CN202308030U - 多层式阵列型发光二极管光引擎的结构改良 - Google Patents
多层式阵列型发光二极管光引擎的结构改良 Download PDFInfo
- Publication number
- CN202308030U CN202308030U CN2011203081318U CN201120308131U CN202308030U CN 202308030 U CN202308030 U CN 202308030U CN 2011203081318 U CN2011203081318 U CN 2011203081318U CN 201120308131 U CN201120308131 U CN 201120308131U CN 202308030 U CN202308030 U CN 202308030U
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- led light
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- structural improvement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
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Claims (38)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011203081318U CN202308030U (zh) | 2011-08-23 | 2011-08-23 | 多层式阵列型发光二极管光引擎的结构改良 |
Applications Claiming Priority (1)
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CN2011203081318U CN202308030U (zh) | 2011-08-23 | 2011-08-23 | 多层式阵列型发光二极管光引擎的结构改良 |
Publications (1)
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CN202308030U true CN202308030U (zh) | 2012-07-04 |
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CN2011203081318U Expired - Fee Related CN202308030U (zh) | 2011-08-23 | 2011-08-23 | 多层式阵列型发光二极管光引擎的结构改良 |
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CN (1) | CN202308030U (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107002986A (zh) * | 2014-12-19 | 2017-08-01 | 通用电气照明解决方案有限责任公司 | 具有减少的湿气进入的光模块组件及其制造方法 |
CN107565003A (zh) * | 2017-07-31 | 2018-01-09 | 深圳市华星光电技术有限公司 | 量子点led封装结构 |
CN108011024A (zh) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led灯及led封装工艺 |
CN108011016A (zh) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | 一种led封装结构 |
CN109003953A (zh) * | 2018-08-08 | 2018-12-14 | 中山大学 | 一种散热片 |
TWI708908B (zh) * | 2019-06-10 | 2020-11-01 | 聯嘉光電股份有限公司 | 纖細線型led發光裝置 |
-
2011
- 2011-08-23 CN CN2011203081318U patent/CN202308030U/zh not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107002986A (zh) * | 2014-12-19 | 2017-08-01 | 通用电气照明解决方案有限责任公司 | 具有减少的湿气进入的光模块组件及其制造方法 |
CN107565003A (zh) * | 2017-07-31 | 2018-01-09 | 深圳市华星光电技术有限公司 | 量子点led封装结构 |
CN107565003B (zh) * | 2017-07-31 | 2019-04-30 | 深圳市华星光电技术有限公司 | 量子点led封装结构 |
CN108011024A (zh) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | Led灯及led封装工艺 |
CN108011016A (zh) * | 2017-11-28 | 2018-05-08 | 西安科锐盛创新科技有限公司 | 一种led封装结构 |
CN109003953A (zh) * | 2018-08-08 | 2018-12-14 | 中山大学 | 一种散热片 |
TWI708908B (zh) * | 2019-06-10 | 2020-11-01 | 聯嘉光電股份有限公司 | 纖細線型led發光裝置 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YINGSHENG PHOTOELECTRIC TECHNOLOGY (SHANGHAI) CO., Free format text: FORMER OWNER: YINGSHENG TECHNOLOGY CO.,LTD. Effective date: 20141223 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 200438 YANGPU, SHANGHAI |
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TR01 | Transfer of patent right |
Effective date of registration: 20141223 Address after: 200438 Shanghai city Yangpu District Hengren Road No. 350 Building 1 room 110-4 Patentee after: Ying Guang photoelectric technology (Shanghai) Co., Ltd. Address before: Hsinchu County, Taiwan, China Patentee before: Ying Sheng Technology Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20180823 |