perpendicular bisector of the bearing of trend of described 4th bonding pad 1044 with described 5th to the 7th bonding pad 1045,1046,1047 respectively.In the present embodiment, described first connecting sheet circuit board 10 is as accepting the circuit board transplanting circuit board unit.
Refer to Fig. 2, for the profile of described first connecting sheet circuit board 10, in the present embodiment, first connecting sheet circuit board 10 is the double-sided flex circuit plate being formed with conducting wire, it the first cover layer 14 and the second cover layer 15 comprising the first insulating barrier 13 between the first conductive layer 11, second conductive layer 12, first conductive layer 11 and the second conductive layer 12 and lay respectively at outside the first conductive layer 11 and the second conductive layer 12.Wherein, the material of described first insulating barrier 13 is polyester (PET) or polyimides (PI) etc.; described first cover layer 14 and the second cover layer 15 all comprise one deck glue-line and layer protective layer; the glue-line of described first cover layer 14 and the glue-line of the second cover layer 15 bond with described first conductive layer 11 and the second conductive layer 12 respectively; the material of glue-line is epoxy resin or acrylic resin etc., and the material of protective layer is polyester (PET) or polyimides (PI) etc.
Wherein, described first connecting sheet circuit board 10 also can be single or multiple lift flexible circuit board, also can be individual layer, bilayer or multilayer hard circuit board.It should be noted that, on described first connecting sheet circuit board 10, the quantity of circuit board unit is not limit.Only illustrate to comprise two circuit board units in the present embodiment, in fact generally speaking the quantity of connecting sheet circuit board is two or more.As accepting the circuit board transplanting circuit board unit, on described first connecting sheet circuit board 10, the number needs of electrical measurement defective products is no less than one, and electrical measurement non-defective unit quantity is quite a few in one.Recommend the quantity of quantity more than electrical measurement defective products of electrical measurement non-defective unit, to reduce transplanting number of times, improve the efficiency of transplanting.Described first circuit board unit 101 and second circuit Slab element 102 also can be other shapes.The quantity of the bonding pad that described first micro-force sensing district 104 comprises can be also other, as long as can couple together between described circuit board unit and garbage area.
Second step, refers to Fig. 3 and Fig. 4, provides second connecting sheet circuit board 20.Except the electrical connection situation that described second connecting sheet circuit board 20 and described first connecting sheet circuit board 10 record except electrical measurement is different, other is substantially identical.
Described second connecting sheet circuit board 20 comprises a tertiary circuit Slab element 201, one with the 4th circuit board unit 202 of tertiary circuit Slab element 201 symmetry, second garbage area 203 and the second micro-force sensing district 204 being positioned at described second connecting sheet circuit board 20 periphery of a described tertiary circuit Slab element 201 of encirclement and the 4th circuit board unit 202, wherein, described tertiary circuit Slab element 201 is electrical measurement defective products, described 4th circuit board unit 202 is electrical measurement non-defective unit, and described second micro-force sensing district 204 comprises the 8th to the 14 bonding pad 2041, 2042, 2043, 2044, 2045, 2046, 2047, wherein, described 8th to the tenth bonding pad 2041, 2042, described tertiary circuit Slab element 201 is connected with described second garbage area 203 by 2043, and described tertiary circuit Slab element 201 is connected with described 4th circuit board unit 202 by described 11 bonding pad 2044, described 12 to the 14 bonding pad 2045, 2046, described 4th circuit board unit 202 is connected with described second garbage area 203 by 2047.In the present embodiment, described second connecting sheet circuit board 20 is as the circuit board providing non-defective unit circuit board unit.
Wherein, on described second connecting sheet circuit board 20, the quantity of circuit board unit also can be two or more, as the circuit board of circuit board unit providing non-defective unit, on described second connecting sheet circuit board 20, electrical measurement non-defective unit quantity is no less than one, recommend the quantity of electrical measurement defective products more than the quantity of electrical measurement non-defective unit, make it have necessity of the circuit board as the circuit board unit providing non-defective unit.Certainly, described second connecting sheet circuit board 20 also can be different from described first connecting sheet circuit board 10, have at least one circuit board unit identical with second circuit Slab element 102.
3rd step, refers to Fig. 5, by laser cutting, removes described second circuit Slab element 102.That is, by laser cutting, described 4th to the 7th bonding pad is cut off, described second circuit Slab element 102 is separated with described first garbage area 103 and first circuit board unit 101, to remove described second circuit Slab element 102.
The cut-out mode of described 4th to the 7th bonding pad 1044,1045,1046,1047 is identical, is described with the example that is cut to of the 7th bonding pad 1047 in scheming.Defining two faces that described 7th bonding pad 1047 is connected with the surface of described first cover layer 14 and the surface of described second cover layer 15 is side.First, laser cutting is carried out facing to laser rays by one of the first cover layer 14 of described first connecting sheet circuit board 10, wherein laser cuts from the surface of the first cover layer 14, and the direction of illumination of laser is perpendicular to the surface of described first cover layer 14, depth of cut is the half of the thickness of described first connecting sheet circuit board 10, and the 7th bonding pad 1047 on described first connecting sheet circuit board 10 forms the first section 105.
Then, overturn described first connecting sheet circuit board 10, the second cover layer 15 of described first connecting sheet circuit board 10 is made to carry out laser cutting towards laser rays, wherein laser cuts from the surface of the second cover layer 15, and the direction of illumination of laser is perpendicular to the surface of described second cover layer 15, depth of cut is also the half of the thickness of described first connecting sheet circuit board 10, and the 7th bonding pad 1047 on described first connecting sheet circuit board 10 forms the second section 106.Wherein, the first section 105 and the second section 106 mutually stagger on the bearing of trend of the 7th bonding pad 1047, and wherein the first section 105 is closer to described second circuit Slab element 102.
Further, overturn described first connecting sheet circuit board 10, make the side of described 7th bonding pad 1047 towards laser rays, laser cutting is carried out at middle part along described first insulating barrier 13, the 7th bonding pad 1047 on described first connecting sheet circuit board 10 forms the 3rd section 107, wherein, cut direction extends to described second section 106 one end in described first insulating barrier 13 from described first section 105 one end in described first insulating barrier 13, thus is disconnected described 7th bonding pad 1047.The section of the 7th bonding pad 1047 namely on described first connecting sheet circuit board 10 is stepped, is in turn connected to form by the first section 105, the 3rd section 107 and the second section 106.Then, according to described 4th to the 6th bonding pad 1044,4045,1046 of cutting method cutting of described 7th bonding pad 1047, described second circuit Slab element 102 is separated from each other with described first garbage area 103 and first circuit board unit 101.Finally, described second circuit Slab element 102 is removed.
Be appreciated that because above-mentioned cutting does not need very accurate, therefore other cutting means also can be used to carry out above-mentioned cutting, as milling cutter cutting etc.
4th step, refers to Fig. 6, identical with the method for the 3rd step, by laser cutting, is separated by described 4th circuit board unit 202 with described second connecting sheet circuit board 20.
Pass through laser cutting, described 4th circuit board unit 202 is separated with described second connecting sheet circuit board 20, wherein said 11 to the 14 bonding pad 2044, 2045, 2046, the off-position of 2047, the degree of depth and described 4th to the 7th bonding pad 1044, 1045, 1046, the off-position of 1047, degree of depth correspondence is identical, for the 14 bonding pad 2047 on described 4th circuit board unit 202, the section of described 14 bonding pad 2047 is stepped, by the 4th section 205, 5th section 206 and the 6th section 207 are in turn connected to form, because of described 11 to the 14 bonding pad 2044, 2045, 2046, the off-position of 2047, the degree of depth and described 4th to the 7th bonding pad 1044, 1045, 1046, the off-position of 1047, degree of depth correspondence is identical, therefore described 4th section 205, 5th section 206 and the 6th section 207 respectively with described first section 105, 3rd section 107 and the second section 106 match.
Be appreciated that, if described second connecting sheet circuit board 20 is incomplete same with described first connecting sheet circuit board 10, as long as but the second connecting sheet circuit board 20 has at least one circuit board unit identical with second circuit Slab element 102, then also can be separated according to the circuit board unit identical with second circuit Slab element 102 of the method for step 3 by the second connecting sheet circuit board 20.
5th step, sees also Fig. 5-7, is bonded on described first connecting sheet circuit board 10 by gluing mode by described 4th circuit board unit 202, forms the 3rd connecting sheet circuit board 30 of the full non-defective unit after transplanting.
First, by glue coating on the 6th section 207 of described 4th circuit board unit 202; Then, be placed in by described 4th circuit board unit 202 on described first connecting sheet circuit board 10, the merging that matched with the stepped section of the 4th to the 7th bonding pad 1044,1045,1046,1047 that described first connecting sheet circuit board 10 is connected respectively by described 11 to the 14 stepped section in bonding pad 2044,2045,2046,2047 that described 4th circuit board unit 202 connects is bonded together.For the 14 bonding pad 2047, described 4th section 205, the 5th section 206 and the 6th section 207 are affixed with the first section 105, second section 106 of described first connecting sheet circuit board 10 and the 3rd section 107 respectively, described 6th section 207 and the 3rd section 107 are bondd by glue, thus makes described 4th circuit board unit 202 be bonded on described first connecting sheet circuit board 10; Finally, solidify described glue, obtain the 3rd connecting sheet circuit board 30 comprising first circuit board unit 101 and the 4th circuit board unit 202, described first circuit board unit 101 and the 4th circuit board unit 202 are electrical measurement non-defective unit.Also namely, described 4th circuit board unit 202 has been transplanted to the position of the second circuit Slab element 102 in the first connecting sheet circuit board 10, forms the 3rd connecting sheet circuit board 30.
Be appreciated that, if tertiary circuit Slab element 201 is non-defective units, and described 4th circuit board unit 202 is defective productss, also tertiary circuit Slab element 201 can be transplanted to the position of described second circuit Slab element 102, if the section of the section of each bonding pad and off-position and each bonding pad removed in the first connecting sheet circuit board 10 after described second circuit Slab element 102 and off-position corresponding.
The depth of cut of the first section 105 also can be other degree of depth, be not limited to the middle part of described first insulating barrier, with facilitate be cut into suitable, and only need the depth of cut sum of the depth of cut of the first section 105 and the 3rd section 107 to equal the thickness of the first connecting sheet circuit board 10, namely described first section 105, second section 106 and the 3rd section 107 need described 7th bonding pad 1047 to be cut off.
In addition, described glue also can be coated on described 3rd section 107.Described glue also can change and do solid-state pressure-sensing glue etc.In addition, if described first connecting sheet circuit board 10 comprises the bad circuit board unit of plural electrical measurement, described second connecting sheet circuit board 20 only has an electrical measurement to be good circuit board unit, then can transplant the circuit board unit of several non-defective unit on described first connecting sheet circuit board 10 from other several connecting sheet circuit board again according to said method.
Be understandable that, for the person of ordinary skill of the art, other various corresponding change and distortion can be made by technical conceive according to the present invention, and all these change the protection range that all should belong to the claims in the present invention with distortion.
Claims (8)
1. a manufacture method for connecting sheet circuit board, it comprises the following steps:
First connecting sheet circuit board is provided, described first connecting sheet circuit board comprises multiple circuit board unit, and one is surrounded described multiple circuit board unit and the first garbage area be connected with described multiple circuit board unit, described multiple circuit board unit comprises at least one first circuit board unit, and at least one first circuit board unit described is electrical measurement defective products;
Second connecting sheet circuit board is provided, described second connecting sheet circuit board comprises multiple circuit board unit, and one is surrounded described multiple circuit board unit and the second garbage area be connected with described multiple circuit board unit, in described multiple circuit board unit, at least one is electrical measurement defective products, described multiple second connecting sheet circuit board unit comprises at least one second circuit Slab element, at least one second circuit Slab element described is electrical measurement non-defective unit, and at least one second circuit Slab element described is identical with at least one first circuit board unit described;
The position that at least one first circuit board unit described is connected with described first garbage area is cut off, described first connecting sheet circuit board forms stair-stepping first section, and remove at least one first circuit board unit described;
The position that at least one second circuit Slab element described is connected with described second garbage area is cut off, at least one second circuit Slab element described forms stair-stepping second section, at least second circuit Slab element described in separation, wherein, described second section and described first section match; And
Being coordinated by described second section is bonded on described first section, thus at least one second circuit Slab element described in separation is bonded on described first connecting sheet circuit board after removing at least one first circuit board unit described, form the 3rd connecting sheet circuit board.
2. the manufacture method of connecting sheet circuit board as claimed in claim 1, it is characterized in that, at least one first circuit board unit described on described first connecting sheet circuit board is connected with other circuit board units on described first garbage area and described first connecting sheet circuit board by multiple first micro-force sensing district, and at least one the second circuit Slab element described on described second connecting sheet circuit board is connected with other circuit board units on described second garbage area and described second connecting sheet circuit board by multiple second micro-force sensing district.
3. the manufacture method of connecting sheet circuit board as claimed in claim 2, it is characterized in that, described multiple first micro-force sensing district and described multiple second micro-force sensing district are strip.
4. the manufacture method of connecting sheet circuit board as claimed in claim 2, it is characterized in that, the step cutting off the position that at least one first circuit board unit described is connected with described first garbage area comprises: described first micro-force sensing district has two surfaces, distance between two surfaces is H1, from a surface in described first micro-force sensing district, described first micro-force sensing district is cut out first otch, described first notch depth is H2; From another relative surface in described first micro-force sensing district, the position staggered in described first micro-force sensing district and the first otch is cut out second otch, described second notch depth is H3, wherein H2+H3=H1; Horizontal resection three cuts between the bottom of described first otch and the bottom of described second otch, described first otch, the second otch and three cuts are connected, thus at least one first circuit board unit described is separated with described first connecting sheet circuit board.
5. the manufacture method of connecting sheet circuit board as claimed in claim 2, it is characterized in that, the step cutting off the position that at least one second circuit Slab element described is connected with described second garbage area comprises: described second micro-force sensing district has two surfaces, distance between two surfaces is H4, from a surface in described second micro-force sensing district, described second micro-force sensing district is cut out the 4th otch, described 4th notch depth is H5; From another surface in described second micro-force sensing district, the position staggered in described second micro-force sensing district and the 4th otch is cut out the 5th otch, described 5th notch depth is H6, wherein H5+H6=H4; Horizontal resection the 6th otch between the bottom of described 4th otch and the bottom of described 5th otch, described 4th otch, the 5th otch and the 6th otch are connected and are separated with described second connecting sheet circuit board by least one second circuit Slab element described.
6. the manufacture method of the connecting sheet circuit board as described in claim 4 or 5, is characterized in that, the mode of described cutting is laser cutting.
7. the manufacture method of connecting sheet circuit board as claimed in claim 1, it is characterized in that, described second section is bonding by glue with the bonding way of described first section.
8. the manufacture method of connecting sheet circuit board as claimed in claim 1, it is characterized in that, described second section is bonding by solid-state pressure-sensing glue with the bonding way of described first section.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110334008.8A CN103096641B (en) | 2011-10-28 | 2011-10-28 | The manufacture method of connecting sheet circuit board |
| TW100140062A TW201318490A (en) | 2011-10-28 | 2011-11-03 | Method for making printed circuit board assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110334008.8A CN103096641B (en) | 2011-10-28 | 2011-10-28 | The manufacture method of connecting sheet circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103096641A CN103096641A (en) | 2013-05-08 |
| CN103096641B true CN103096641B (en) | 2015-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110334008.8A Active CN103096641B (en) | 2011-10-28 | 2011-10-28 | The manufacture method of connecting sheet circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN103096641B (en) |
| TW (1) | TW201318490A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107529277B (en) * | 2016-06-21 | 2020-03-06 | 北大方正集团有限公司 | Circuit board forming method |
| DE102017221543A1 (en) * | 2017-11-30 | 2019-06-06 | Robert Bosch Gmbh | PCB panels |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431863A (en) * | 2007-11-05 | 2009-05-13 | 富葵精密组件(深圳)有限公司 | Back glue attaching method for flexible printed circuit board |
| CN101547574A (en) * | 2008-03-28 | 2009-09-30 | 富葵精密组件(深圳)有限公司 | Base plate of a circuit board and a preparing method of a circuit board with a misalignment structure |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
-
2011
- 2011-10-28 CN CN201110334008.8A patent/CN103096641B/en active Active
- 2011-11-03 TW TW100140062A patent/TW201318490A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101431863A (en) * | 2007-11-05 | 2009-05-13 | 富葵精密组件(深圳)有限公司 | Back glue attaching method for flexible printed circuit board |
| CN101547574A (en) * | 2008-03-28 | 2009-09-30 | 富葵精密组件(深圳)有限公司 | Base plate of a circuit board and a preparing method of a circuit board with a misalignment structure |
| CN101695217A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing printed board combining rigidness and flexibleness |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201318490A (en) | 2013-05-01 |
| CN103096641A (en) | 2013-05-08 |
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Effective date of registration: 20170303 Address after: 518103 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Shenzhen Baoan District city Songgang street Chuanyan Luzhen Yan Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |