CN201935144U - Heat dissipation structure of high power LED lamp - Google Patents

Heat dissipation structure of high power LED lamp Download PDF

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Publication number
CN201935144U
CN201935144U CN2010206098250U CN201020609825U CN201935144U CN 201935144 U CN201935144 U CN 201935144U CN 2010206098250 U CN2010206098250 U CN 2010206098250U CN 201020609825 U CN201020609825 U CN 201020609825U CN 201935144 U CN201935144 U CN 201935144U
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CN
China
Prior art keywords
light source
radiator
heat pipe
heat
led light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010206098250U
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Chinese (zh)
Inventor
黄庆光
王平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG XINQIANG LIGHTING ELECTRONIC Co Ltd
Original Assignee
ZHEJIANG XINQIANG LIGHTING ELECTRONIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHEJIANG XINQIANG LIGHTING ELECTRONIC Co Ltd filed Critical ZHEJIANG XINQIANG LIGHTING ELECTRONIC Co Ltd
Priority to CN2010206098250U priority Critical patent/CN201935144U/en
Application granted granted Critical
Publication of CN201935144U publication Critical patent/CN201935144U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a heat dissipation structure of a high power LED lamp. The structure mainly comprises a LED light source and a radiator; the LED light source is connected with a bearing platform; heat conduction fat is disposed between the LED light source and the bearing platform; the bearing platform is in seamless connection with a heat pipe; the heat pipe fixed on the radiator by a heat pipe pressing plate and screws. In the heat dissipation structure of a high power LED lamp, heat conduction fat is disposed between the LED light source and the bearing platform, thereby the two are connected more tightly to achieve a better heat radiation effect; the seamless connection between the bearing platform and the heat pipe enables the heat generated by the LED light source to be transmitted to the heat pipe rapidly; the tight connection of the heat pipe and the radiator can enable the heat on the heat pipe to be transmitted to the radiator rapidly, then is radiated out by the ultra large heat dissipation area of the radiator. The structure realizes the heat dissipation to an LED light source, and ensures luminous decay index and prolongs the service life of an LED light source.

Description

The radiator structure of high-powered LED lamp
Technical field
The utility model relates to LED lamp illuminating industry, especially a kind of radiator structure of high-powered LED lamp.
Background technology
The radiator structure of LED lamp generally all is to be connected with radiator by led light source on the market at present, owing to have certain clearance between led light source and the radiator, has reduced the area that conducts heat, and makes heat-conducting effect poor, and the heat transmission is slow, and radiating effect is poor.Especially some high-power LED lamps in use can produce a large amount of heats, as not distributing heat quickly, will be that the temperature of LED lamp is too high, cause reduce the service life of LED lamp.
The utility model content
The purpose of this utility model is the radiator structure that the high-powered LED lamp of a kind of energy quick heat radiating and good heat dissipation effect is provided for the deficiency that solves above-mentioned technology.
In order to achieve the above object, the radiator structure of the high-powered LED lamp that the utility model is designed, it mainly comprises led light source and radiator, led light source is connected with cushion cap, between led light source and cushion cap, be provided with thermal grease conduction, cushion cap and heat pipe seamless link, heat pipe is fixed on the radiator by heat pipe pressing plate and screw.Such structure makes led light source be connected closely better heat-radiation effect with cushion cap.
Above-mentioned heat pipe is bending-type, and plane, heat pipe place is vertical with the radiator mounting plane, and radiator is provided with fin, the irregular fold of fin surface, and such structure has increased area of dissipation, makes radiating effect better.
The radiator structure of the resulting high-powered LED lamp of the utility model is provided with thermal grease conduction between led light source and cushion cap, make both connections tightr, and radiating effect is better.Because irregular fold on the fin increases area of dissipation, heat-sinking capability strengthens.Adopt seamless link between cushion cap and the heat pipe in addition, the heat that led light source is produced can be passed to heat pipe rapidly, and heat pipe closely is connected with radiator, can make the heat on the heat pipe be passed on the radiator rapidly, rely on the area of dissipation of radiator super large that heat radiation is gone out then, realized heat radiation, guaranteed the light decay index, improved the service life of led light source led light source.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment.
1.LED light source, 2. thermal grease conduction, 3. cushion cap, 4. heat pipe, 5. screw, 6. heat pipe pressing plate, 7. radiator, 8. fin.
The specific embodiment
The utility model will be further described in conjunction with the accompanying drawings below by embodiment.
Embodiment 1:
As shown in Figure 1, the radiator structure of the high-powered LED lamp that present embodiment is described, it mainly comprises led light source 1 and radiator 7, and led light source 1 is connected with cushion cap 3, is provided with thermal grease conduction 2 between led light source 1 and cushion cap 3, cushion cap 3 and heat pipe 4 seamless links, heat pipe 4 is fixed on the radiator 7 by heat pipe pressing plate 6 and screw 5, and heat pipe 4 is bending-type, and plane, heat pipe 4 place is vertical with radiator 7 mounting planes, radiator 7 is provided with fin 8, fin 8 surperficial irregular folds.

Claims (2)

1. the radiator structure of a high-powered LED lamp, it mainly comprises led light source and radiator, it is characterized in that described led light source is connected with cushion cap, is provided with thermal grease conduction between led light source and cushion cap, cushion cap and heat pipe seamless link, heat pipe is fixed on the radiator by heat pipe pressing plate and screw.
2. the radiator structure of high-powered LED lamp according to claim 1 is characterized in that described heat pipe is bending-type, and plane, heat pipe place is vertical with the radiator mounting plane, and radiator is provided with fin, the irregular fold of fin surface.
CN2010206098250U 2010-11-16 2010-11-16 Heat dissipation structure of high power LED lamp Expired - Fee Related CN201935144U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010206098250U CN201935144U (en) 2010-11-16 2010-11-16 Heat dissipation structure of high power LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010206098250U CN201935144U (en) 2010-11-16 2010-11-16 Heat dissipation structure of high power LED lamp

Publications (1)

Publication Number Publication Date
CN201935144U true CN201935144U (en) 2011-08-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010206098250U Expired - Fee Related CN201935144U (en) 2010-11-16 2010-11-16 Heat dissipation structure of high power LED lamp

Country Status (1)

Country Link
CN (1) CN201935144U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017008559A1 (en) * 2015-07-14 2017-01-19 广东欧珀移动通信有限公司 Mainboard heat dissipation structure and mobile terminal
CN108681373A (en) * 2018-07-02 2018-10-19 广州洛图终端技术有限公司 A kind of small casing structure of external heat radiation piece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017008559A1 (en) * 2015-07-14 2017-01-19 广东欧珀移动通信有限公司 Mainboard heat dissipation structure and mobile terminal
CN108681373A (en) * 2018-07-02 2018-10-19 广州洛图终端技术有限公司 A kind of small casing structure of external heat radiation piece

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110817

Termination date: 20111116