CN2733823Y - A base plate for drilling printed circuit board - Google Patents
A base plate for drilling printed circuit board Download PDFInfo
- Publication number
- CN2733823Y CN2733823Y CN 200420048752 CN200420048752U CN2733823Y CN 2733823 Y CN2733823 Y CN 2733823Y CN 200420048752 CN200420048752 CN 200420048752 CN 200420048752 U CN200420048752 U CN 200420048752U CN 2733823 Y CN2733823 Y CN 2733823Y
- Authority
- CN
- China
- Prior art keywords
- gummed paper
- printed circuit
- circuit board
- dipping
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The utility model relates to a base plate for drilling printed circuit board, comprising a dipping gummed paper 2, a basal plate 3, a dipping gummed paper 4. The dipping gummed paper 2 is arranged on the basal plate 3, and the dipping gummed paper 4 is arranged below the basal plate which is compositely formed after the heat pressing. The utility model has the advantages of proper hardness, good planeness and elasticity, lower cost, un-easy abrasion of the drill head, no putty spot or sentus in the drilled hole, no warpage or deformation for long term storing, low producing cost, and wide popularization value.
Description
The utility model belongs to hot-forming composite board, the boring bottom backing plate of a kind of printed circuit board.
When printed circuit board is holed, in order to protect drilling platform and to guarantee drilling quality, the essential bottom backing plate that uses.At present, most of producers adopt phenolic board or epoxy resin bonded fiber as the bottom backing plate, and the shortcoming that adopts these two kinds of sheet materials to make the bottom backing plate is that the greasy dirt of epoxy is many in hardness height, poor flexibility, the hole, burr is many, drill bit is easy to wear and useful life short.For a long time, the effective way that always overcomes the above problems of people in exploration.
The purpose of this utility model is, in order to overcome the shortcoming that traditional bottom backing plate exists, designed therefore that hardness is suitable, do not had the boring bottom backing plate of a kind of printed circuit board of be bored with dirt and burr in evenness and good springiness, drill bit not easy to wear, long service life, the hole.
The utility model is realized as follows:
The boring bottom backing plate of a kind of printed circuit board, bottom backing plate 1 are to be composited by dipping gummed paper 2, substrate 3 and dipping gummed paper 4, are provided with dipping gummed paper 2 on substrate 3, are provided with dipping gummed paper 4 below it.
The utility model has the advantages that: hardness is suitable, evenness and good springiness, does not have the dirt of being bored with and burr in drill bit not easy to wear, the useful life of having improved drill bit, the hole that gets out.
Description of drawings:
Fig. 1 is a front view of the present utility model;
Fig. 2 is a plan structure schematic diagram of the present utility model.
Introduce embodiment of the present utility model with reference to the accompanying drawings:
The boring bottom backing plate of a kind of printed circuit board, the upper and lower surface at substrate 3 during enforcement is provided with dipping gummed paper 2 and dipping gummed paper 4 respectively, through the hot pressing composite molding.Substrate is to adopt vegetable fibre board, preferably adopt medium density fibre board (MDF), substrate 3 will carry out sand milling before Compound Machining, and is even to guarantee monolith substrate thickness, size is on request cut then, will flood to organize plate after gummed paper is cut by the size of substrate again.The program of group plate is to place dipping gummed paper 4 on the metal supporting plate earlier, dipping gummed paper 4 has facing down of remover, accordingly substrate 3 is placed on then on the dipping gummed paper 4, to flood again gummed paper 2 have remover towards on be placed on the substrate 3, put backplate above the gummed paper 2 or put an amount of money supporting plate again at dipping and organize one group of plate separately to carry out many plates compound.The plate that group is good is sent into and is carried out hot forming in the hot press.The utility model plate face is smooth, good springiness, do not peel off, long-term storage warpage, indeformable not, low production cost has promotional value widely.
Claims (1)
1, the boring bottom backing plate of a kind of printed circuit board, bottom backing plate (1) is to be composited by dipping gummed paper (2), substrate (3) and dipping gummed paper (4), it is characterized in that on substrate (3), being provided with dipping gummed paper (2), be provided with dipping gummed paper (4) below it.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420048752 CN2733823Y (en) | 2004-04-05 | 2004-04-05 | A base plate for drilling printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200420048752 CN2733823Y (en) | 2004-04-05 | 2004-04-05 | A base plate for drilling printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2733823Y true CN2733823Y (en) | 2005-10-12 |
Family
ID=35069658
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200420048752 Expired - Fee Related CN2733823Y (en) | 2004-04-05 | 2004-04-05 | A base plate for drilling printed circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2733823Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101951734A (en) * | 2010-09-30 | 2011-01-19 | 深圳市大族激光科技股份有限公司 | Method for processing micro through hole of flexible circuit board |
CN102248202A (en) * | 2011-04-27 | 2011-11-23 | 金安国纪科技股份有限公司 | Cover board or backing board for drilling printed circuit board, and processing method thereof |
CN101795534B (en) * | 2010-01-19 | 2012-04-25 | 苏州思诺林电子有限公司 | Drilling liner plate of circuit board |
CN108127150A (en) * | 2017-11-30 | 2018-06-08 | 广州兴森快捷电路科技有限公司 | The thin size plate processing method of light and small |
-
2004
- 2004-04-05 CN CN 200420048752 patent/CN2733823Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101795534B (en) * | 2010-01-19 | 2012-04-25 | 苏州思诺林电子有限公司 | Drilling liner plate of circuit board |
CN101951734A (en) * | 2010-09-30 | 2011-01-19 | 深圳市大族激光科技股份有限公司 | Method for processing micro through hole of flexible circuit board |
CN101951734B (en) * | 2010-09-30 | 2013-04-17 | 深圳市大族激光科技股份有限公司 | Method for processing micro through hole of flexible circuit board |
CN102248202A (en) * | 2011-04-27 | 2011-11-23 | 金安国纪科技股份有限公司 | Cover board or backing board for drilling printed circuit board, and processing method thereof |
CN108127150A (en) * | 2017-11-30 | 2018-06-08 | 广州兴森快捷电路科技有限公司 | The thin size plate processing method of light and small |
CN108127150B (en) * | 2017-11-30 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | Light and small thin size plate processing method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |