CN202192556U - Cutting grinding wheel made of ultrathin super-hard materials - Google Patents
Cutting grinding wheel made of ultrathin super-hard materials Download PDFInfo
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- CN202192556U CN202192556U CN2011202837436U CN201120283743U CN202192556U CN 202192556 U CN202192556 U CN 202192556U CN 2011202837436 U CN2011202837436 U CN 2011202837436U CN 201120283743 U CN201120283743 U CN 201120283743U CN 202192556 U CN202192556 U CN 202192556U
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- chip area
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- cutting
- superhard material
- abrasive cut
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Abstract
A cutting grinding wheel made of ultrathin super-hard materials comprises a base and an abrasive layer arranged on the outer side of the base. Both lateral faces of the abrasive layer are provided with circumferentially annular chip removal flutes, and the different chip removal flutes are arrayed in a concentric circle. The chip removal flutes of different shapes and different sizes are designed circumferentially according to the size of the cutting grinding wheel made of the ultrathin super-hard materials and different cutting objects and use conditions, chip removal is benefited, entering of cooling liquid is also benefited, and the external circle of the cutting grinding wheel is continuous, so that impact caused by cutting can be avoided, cutting quality is improved, and cutting efficiency is increased.
Description
Technical field
The utility model belongs to grinding tool abrasive grinding technical field, relates in particular to a kind of superhard material abrasive cut-off wheel.
Background technology
Ultra-thin superhard material abrasive cut-off wheel is mainly used in the cutting or the fluting of precious materials, electronic device, precision optics glass manufacturing process.When big surplus cutting because cutting-in is bigger; Chip removal is not smooth, cooling fluid is difficult to get into etc.; Be prone to cause phenomenons such as cutting area friction aggravation, temperature raise, cutting is not sharp, the lathe load is excessive, the cut workpiece edge collapses the limit, break like this, and then influence cut quality and cutting efficiency.In order to help chip removal and cooling, commonly radially have several cooling chip removal tank, 0.5 to 10 millimeter of the tank degree of depth at ultra-thin superhard material abrasive cut-off wheel abrasive material cylindrical; 0.1 millimeter of tank width does not wait to 1 millimeter, significantly improves with the cutting sharpness though have the emery wheel cutting efficiency of tank, owing to its tank all is spaced apart in the abrasive material cylindrical; When cutting, will inevitably produce interrupted cutting force simultaneously, workpiece and abrasive cut-off wheel are owing to bear alternate stress, and its whole system can produce forced vibration; Thereby deterioration machined surface quality; The aggravation abrasion of grinding wheel, workpiece chipping when serious, edge damage strengthen, and abrasive cut-off wheel is fragile.This must not allow in precise cutting process.So the tank setting of this ultra-thin superhard material abrasive cut-off wheel is that significant limitation and deficiency are arranged.
The utility model content
In order to solve when big surplus is cut off, chip removal is not smooth, and cooling effect is poor, and workpiece and ultra-thin abrasive cut-off wheel bear alternate stress, the problem that workpiece is prone to break, and the utility model provides a kind of ultra-thin superhard material abrasive cut-off wheel.
Adopt following technical scheme in order to solve the problems of the technologies described above: a kind of ultra-thin superhard material abrasive cut-off wheel; The abrasive material that comprises matrix and matrix arranged outside; Two sides of abrasive material are equipped with the chip area that circumferential annular is provided with, and are concentric circles between the different chip areas and arrange.
The chip area of two sides of described abrasive material is symmetrically arranged.
The chip area that establish two sides of described abrasive material is asymmetric setting.
The cross section of said chip area is triangle, circular arc, trapezoidal or rectangle.
At the bottom of the bottom land of said chip area is circular arc.
The quantity of said chip area is 1-10, radially is concentric circles and evenly arranges.
Described cross section is triangle or trapezoidal chip area, and the angle of triangle drift angle or trapezoidal two waists is α, and 0 °＜α＜180 °, the degree of depth of chip area is h, 0.01mm＜h＜1.0 mm.
Described cross section is the chip area of circular arc, and the arc radius of chip area is r, 0.1mm＜r＜10 mm.
Described cross section is the chip area of rectangle, and the width of chip area is b, 0.1mm＜b＜10mm, and the degree of depth of chip area is h, 0.01mm＜h＜1.0 mm.
Arc radius at the bottom of the described circular arc is r, 0.1mm＜r＜10 mm.
The utility model is different according to the size of ultra-thin superhard material abrasive cut-off wheel and cutting object and service condition; Circumferentially be designed with the difformity and big or small chip area that are the concentric circles arrangement, not only help chip removal, and help the entering of cooling fluid; The abrasive cut-off wheel cylindrical is continuous shape simultaneously; The impact that can avoid interrupted cutting to bring improves cut quality, improves cutting efficiency.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Fig. 2 is that the A-A of Fig. 1 is to cutaway view.
Fig. 3 is the enlarged drawing in the B zone of Fig. 2; Wherein scheme the structural representation of A ~ H for eight kinds of symmetric arrays among the embodiment 3.
Fig. 4 is the enlarged drawing in the B zone of Fig. 2; Wherein scheme the structural representation of A ~ H for eight kinds of asymmetric geometries among the embodiment 4.
The specific embodiment
Embodiment 1: like Fig. 1, shown in 2, a kind of ultra-thin superhard material abrasive cut-off wheel comprises the abrasive material 2 of matrix 1 and matrix arranged outside, and two sides of abrasive material 2 are equipped with the chip area 3 that circumferential annular is provided with.The quantity of chip area is 1-10, radially is concentric circles and evenly arranges; The cross section of chip area is triangle, circular arc, trapezoidal or rectangle.
Ultra-thin superhard material abrasive cut-off wheel external diameter is 20-500mm, and thickness H is 0.3-2.0mm.
Embodiment 2: a kind of ultra-thin superhard material abrasive cut-off wheel, the quantity of chip area is 2 ~ 5.Said cross section is the chip area of triangle, circular arc, trapezoidal or rectangle, and bottom land all can be at the bottom of the circular arc.Other are with embodiment 1.
Embodiment 3: the ultra-thin superhard material abrasive cut-off wheel for H＞0.5mm adopts the chip area that is symmetrically distributed, and is stressed even, stable cutting.As scheming shown in A ~ H the structural representation of eight kinds of symmetric arrays among Fig. 3.
Wherein, among Fig. 3 A, the 3C, cross section is triangle or trapezoidal chip area, and the angle of triangle drift angle or trapezoidal two waists is α, and 0 °＜α＜180 °, the degree of depth of chip area is h, 0.01mm＜h＜1.0 mm.
Among Fig. 3 B, cross section is semicircular chip area, and the arc radius of chip area is r, 0.1mm＜r＜10 mm.
Among Fig. 3 D, cross section is the chip area of rectangle, and the width of chip area is b, 0.1mm＜b＜10mm, and the degree of depth of chip area is h, 0.01mm＜h＜1.0 mm.
Among Fig. 3 E, 3F, 3G, the 3H, the top of chip area is respectively triangle, trapezoidal, circular arc, rectangle, and the bottom land of chip area is circular arc, and the radius at the bottom of the circular arc is r, 0.1mm＜r＜10 mm.
Other are with embodiment 1.
The ultra-thin superhard material abrasive cut-off wheel of embodiment 4:H＜0.5mm; Adopt the chip area that is symmetrically distributed to weaken the bending strength of emery wheel, destroy the rigidity of emery wheel, so take the chip area of asymmetric distribution; As scheming among Fig. 4 shown in A ~ H; The structural representation of eight kinds of asymmetric geometries so just can be avoided above-mentioned defective, can also keep its good cutting ability.
Other structures are with embodiment 3.
Claims (10)
1. ultra-thin superhard material abrasive cut-off wheel comprises the abrasive material of matrix and matrix arranged outside, and it is characterized in that: two sides of abrasive material are equipped with the chip area that circumferential annular is provided with, and are concentric circles between the different chip areas and arrange.
2. ultra-thin superhard material abrasive cut-off wheel according to claim 1 is characterized in that: the chip area of two sides of described abrasive material is symmetrically arranged.
3. ultra-thin superhard material abrasive cut-off wheel according to claim 1 is characterized in that: the chip area that establishes two sides of described abrasive material is asymmetric setting.
4. according to claim 1 or 2 or 3 described ultra-thin superhard material abrasive cut-off wheels, it is characterized in that: the cross section of said chip area is triangle, circular arc, trapezoidal or rectangle.
5. ultra-thin superhard material abrasive cut-off wheel according to claim 4 is characterized in that: at the bottom of the bottom land of said chip area is circular arc.
6. according to claim 1 or 2 or 3 described ultra-thin superhard material abrasive cut-off wheels, it is characterized in that: the quantity of said chip area is 1-10, radially is concentric circles and evenly arranges.
7. ultra-thin superhard material abrasive cut-off wheel according to claim 4; It is characterized in that: described cross section is triangle or trapezoidal chip area, and the angle of triangle drift angle or trapezoidal two waists is α, 0 °＜α＜180 °; The degree of depth of chip area is h, 0.01mm＜h＜1.0 mm.
8. ultra-thin superhard material abrasive cut-off wheel according to claim 4 is characterized in that: described cross section is the chip area of circular arc, and the arc radius of chip area is r, 0.1mm＜r＜10 mm.
9. ultra-thin superhard material abrasive cut-off wheel according to claim 4 is characterized in that: described cross section is the chip area of rectangle, and the width of chip area is b, 0.1mm＜b＜10mm, and the degree of depth of chip area is h, 0.01mm＜h＜1.0 mm.
10. ultra-thin superhard material abrasive cut-off wheel according to claim 5 is characterized in that: the arc radius at the bottom of the described circular arc is r, 0.1mm＜r＜10 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202837436U CN202192556U (en) | 2011-08-05 | 2011-08-05 | Cutting grinding wheel made of ultrathin super-hard materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202837436U CN202192556U (en) | 2011-08-05 | 2011-08-05 | Cutting grinding wheel made of ultrathin super-hard materials |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202192556U true CN202192556U (en) | 2012-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202837436U Expired - Lifetime CN202192556U (en) | 2011-08-05 | 2011-08-05 | Cutting grinding wheel made of ultrathin super-hard materials |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202192556U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103802024A (en) * | 2013-11-21 | 2014-05-21 | 湖南大学 | Method for trimming ultra-thin and ultra-hard material grinding wheel through double light beams |
| CN105252440A (en) * | 2015-11-10 | 2016-01-20 | 长沙长泰机器人有限公司 | Lapping grinding wheel for automatically cleaning castings by industrial robot |
-
2011
- 2011-08-05 CN CN2011202837436U patent/CN202192556U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103802024A (en) * | 2013-11-21 | 2014-05-21 | 湖南大学 | Method for trimming ultra-thin and ultra-hard material grinding wheel through double light beams |
| CN103802024B (en) * | 2013-11-21 | 2016-09-28 | 湖南大学 | A kind of Apparatus and method for using dual-beam to repair ultra-thin extra hard material grinding wheel |
| CN105252440A (en) * | 2015-11-10 | 2016-01-20 | 长沙长泰机器人有限公司 | Lapping grinding wheel for automatically cleaning castings by industrial robot |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHENGZHOU RESEARCH INSTITUTE FOR ABRASIVES + GRIND Free format text: FORMER OWNER: ZHENGZHOU ABRASIVE MATERIALS, ABRASIVE TOOLS, GRINDING INST. (CN) NO.1 HUASHAN R Effective date: 20131213 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20131213 Address after: 450001 Zhengzhou high tech Zone, Henan, China Street, No. 121 Patentee after: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. Patentee after: Zhengzhou Sanmo Superhard Material Co., Ltd. Address before: 450001 Zhengzhou high tech Zone, Henan, China Street, No. 121 Patentee before: Zhengzhou Research Institute for Abrasive & Grinding Co., Ltd. Patentee before: Zhengzhou Sanmo Superhard Material Co., Ltd. |
|
| CU03 | Publication of corrected utility model |
Correction item: Patentee Correct: Zhengzhou Institute of abrasives and grinding|450001. No. 121, Indus street, hi tech Zone, Henan, Zhengzhou|Zhengzhou Sanmo Superhard Material Co., Ltd. False: Zhengzhou Abrasives grinding Research Institute Co., Ltd.|No. 450001, 121 Indus street, hi tech Zone, Henan, Zhengzhou|Zhengzhou Sanmo Superhard Material Co., Ltd. Number: 02 Volume: 30 |
|
| ERR | Gazette correction |
Free format text: CORRECT: PATENTEE; FROM: ZHENGZHOU RESEARCH INSTITUTE FOR ABRASIVES + GRINDING CO., LTD.:450001 ZHENGZHOU, HENAN PROVINCE; ZHENGZHOU SANMO SUPERHARD MATERIAL CO., LTD. TO: ZHENGZHOU ABRASIVE MATERIALS, ABRASIVE TOOLS, GRINDING INST. (CN) NO.1 HUASHAN R:450001 ZHENGZHOU, HENAN PROVINCE; ZHENGZHOU SANMO SUPERHARD MATERIAL CO., LTD. |
|
| ASS | Succession or assignment of patent right |
Owner name: ZHENGZHOU RESEARCH INSTITUTE FOR ABRASIVES + GRIND Free format text: FORMER OWNER: ZHENGZHOU ABRASIVE MATERIALS, ABRASIVE TOOLS, GRINDING INST. (CN) NO.1 HUASHAN R Effective date: 20140208 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140208 Address after: 450001 Zhengzhou high tech Zone, Henan, China Street, No. 121 Patentee after: Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd. Patentee after: Zhengzhou Sanmo Superhard Material Co., Ltd. Address before: 450001 Zhengzhou high tech Zone, Henan, China Street, No. 121 Patentee before: Zhengzhou Research Institute for Abrasive & Grinding Co., Ltd. Patentee before: Zhengzhou Sanmo Superhard Material Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120418 |