CN201946628U - Light emitting diode package and its mould - Google Patents
Light emitting diode package and its mould Download PDFInfo
- Publication number
- CN201946628U CN201946628U CN2010206913542U CN201020691354U CN201946628U CN 201946628 U CN201946628 U CN 201946628U CN 2010206913542 U CN2010206913542 U CN 2010206913542U CN 201020691354 U CN201020691354 U CN 201020691354U CN 201946628 U CN201946628 U CN 201946628U
- Authority
- CN
- China
- Prior art keywords
- mould
- lead division
- emitting diode
- led package
- spacing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a light emitting diode package including light emitting diode chips, a bracket used for installing the light emitting diode chips and a mould for fitting the bracket which includes a first lead-out part and a second lead-out part with a space in between, the width of both ends on the extension direction is greater than that in the middle, the mould has a filling part matched to the space, the first and second lead-out parts are installed on the two sides of the filling part of the mould, which has a reinforcement part projected upward from the middle part to the two ends. The filling part between the first two leading parts of the light emitting diode package mould is formed by hot rigid resin to prevent damage to the clearance efficiently and reduce thermal deformation.
Description
Technical field
The utility model relates to a kind of LED package and mould thereof.
Background technology
Light-emitting diode utilizes its lighting function to can be used as a device after through encapsulation to be used for back light unit at lighting apparatus, imageing sensor and display unit, photoflash lamp.
General light-emitting diode is made up of light-emitting diode chip for backlight unit, the support that light-emitting diode chip for backlight unit is installed and the mould of mounting bracket.Support comprises first lead division, second lead division that mutual isolation is provided with, and first lead division, second lead division are connected with negative electrode with the anode of light-emitting diode respectively.After support is installed on the mould, fill thermoplastic resin phenylpropanolamine (Polyphthalamide) between first lead division, second lead division.But on this pattern, filling place of first lead division, second lead division is easy to divide or damaged phenomenon.In addition, light-emitting diode chip for backlight unit can produce a lot of heats when work, and the mould that is formed by thermoplastics such as phenylpropanolamine also causes thermal deformation easily.As time goes on thermoplastic resin causes the support adherence force to reduce easily, and xanthochromia etc. takes place, and whole LED package reliability is reduced.
Summary of the invention
A purpose of the present utility model provides damaged LED package takes place between two supports of a kind of effective inhibition.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of LED package, comprise light-emitting diode chip for backlight unit, be used to install described light-emitting diode chip for backlight unit support, be used to install the mould of described support, described support comprises first lead division, second lead division, has spacing between described first lead division and second lead division, the width at described spacing two ends on its bearing of trend is greater than the width in the middle of it, described mould has the filling part that is complementary with described spacing shape, and described first lead division, second lead division are installed in the filling part both sides of described mould respectively.
Preferably, the material of described mould is a thermosetting resin.Further preferably, described thermosetting resin is a white.
Preferably, the center that the is shaped as symmetry of described spacing.
Preferably, the width of described spacing from both sides to the centre reduces gradually.
Preferably, offer concave part on the described support, described light-emitting diode chip for backlight unit is installed in the described concave part.
Another purpose of the present utility model provides the mould that above-mentioned support is installed in a kind of LED package.
A kind of mould of LED package, described mould has the filling part that the spacing shape with described first lead division, second lead division is complementary, described first lead division, second lead division are installed in the filling part both sides of described mould respectively, and described filling part is protruding upward the reinforcement part.
Preferably, described reinforcement part is protruding upward gradually to two ends from the centre of described filling part.Further preferably, the cross section of described reinforcement part is triangular in shape.
Because the technique scheme utilization, the utility model compared with prior art has following advantage and effect:
LED package of the present utility model, mould employing thermosetting resin is formed on the filling between first lead division and second lead division, can effectively prevent this gap and damaged phenomenon occur, and reduce the thermal deformation of mould, effectively prevent phenomenons such as the low and xanthochromia of adherence force.
Description of drawings
Accompanying drawing 1 is the plane graph of LED package of the present utility model;
Accompanying drawing 2 is the cutaway view of LED package of the present utility model;
Accompanying drawing 3 is the plane graph one of LED support part of the present utility model;
Accompanying drawing 4 is the plane graph two of LED support part of the present utility model;
Accompanying drawing 5 is a mould schematic diagram of the present utility model;
Accompanying drawing 6 is the partial schematic diagram of mould in the accompanying drawing 5.
Wherein: 1, LED package; 2, LED package; 100, light-emitting diode chip for backlight unit; 200, support; 210, first lead division; 212, portion of terminal; 214, concave part; 215, spacing; 216, spacing; 220, second lead division; 222, portion of terminal; 300, mould; 310, filling part; 320, reinforcement part; 410, lead; 420, lead.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described:
As shown in Figure 1, 2, 3, the LED package 1 of present embodiment comprises light-emitting diode chip for backlight unit 100, support 200 and mould 300.Wherein: light-emitting diode chip for backlight unit 100 is engaged with N type semiconductor by P type semiconductor and forms, and produces light during from P type semiconductor to the N type semiconductor current emission; Support 200 comprises isolates first lead division 210 and second lead division 220 that is provided with.
There is individual concave part 214 middle part of support 200, and as shown in Figure 2, first lead division 210 is toward the recessed part of downside, and light-emitting diode chip for backlight unit 100 is installed in the concave part 214.In the present embodiment, the anode of light-emitting diode chip for backlight unit 100 and negative electrode correspond respectively to first lead division 210 and second lead division 220, somely in the anode of light-emitting diode chip for backlight unit 100 or the negative electrode lead to first lead division, 210, the first lead divisions, 210 terminals by a lead 410 and form the portion of terminal 212 be connected with external circuitry; Light-emitting diode chip for backlight unit 100 another utmost points lead to second lead division 220 by an other lead 420, second lead division, 220 terminals form the portion of terminal 222 that is connected with external circuitry, because first lead division 210 and second lead division, 220 physical properties are isolated mutually, the anode of light-emitting diode chip for backlight unit 100 electrically separates with negative electrode.
The heat of sending on the light-emitting diode chip for backlight unit 100 effectively sheds at the concave part 214 by first lead division 210.Mould 300 is the material of thermosetting resin (epoxy molding compound), and in order better to accomplish the light reflection, thermosetting resin interpolation silicon silica etc. makes it present white; Simultaneously, make the effect of LED package reach best at the light-emitting diode chip for backlight unit 100 coated resins of fluorescent material that comprise.
The mould of the LED package 2 of present embodiment is that the white hot hardening resin is by compression forming, the thermosetting resin thermal endurance is more outstanding, adherence force to support 200 is also stronger, and, mould compared with the PPA material, light-emitting diode chip for backlight unit 100 heatings can be out of shape yet, and adherence force also can continue to keep, and significantly promotes 1 reliability effect of LED package; And the mould 200 that thermosetting resin forms can more effective inhibition to the effect of resin loss than the mould of PPA resin forming.
Yet thermosetting resin is more more outstanding than thermoplastic resin PPA heat-resistant quality and adherence force etc., but also bigger than PPA hardness, and therefore damaged equally likely possibility is also high more.Width by spacing in the present embodiment diminishes from both ends to the middle gradually, suppresses the stress concentration phenomenon, makes the possibility of filling part 310 breakages of mould 200 littler.In addition, the width of spacing directly influences filling part 310 and first lead division 210, second lead division, 220 bonding areas under a stable condition, to reach filling part 310 and first lead division 210, second lead division 220 are pasted more firm.
Shown in Fig. 5,6, in the present embodiment, the filling part 310 of mould 200 extends upward reinforcement part 320, and reinforcement part 320 is protruding gradually to two ends from the centre of filling part 310, and the thickness of mould 200 is thicker than the madial wall between filling part 310 both sides.Because reinforcement part 320 forms with outstanding form on filling part 310, bear together reinforcement part 320 when filling part 310 is stressed, in addition, compared with filling part 310 inboards, filling part 310 both sides are higher with the possibility that be full of cracks takes place because of external impact, so reinforcement part 320 is in filling part 310 both sides projectioies.
In addition, reinforcement part 320 is higher than the installation site of first lead division 210 and second lead division 220, exists with discontiguous form.
The foregoing description only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement according to this, can not limit protection range of the present utility model with this.All equivalences of being done according to the utility model spirit change or modify, and all should be encompassed within the protection range of the present utility model.
Claims (9)
1. LED package, comprise light-emitting diode chip for backlight unit, be used to install the support of described light-emitting diode chip for backlight unit, be used to install the mould of described support, described support comprises first lead division, second lead division, has spacing between described first lead division and second lead division, it is characterized in that: the width at described spacing two ends on its bearing of trend is greater than the width in the middle of it, described mould has the filling part that is complementary with described spacing shape, described first lead division, second lead division is installed in the filling part both sides of described mould respectively.
2. LED package according to claim 1 is characterized in that: the material of described mould is a thermosetting resin.
3. LED package according to claim 2 is characterized in that: described thermosetting resin is white.
4. LED package according to claim 1 is characterized in that: the center that the is shaped as symmetry of described spacing.
5. LED package according to claim 1 is characterized in that: the width of described spacing from both sides to the centre reduces gradually.
6. LED package according to claim 1 is characterized in that: offer concave part on the described support, described light-emitting diode chip for backlight unit is installed in the described concave part.
7. the mould of a LED package as claimed in claim 1, it is characterized in that: described mould has the filling part that the spacing shape with described first lead division, second lead division is complementary, described first lead division, second lead division are installed in the filling part both sides of described mould respectively, and described filling part is protruding upward the reinforcement part.
8. the mould of LED package according to claim 7, it is characterized in that: described reinforcement part is protruding upward gradually to two ends from the centre of described filling part.
9. the mould of LED package according to claim 8, it is characterized in that: the cross section of described reinforcement part is triangular in shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206913542U CN201946628U (en) | 2010-12-31 | 2010-12-31 | Light emitting diode package and its mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206913542U CN201946628U (en) | 2010-12-31 | 2010-12-31 | Light emitting diode package and its mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201946628U true CN201946628U (en) | 2011-08-24 |
Family
ID=44473964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206913542U Expired - Fee Related CN201946628U (en) | 2010-12-31 | 2010-12-31 | Light emitting diode package and its mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201946628U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130278A (en) * | 2010-12-31 | 2011-07-20 | 昆山琉明光电有限公司 | Package of light emitting diode |
| CN103311402A (en) * | 2012-03-16 | 2013-09-18 | 日月光半导体制造股份有限公司 | LED packages and carrier |
-
2010
- 2010-12-31 CN CN2010206913542U patent/CN201946628U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130278A (en) * | 2010-12-31 | 2011-07-20 | 昆山琉明光电有限公司 | Package of light emitting diode |
| CN102130278B (en) * | 2010-12-31 | 2013-04-03 | 昆山琉明光电有限公司 | Package of light emitting diode |
| CN103311402A (en) * | 2012-03-16 | 2013-09-18 | 日月光半导体制造股份有限公司 | LED packages and carrier |
| CN103311402B (en) * | 2012-03-16 | 2016-03-16 | 日月光半导体制造股份有限公司 | LED package and loading plate |
| US9653656B2 (en) | 2012-03-16 | 2017-05-16 | Advanced Semiconductor Engineering, Inc. | LED packages and related methods |
| US10177283B2 (en) | 2012-03-16 | 2019-01-08 | Advanced Semiconductor Engineering, Inc. | LED packages and related methods |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20191231 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |