CN202465929U - Rapid copper ball and tin ball adding device for PCB (printed circuit board) electroplating - Google Patents
Rapid copper ball and tin ball adding device for PCB (printed circuit board) electroplating Download PDFInfo
- Publication number
- CN202465929U CN202465929U CN2012200043376U CN201220004337U CN202465929U CN 202465929 U CN202465929 U CN 202465929U CN 2012200043376 U CN2012200043376 U CN 2012200043376U CN 201220004337 U CN201220004337 U CN 201220004337U CN 202465929 U CN202465929 U CN 202465929U
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- Prior art keywords
- ball
- pcb
- interpolation
- tin
- groove
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- Expired - Lifetime
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Abstract
The utility model relates to a rapid copper ball and tin ball adding device for PCB (printed circuit board) electroplating. The rapid copper ball and tin ball adding device comprises an adding groove, adding holes are arranged at the bottom of the adding groove, and anode-connected conduits are led out below the adding holes. By the aid of the rapid copper ball and tin ball adding device for the PCB electroplating, copper balls and tin balls can be filled into the adding groove and added via the adding holes and the anode-connected conduits, so that rapid adding of the copper balls and the tin balls can be guaranteed, materials can be prevented from falling into a chemical liquid tank to generate copper powder to stick on surfaces of PCBs to cause short circuit and production quality and efficiency are improved.
Description
Technical field
The utility model relates to the processing units of pcb board, a kind of pcb board electroplating process copper ball and quick device that adds of tin ball of being used for of saying so exactly.
Background technology
In the PCB electroplating process, need to add copper ball and tin ball, the present method that adopts is that the people stands on the anode and in plating tank, adds copper ball and tin ball.This way needs MC.
Artificial method of adding copper ball and tin ball causes the difficulty that adds materials, and inefficiency can make material fall into to produce in the cylinder copper powder to adhere to and cause the line short circuit phenomenon on the plate face, can cause the coarse condemnation factor rising of pcb board face; And, the as easy as rolling off a log dislocation of production middle-jiao yang, function of the spleen and stomach to electric current branch inhomogeneous with maintenance difficulty, the people does not have local station. exist to drop to because of carelessness in the liquid medicine cylinder and produce potential safety hazard, also exist liquid medicine to corrode the problem of skin simultaneously, jeopardize workman's personnel safety.
Summary of the invention
For this reason, the purpose of the utility model provides a kind of PCB and electroplates copper ball and the quick adding set of tin ball, and this device can add fast electroplates copper ball and tin ball, saves time, and increases productivity effect, has guaranteed the generation quality.
Another purpose of the utility model provides a kind of PCB and electroplates copper ball and the quick adding set of tin ball; This device can stable anode shift position not; Improve and avoid it that operator is produced injury and unrestrained refuse material, avoid potential safety hazard, increased the security of operation.
For this reason, the utility model is realized according to following mode.
A kind of PCB electroplates copper ball and the quick adding set of tin ball; It is characterized in that this device includes the interpolation groove; Described interpolation trench bottom has the interpolation mouth, and the below of adding mouth leads to connects the anode conduit, can copper ball and tin ball be encased in the interpolation groove through this device; Add with connection anode conduit through adding mouth then; Can guarantee like this to add copper ball and tin ball fast, avoid material to fall into producing in the liquid medicine cylinder copper powder to adhere to and cause the line short circuit phenomenon on the plate face, improve and generate quality and formation efficiency.
Said interpolation groove, the interpolation groove is a square structure, has backplate around it, the bottom has base plate, and a plurality of interpolations mouths are set on the base plate; And this interpolation groove adopts PP glue to make cell body, to be used for adorning copper ball and tin ball.When adding operation, can utilize machinery to add automatically, also can adopt manual work, the people adds above may stand in and adding groove, and the people is difficult for dropping to liquid medicine cylinder the inside.
Said interpolation mouthful, it is circular, square, oval, trilateral, regular polygon any one.
Said interpolation mouth, its top has the gradient of an inclination with the interpolation groove bottom, so that the smooth interpolation of copper ball and tin ball.
Said connection anode conduit, its upper end is fixed on the interpolation trench bottom, and connects and add mouth, and the interpolation groove evenly firmly is in the same place with anode.Anode is difficult for moving like this, and copper ball and tin ball are not fallen in the liquid medicine cylinder and produced copper powder, can not produce the plank short circuit phenomenon, avoids it that workman is produced injury and unrestrained refuse material, has increased the security of operation, has reduced plate face shot copper, has improved product quality.
Said connection anode conduit, it is inserted into and adds in the mouth, and is fixed together with the interpolation groove.
Directly copper ball and tin ball adding titanium basket are compared with the zirconium basket, the utility model adopts the interpolation groove to add, and can fast, stably add copper ball and tin ball; Reach economizing and energy saving effect safety again; Simple to operate, not only improved working efficiency, also improved operating environment.
And the utility model is simple in structure, is easy to make and realize.
Description of drawings
The structural representation that Fig. 1 implements for the utility model.
Embodiment
Shown in accompanying drawing, the practical implementation of the utility model is elaborated.
A kind of PCB that the utility model is realized electroplates copper ball and the quick adding set of tin ball; As shown in Figure 1; This device includes and adds groove 1, and described interpolation trench bottom has the mouth of interpolation 2, and the below of adding mouth 2 leads to connects anode conduit 3; Can copper ball and tin ball be encased in the interpolation groove 1 through this device, add with connection anode conduit 3 through adding mouth 2 then.
Generally, it is fixed that the length of adding groove 1 is come by the cell body length dimension, be 25cm and add the wide of groove 1, is 13cm deeply, and adopts anticorrosive PP plastics to manufacture, the appearance of interpolation groove 1 cell body that is rectangle.When being used for adding copper ball and tin ball. be put into the groove the inside to copper ball and tin ball.
Adding groove 1 is square structure, has backplate 4 around it, and the bottom has base plate 5, and a plurality of interpolations mouths 2 are set on the base plate 5.
Add mouthfuls 2 roundedly, the copper ball that internal diameter 5cm effect will be added the groove the inside and the tin ball face that leaks down is used for making inside a copper ball and tin ball adding anode titanium basket and the zirconium basket above the plank copper on the even planeness.
It is high to connect anode conduit 3 about 10cm, and internal diameter 5cm adopts the PP plastics to manufacture.Be fixed on hot weld and add mouthful 2 places below the cell body that adds groove 1.This installs in use, and integral body is being inserted in titanium basket the inside, is used for catching the copper ball and the tin ball that add to leak down in the mouth and adds to smoothly inside the titanium basket, so as to not make that falling into bottom land brings quality hidden danger to plank.
This device adds through the trend of guiding copper ball and tin ball, can change inaccessiable efficient of common practices and advantage.Be put into interpolation groove the inside to copper ball and tin ball when for example maintaining, the people carries out paddling in the above, send copper ball and tin ball toward the mouth of pipe of connecting the anode conduit, fills it up with the mouth of pipe of connecting the anode conduit just passable.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; Any modification of being done within all spirit and principles at the utility model, be equal to replacement and improvement etc., all should be included within the protection domain of the utility model.
Claims (6)
1. a PCB electroplates copper ball and the quick adding set of tin ball, it is characterized in that this device includes the interpolation groove, and described interpolation trench bottom has the mouth of interpolation, and the below of adding mouth leads to connects the anode conduit.
2. PCB as claimed in claim 1 electroplates copper ball and the quick adding set of tin ball, it is characterized in that said interpolation groove, and the interpolation groove is a square structure, has backplate around it, and the bottom has base plate, and a plurality of interpolations mouths are set on the base plate.
3. PCB as claimed in claim 1 electroplates copper ball and the quick adding set of tin ball, it is characterized in that said interpolation mouth, and it is circular, square, oval, trilateral, regular polygon any one.
4. PCB as claimed in claim 3 electroplates copper ball and the quick adding set of tin ball, it is characterized in that said interpolation mouth, and its top has the gradient of an inclination with the bottom surface of adding groove.
5. PCB plating copper ball as claimed in claim 1 and the quick adding set of tin ball is characterized in that said connection anode conduit, and its upper end is fixed on the interpolation trench bottom, and connects and add mouth, and the interpolation groove evenly firmly is in the same place with anode.
6. PCB as claimed in claim 1 electroplates copper ball and the quick adding set of tin ball, it is characterized in that said connection anode conduit, and it is inserted into and adds in the mouth, and is fixed together with the interpolation groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200043376U CN202465929U (en) | 2012-01-06 | 2012-01-06 | Rapid copper ball and tin ball adding device for PCB (printed circuit board) electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200043376U CN202465929U (en) | 2012-01-06 | 2012-01-06 | Rapid copper ball and tin ball adding device for PCB (printed circuit board) electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202465929U true CN202465929U (en) | 2012-10-03 |
Family
ID=46914106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200043376U Expired - Lifetime CN202465929U (en) | 2012-01-06 | 2012-01-06 | Rapid copper ball and tin ball adding device for PCB (printed circuit board) electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202465929U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106236092A (en) * | 2016-08-22 | 2016-12-21 | 合肥芯福传感器技术有限公司 | EIT electrod-array and manufacture method thereof and device based on this electrod-array |
| CN110923795A (en) * | 2019-12-02 | 2020-03-27 | 欣强电子（清远）有限公司 | Plating line copper ball adds leak protection device |
-
2012
- 2012-01-06 CN CN2012200043376U patent/CN202465929U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106236092A (en) * | 2016-08-22 | 2016-12-21 | 合肥芯福传感器技术有限公司 | EIT electrod-array and manufacture method thereof and device based on this electrod-array |
| CN110923795A (en) * | 2019-12-02 | 2020-03-27 | 欣强电子（清远）有限公司 | Plating line copper ball adds leak protection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121003 |
|
| CX01 | Expiry of patent term |