CN202336607U - Special two-side polymerized pad plate for hole drilling of printed circuit board - Google Patents
Special two-side polymerized pad plate for hole drilling of printed circuit board Download PDFInfo
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- CN202336607U CN202336607U CN2011204868585U CN201120486858U CN202336607U CN 202336607 U CN202336607 U CN 202336607U CN 2011204868585 U CN2011204868585 U CN 2011204868585U CN 201120486858 U CN201120486858 U CN 201120486858U CN 202336607 U CN202336607 U CN 202336607U
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Abstract
The utility model discloses a special two-side polymerized pad plate for the hole drilling of a printed circuit board. The special two-side polymerized pad plate comprises a base layer, wherein adhesive layers are respectively coated on the front side and the back side of the base layer, surface layers are arranged on the adhesive layers, the coating thickness of the adhesive layers is 80 to 100mum, the thickness of the surface layers is 100 to 150mum, the base layer is a wood fiber board, the adhesive layers are formed by carrying out photocuring on epoxy polyester, the surface layer is formed by combining resin with superfine powder, and the proportion relationship of the resin to the superfine powder is (2:8)-(4:6). The special two-side polymerized pad plate for the hole drilling of the printed circuit board disclosed by the utility model has the advantages that the hole drilling is convenient, and the precision of drilled holes is high.
Description
Technical field
The utility model belongs to the printed circuit board field, concrete a kind of printed circuit board special-purpose two-sided polymerization backing plate of holing that relates to.
Background technology
Backing plate to the practicality of the flow process of printed circuit board boring at present mainly is divided into three major types: 1: middle height density fiber board: it is mainly used in the backing plate that boring aperture is the wiring board more than 0.3; 2: two-sided three cyanogen polyamine high density fiberboards: it is mainly used in the backing plate that boring aperture is the interval wiring board of 0.2-0.5; 3: phenolic board: being mainly used in boring aperture is the backing plate of the interval wiring board of 0.25-0.1, and this plate is mainly used in the flexible PCB drilling liner plate.
One, the main purpose of drilling liner plate:
1, prevents that drill point from getting into table top and causing broken needle;
2, prevent that bottom boring plate hole is protruding;
3, prevent that perforated plate from producing peak and burr;
4, reduce the broken needle rate;
5, improve drilling accuracy.
Two, the main technical requirements of drilling liner plate:
1, case hardness requires high and is evenly distributed;
2, flatness requires high;
3, heat dispersion requires and will get well;
4, meet the environmental protection related request, require to reach the E1 grade standard.
The key technical indexes contrast of the drilling liner plate that three, uses at present:
Developing rapidly of science and technology also promotes very highly to the requirement of circuit board, boring aperture is more and more thinner; The rotating speed of drill point is increasingly high, has reached 35KPRM at present, therefore; The flying chip that produces during boring is many, and is big to the impulsive force of hole wall, and the heat that drill point produces is big; Require the hole circle degree high simultaneously, the CPK value in hole requires high.Market competition simultaneously, the cost of raw material rises, and causes manufacturer can only control cost from the side (for example artificial, the consumptive material aspect).Drilling liner plate is as one of consumptive material, and the control of cost can only be started with from the new product new technology.
The utility model content
For overcoming deficiency of the prior art, the purpose of the utility model is to provide a kind of boring convenient, and the high printed circuit board of hole precision that the bores special-purpose two-sided polymerization backing plate of holing.
Another purpose of the utility model is to provide a kind of printed circuit board preparation method of special-purpose two-sided polymerization backing plate that holes.
In order to solve the problems of the technologies described above, realize above-mentioned purpose, the utility model has been taked following technical scheme:
A kind of printed circuit board special-purpose two-sided polymerization backing plate of holing, it comprises a basic unit, and the positive and negative of said basic unit respectively is coated with an adhesive layer, and described adhesive layer is provided with a top layer.
Further, the coating thickness of said adhesive layer is 80-100 μ m.
Further, the thickness on said top layer is 100-150 μ m.
Further, said basic unit is a wood-fiber board.
Further, said adhesive layer is that epoxy polyester forms through photocuring.
Further, said top layer is that resin and ultra micro powder combine.
Further, the proportionate relationship of said resin and said ultra micro powder is 2: 8-4: 6.
Compared with prior art, the utility model has a following beneficial effect:
1, the wood-fiber board of basic unit's employing middle-high density is as carrier.Slow down side force and frictional force when drill point gets into this layer, reduce the resistance of the withdraw of the needle, improve the service life of drill point syringe needle;
2, adhesive layer mainly adopts epoxy polyester environment-friendly type macromolecule organic material; Behind the special formulation photocuring, reduce the flexibility of adhesive, main feature shows as fragility, helps the chip removal ability of drill point; Simultaneously wetting wood-fiber board surface; Effectively improve the case hardness of wood-fiber board, reduce surface tension, provide top layer and wood-fiber board to bind function;
3, the top layer mainly utilizes the high rigidity of ultra micro powder and the characteristic of high surface; Evenly be applied to (roller coating or showering) adhesive top layer through photocuring with a small amount of environment-friendly type macromolecule material through high-speed stirred; The generation density and high hardness is high; Good heat conductivity, the coating that fragility is good, and coating layer thickness is the 100-150 micron.This layer helps the borehole accuracy of drill point, guarantees the chip removal of drill point, improves the heat-sinking capability of drill point.
Coated on both sides finishes the back and adopts the moment HTHP, guarantees the bonding of each level, increases density of product and case hardness uniformity, utilizes the effect of mirror steel plate simultaneously, makes integral surface have the very high flatness and the depth of parallelism.This process helps drilling accuracy, prevents that the out-of-flatness on surface from causing that the hole is protruding, burr, and the defective of peak reduces the broken needle rate of drill point simultaneously.
Above-mentioned explanation only is the general introduction of the utility model technical scheme, in order more to know the technological means of understanding the utility model, and can implement according to the content of specification, below with the preferred embodiment of the utility model and conjunction with figs. specify as after.The specific embodiment of the utility model is provided by following examples and accompanying drawing thereof in detail.
Description of drawings
Accompanying drawing described herein is used to provide the further understanding to the utility model, constitutes the application's a part, and illustrative examples of the utility model and explanation thereof are used to explain the utility model, do not constitute the improper qualification to the utility model.In the accompanying drawings:
Fig. 1 is the structural representation of the utility model.
Fig. 2 is the pressing process sketch map of the method for the utility model.
The specific embodiment
Referring to shown in Figure 1, a kind of printed circuit board special-purpose two-sided polymerization backing plate of holing, it comprises a basic unit 1, and the positive and negative of said basic unit 1 respectively is coated with an adhesive layer 2, and described adhesive layer 2 is provided with a top layer 3.
Further, the coating thickness of said adhesive layer 2 is 80-100 μ m.
Further, the thickness on said top layer 3 is 100-150 μ m.
Further, said basic unit 1 is a wood-fiber board.
Further, said adhesive layer 2 forms through photocuring for epoxy polyester.
Further, said top layer 3 combines for resin and ultra micro powder.
Further, the proportionate relationship of said resin and said ultra micro powder is 2: 8-4: 6.
Referring to shown in Figure 2, the hole preparation method of special-purpose two-sided polymerization backing plate of a kind of printed circuit board, it may further comprise the steps:
Step 1) is got the wood-fiber board of a pair of facing sand light as basic unit 1;
Step 2) gets epoxy polyester and stick positive and negative surface, form two-layer adhesive layer 2 in said basic unit 1 through photocuring;
Step 3) adopts the method for coating to be overlying on the said adhesive layer mixture process high speed centrifugation mixing and stirring of resin and ultra micro powder, passes through photocuring effect film-forming again, forms two-layer top layer 3;
Step 4) is 170 ℃ ± 30 ℃ in temperature, and pressure is 1.5-2.8MPa, and pressing time is to carry out two-sided one step press through mirror steel plate 4 under the technological parameter of 10-12s.
Further, the coating thickness of said adhesive layer 2 is 80-100 μ m.
Further, the thickness on said top layer 3 is 100-150 μ m.
The utlity model has the composite construction on inorganic layer surface; Except that the preceding said method of mentioning can be accomplished the structure structure of this plate; This method does not limit and only is unique method according to this; So long as can reach the category that the same structure of surface smoothness and hardness all belongs to the utility model structure, for example with the heat cure moulding, adhesive layer or hard layer adopt heat cure more in addition pressing be the one of which example.
The preferred embodiment that the above is merely the utility model is not limited to the utility model, and for a person skilled in the art, the utility model can have various changes and variation.All within the spirit and principle of the utility model, any modification of being done, be equal to replacement, improvement etc., all should be included within the protection domain of the utility model.
Claims (3)
1. a printed circuit board special-purpose two-sided polymerization backing plate of holing, it is characterized in that: comprise a basic unit (1), the positive and negative of said basic unit (1) respectively is coated with an adhesive layer (2), and described adhesive layer (2) is provided with a top layer (3).
2. the printed circuit board according to claim 1 special-purpose two-sided polymerization backing plate of holing, it is characterized in that: the coating thickness of said adhesive layer (2) is 80-100 μ m.
3. the printed circuit board according to claim 1 special-purpose two-sided polymerization backing plate of holing, it is characterized in that: the thickness of said top layer (3) is 100-150 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204868585U CN202336607U (en) | 2011-11-30 | 2011-11-30 | Special two-side polymerized pad plate for hole drilling of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204868585U CN202336607U (en) | 2011-11-30 | 2011-11-30 | Special two-side polymerized pad plate for hole drilling of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202336607U true CN202336607U (en) | 2012-07-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204868585U Expired - Fee Related CN202336607U (en) | 2011-11-30 | 2011-11-30 | Special two-side polymerized pad plate for hole drilling of printed circuit board |
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| CN (1) | CN202336607U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104175658A (en) * | 2014-08-22 | 2014-12-03 | 烟台柳鑫新材料科技有限公司 | Base plate for printed circuit board drilling and preparation method for base plate |
| CN105505135A (en) * | 2015-12-24 | 2016-04-20 | 深圳市柳鑫实业股份有限公司 | Backing plate for drilling of PCB (printed circuit board) and preparation method of backing plate |
| CN106735442A (en) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | The method of the drilling quick withdraw of the needle of cartridge-type dials |
| CN114536932A (en) * | 2022-02-18 | 2022-05-27 | 深圳市宏宇辉科技有限公司 | PCB (printed circuit board) base plate with hardened layer and preparation method and application thereof |
-
2011
- 2011-11-30 CN CN2011204868585U patent/CN202336607U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104175658A (en) * | 2014-08-22 | 2014-12-03 | 烟台柳鑫新材料科技有限公司 | Base plate for printed circuit board drilling and preparation method for base plate |
| CN104175658B (en) * | 2014-08-22 | 2016-03-23 | 烟台柳鑫新材料科技有限公司 | A kind of printed circuit board drilling backing plate and preparation method thereof |
| US9572262B2 (en) | 2014-08-22 | 2017-02-14 | Shenzhen Newccess Industrial Co., Ltd | Printed circuit board backup plate and the preparation method thereof |
| CN105505135A (en) * | 2015-12-24 | 2016-04-20 | 深圳市柳鑫实业股份有限公司 | Backing plate for drilling of PCB (printed circuit board) and preparation method of backing plate |
| CN106735442A (en) * | 2016-12-23 | 2017-05-31 | 奥士康科技股份有限公司 | The method of the drilling quick withdraw of the needle of cartridge-type dials |
| CN114536932A (en) * | 2022-02-18 | 2022-05-27 | 深圳市宏宇辉科技有限公司 | PCB (printed circuit board) base plate with hardened layer and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Suzhou TOP Ele&Tec CO.,Ltd. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120718 Termination date: 20131130 |