CN202202003U - Copper ball adding device for electroplating - Google Patents
Copper ball adding device for electroplating Download PDFInfo
- Publication number
- CN202202003U CN202202003U CN2011203031338U CN201120303133U CN202202003U CN 202202003 U CN202202003 U CN 202202003U CN 2011203031338 U CN2011203031338 U CN 2011203031338U CN 201120303133 U CN201120303133 U CN 201120303133U CN 202202003 U CN202202003 U CN 202202003U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- copper ball
- titanium basket
- cylinder
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model relates to a copper ball adding device for electroplating, which comprises an adding box. The adding box is arranged on an electroplating cylinder, a plurality of round holes are formed on the bottom face of the adding box, the diameter of the round holes is not larger than the inner diameter of a titanium basket on the electroplating cylinder and is not smaller than the diameter of copper balls, guide pipes are fixed below the round holes and can be inserted into the titanium basket, the length of the adding box is consistent with the length of the electroplating cylinder, the width of the adding box is twice the external diameter of the titanium basket, the height of the adding box is 10 centimeters, the round holes are arranged according to the arrangement of the titanium basket in the electroplating cylinder, the adding box and the guide pipes are made of a polyvinyl chloride (PVC) material, and the length of the guide pipes is five centimeters. With the adoption of the copper ball adding device for electroplating disclosed by the scheme of the utility mode, the copper balls can be added under the condition of no-stop running of electroplating equipment, the time spent on copper ball adding can be effectively shortened, the workload of workers is reduced, and potential safety hazard is prevented.
Description
Technical field
When the utility model relates to a kind of plating wiring board, be used for adding the device of copper ball, belong to wiring board production utility appliance technical field.
Background technology
In the electro-coppering process that wiring board is produced, because the continuous loss of copper need constantly be carried out copper ball and add.At present, all be that manual work is moved copper ball on the plating line to after waiting electroplating device out of service, in the titanium basket of electroplating dress copper ball on the cylinder, add copper ball by hand.Along with the increasing demand of market to wiring board increases, a lot of manufacturers in order to enhance productivity, to use large-scale electroplating device instead wiring board are carried out electro-coppering on production line.Though can improve certain production efficiency, the plating cylinder on the large-scale electroplating device is many, and the titanium basket is also many; Each copper ball that adds all need once add several tons copper ball, and personnel's workload is big; It is long to add the required time of copper ball, and in the interpolation process, also has potential safety hazard.
The utility model content
The utility model purpose is to provide a kind of can under the situation of electroplating device out of service not, add copper ball for the deficiency that overcomes prior art; And can effectively reduce the time of adding copper ball; Alleviate personnel's workload, the plating of stopping potential safety hazard is with adding the copper ball device.
For achieving the above object, the technical scheme that the utility model adopts is: a kind of plating with the device that adds copper ball comprises being placed on the interpolation box of electroplating on the cylinder; On the bottom surface of said interpolation box, have several circular holes; The diameter of said circular hole is not more than the internal diameter of electroplating titanium basket on the cylinder, and the diameter of circular hole is not less than the diameter of copper ball; The below of said circular hole is fixed with guide pipe; Said guide pipe can insert in the titanium basket.
Preferably, the length of said interpolation box is consistent with the length of electroplating cylinder, and width is the twice of titanium basket external diameter, highly is 10 centimetres.
Preferably, said circular hole is according to the setting of arranging of electroplating titanium basket in the cylinder.
Preferably, said interpolation box and guide pipe adopt the PVC material to process.
Preferably, the length of said guide pipe is 5 centimetres.
Because the utilization of technique scheme, the utility model compared with prior art has advantage:
The utility model scheme a kind of electroplates with the device that adds copper ball, owing to be provided with the interpolation box, can under the situation of electroplating device out of service not, add copper ball; And directly copper ball is poured into and added in the box, copper ball will drop in the titanium basket along guide pipe, can effectively reduce the time of adding copper ball, alleviates personnel's workload, stops potential safety hazard.
Description of drawings
Below in conjunction with accompanying drawing the utility model technical scheme is described further:
Accompanying drawing 1 is the stereographic map of the plating of the utility model with interpolation copper ball device;
Accompanying drawing 2 is the stereographic map of the plating of the utility model with another angle of interpolation copper ball device;
Wherein: 1, add box; 2, circular hole; 3, guide pipe.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is done further to specify.
Because the utilization of technique scheme, the utility model compared with prior art has advantage:
The utility model scheme a kind of electroplates with the device that adds copper ball, owing to be provided with the interpolation box, can under the situation of electroplating device out of service not, add copper ball; And directly copper ball is poured into and added in the box, copper ball will drop in the titanium basket along guide pipe, can effectively reduce the time of adding copper ball, alleviates personnel's workload, stops potential safety hazard.The interpolation copper ball device of the utility model scheme, simple in structure, cost of manufacture is lower, can effectively enhance productivity.
Below only be the concrete exemplary applications of the utility model, the protection domain of the utility model is not constituted any limitation.All employing equivalents or equivalence are replaced and the technical scheme of formation, or any to move mode dull and stereotyped described in the utility model, all drop within the utility model rights protection scope.
Claims (5)
1. electroplate with the device that adds copper ball for one kind, it is characterized in that: comprise being placed on the interpolation box of electroplating on the cylinder; On the bottom surface of said interpolation box, have several circular holes; The diameter of said circular hole is not more than the internal diameter of electroplating titanium basket on the cylinder, and the diameter of circular hole is not less than the diameter of copper ball; The below of said circular hole is fixed with guide pipe; Said guide pipe can insert in the titanium basket.
2. plating according to claim 1 is characterized in that with the device that adds copper ball: the length of said interpolation box is consistent with the length of electroplating cylinder, and width is the twice of titanium basket external diameter, highly is 10 centimetres.
3. plating according to claim 2 is characterized in that with the device that adds copper ball: said circular hole is according to the setting of arranging of electroplating titanium basket in the cylinder.
4. use the device that adds copper ball according to claim 1,2 or 3 described plating, it is characterized in that: said interpolation box and guide pipe adopt the PVC material to process.
5. plating according to claim 4 is with the device that adds copper ball, and it is characterized in that: the length of said guide pipe is 5 centimetres.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203031338U CN202202003U (en) | 2011-08-19 | 2011-08-19 | Copper ball adding device for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203031338U CN202202003U (en) | 2011-08-19 | 2011-08-19 | Copper ball adding device for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202202003U true CN202202003U (en) | 2012-04-25 |
Family
ID=45966135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203031338U Expired - Lifetime CN202202003U (en) | 2011-08-19 | 2011-08-19 | Copper ball adding device for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202202003U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102953111A (en) * | 2011-08-19 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Copper ball addition device used in electroplating |
| CN109518263A (en) * | 2018-11-30 | 2019-03-26 | 广东骏亚电子科技股份有限公司 | Anode copper ball added automatically system and method |
-
2011
- 2011-08-19 CN CN2011203031338U patent/CN202202003U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102953111A (en) * | 2011-08-19 | 2013-03-06 | 悦虎电路(苏州)有限公司 | Copper ball addition device used in electroplating |
| CN109518263A (en) * | 2018-11-30 | 2019-03-26 | 广东骏亚电子科技股份有限公司 | Anode copper ball added automatically system and method |
| CN109518263B (en) * | 2018-11-30 | 2020-08-18 | 广东骏亚电子科技股份有限公司 | Automatic anode copper ball adding system and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120425 |