CN202094175U - 一种远荧光粉的led封装结构 - Google Patents
一种远荧光粉的led封装结构 Download PDFInfo
- Publication number
- CN202094175U CN202094175U CN2011202000633U CN201120200063U CN202094175U CN 202094175 U CN202094175 U CN 202094175U CN 2011202000633 U CN2011202000633 U CN 2011202000633U CN 201120200063 U CN201120200063 U CN 201120200063U CN 202094175 U CN202094175 U CN 202094175U
- Authority
- CN
- China
- Prior art keywords
- led chip
- led
- silica gel
- encapsulating structure
- fluorescent powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 title claims abstract description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000000741 silica gel Substances 0.000 claims abstract description 28
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 39
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 19
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000000605 extraction Methods 0.000 abstract description 5
- 239000007787 solid Substances 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010791 quenching Methods 0.000 description 6
- 230000000171 quenching effect Effects 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000009877 rendering Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 238000005111 flow chemistry technique Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202000633U CN202094175U (zh) | 2011-06-14 | 2011-06-14 | 一种远荧光粉的led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202000633U CN202094175U (zh) | 2011-06-14 | 2011-06-14 | 一种远荧光粉的led封装结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN202094175U true CN202094175U (zh) | 2011-12-28 |
Family
ID=45369223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011202000633U Expired - Lifetime CN202094175U (zh) | 2011-06-14 | 2011-06-14 | 一种远荧光粉的led封装结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN202094175U (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102891242A (zh) * | 2012-10-30 | 2013-01-23 | 四川新力光源股份有限公司 | Led封装器件 |
CN102938442A (zh) * | 2012-11-27 | 2013-02-20 | 北京半导体照明科技促进中心 | Led封装单元及包括其的led封装*** |
CN103219454A (zh) * | 2013-04-25 | 2013-07-24 | 易美芯光(北京)科技有限公司 | 一种提高led封装器件出光效率的涂膜方法和led封装器件 |
CN103682072A (zh) * | 2013-11-29 | 2014-03-26 | 燕飞 | 一种高效率低衰减大功率的白光led封装结构 |
CN104220930A (zh) * | 2012-04-03 | 2014-12-17 | 斯坦雷电气株式会社 | 频闪发光装置 |
CN104253199A (zh) * | 2013-06-26 | 2014-12-31 | 南通同方半导体有限公司 | 一种led封装结构及其制作方法 |
CN106449943A (zh) * | 2016-11-30 | 2017-02-22 | 芜湖聚飞光电科技有限公司 | 一种倒装型量子点led灯珠的成型封装方法 |
CN106531857A (zh) * | 2016-12-28 | 2017-03-22 | 芜湖聚飞光电科技有限公司 | 一种芯片级led封装结构及封装工艺 |
CN108538875A (zh) * | 2018-03-30 | 2018-09-14 | 京东方科技集团股份有限公司 | 光路控制结构、像素结构及其制备方法、显示面板 |
CN114321825A (zh) * | 2022-01-12 | 2022-04-12 | 深圳市必拓电子股份有限公司 | 应用于汽车超远程照明的激光波长转换荧光膜及具有荧光膜的荧光片 |
-
2011
- 2011-06-14 CN CN2011202000633U patent/CN202094175U/zh not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104220930A (zh) * | 2012-04-03 | 2014-12-17 | 斯坦雷电气株式会社 | 频闪发光装置 |
CN102891242A (zh) * | 2012-10-30 | 2013-01-23 | 四川新力光源股份有限公司 | Led封装器件 |
CN102891242B (zh) * | 2012-10-30 | 2015-08-05 | 四川新力光源股份有限公司 | Led封装器件 |
CN102938442A (zh) * | 2012-11-27 | 2013-02-20 | 北京半导体照明科技促进中心 | Led封装单元及包括其的led封装*** |
CN102938442B (zh) * | 2012-11-27 | 2015-06-24 | 北京半导体照明科技促进中心 | Led封装单元及包括其的led封装*** |
CN103219454A (zh) * | 2013-04-25 | 2013-07-24 | 易美芯光(北京)科技有限公司 | 一种提高led封装器件出光效率的涂膜方法和led封装器件 |
CN104253199A (zh) * | 2013-06-26 | 2014-12-31 | 南通同方半导体有限公司 | 一种led封装结构及其制作方法 |
CN103682072A (zh) * | 2013-11-29 | 2014-03-26 | 燕飞 | 一种高效率低衰减大功率的白光led封装结构 |
CN106449943A (zh) * | 2016-11-30 | 2017-02-22 | 芜湖聚飞光电科技有限公司 | 一种倒装型量子点led灯珠的成型封装方法 |
CN106531857A (zh) * | 2016-12-28 | 2017-03-22 | 芜湖聚飞光电科技有限公司 | 一种芯片级led封装结构及封装工艺 |
CN108538875A (zh) * | 2018-03-30 | 2018-09-14 | 京东方科技集团股份有限公司 | 光路控制结构、像素结构及其制备方法、显示面板 |
CN114321825A (zh) * | 2022-01-12 | 2022-04-12 | 深圳市必拓电子股份有限公司 | 应用于汽车超远程照明的激光波长转换荧光膜及具有荧光膜的荧光片 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Far fluorescent powder LED encapsulating structure Effective date of registration: 20121012 Granted publication date: 20111228 Pledgee: Zhongguancun Beijing science and technology Company limited by guarantee Pledgor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Registration number: 2012990000599 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20140207 Granted publication date: 20111228 Pledgee: Zhongguancun Beijing technology financing Company limited by guarantee Pledgor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Registration number: 2012990000599 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PM01 | Change of the registration of the contract for pledge of patent right | ||
PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20140207 Registration number: 2012990000599 Pledgee after: Zhongguancun Beijing technology financing Company limited by guarantee Pledgee before: Zhongguancun Beijing science and technology Company limited by guarantee |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Far fluorescent powder LED encapsulating structure Effective date of registration: 20141204 Granted publication date: 20111228 Pledgee: Beijing industrial development Cci Capital Ltd. Pledgor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Registration number: 2014990001031 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
CX01 | Expiry of patent term |
Granted publication date: 20111228 |
|
CX01 | Expiry of patent term | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20111228 Pledgee: Beijing industrial development Cci Capital Ltd. Pledgor: SHINEON (BEIJING) TECHNOLOGY Co.,Ltd. Registration number: 2014990001031 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |