CN108681373A - A kind of small casing structure of external heat radiation piece - Google Patents
A kind of small casing structure of external heat radiation piece Download PDFInfo
- Publication number
- CN108681373A CN108681373A CN201810713495.0A CN201810713495A CN108681373A CN 108681373 A CN108681373 A CN 108681373A CN 201810713495 A CN201810713495 A CN 201810713495A CN 108681373 A CN108681373 A CN 108681373A
- Authority
- CN
- China
- Prior art keywords
- heat
- tabletting
- casing structure
- small casing
- mainboard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of small casing structures of external heat radiation piece, mainboard IC including machine case body, in machine case body and heat conducting pipe, it is provided with heat conduction tabletting at the top of the mainboard IC, the top of the machine case body is equipped with the cooling fin being located on the outside of machine case body, the bottom of the cooling fin is provided with the heat dissipation tabletting inside machine case body, described heat conducting pipe one end is interted to heat conduction tabletting, and the other end interts to heat dissipation tabletting.Under the connection of heat conducting pipe, well by outside the heat transfer to cabinet on mainboard IC, the heat dissipation of cabinet inside mainboard IC is effectively realized.Meanwhile the present invention is external by cooling fin, can effective controlling machine box volume so that the advantages of small casing structure of the present invention has had both small and perfect heat-dissipating.
Description
Technical field
The present invention relates to cabinet technical field, more particularly to a kind of small casing structure of external heat radiation piece.
Background technology
Cabinet equipped with IC mainboards extensively should be in the electronic equipments such as PC, ticket machine, printer, lottery tickets machine；IC's dissipates
Heat influences whether the operational effect of IC, so IC heat dissipations and mainboard dust-proof the problem of being user's major concern of electronic equipment.
Mainboard, cooling fin, cooling fan are generally all concentrated on same cabinet inside, the setting side by existing mainboard cabinet
The drawbacks of formula generates has：Cabinet volume is excessive, occupies excessive space.Meanwhile heat emission hole and cooling fan lead to the member in cabinet
Device is covered with micronic dust, further influences heat dissipation.
Invention content
Technical problem to be solved by the invention is to provide a kind of small casing structure of external heat radiation piece, the small casing structures
Both had preferable heat dissipation performance, moreover it is possible to occupy smaller space.
Used technical solution to solve above-mentioned technical problem：A kind of small casing structure of external heat radiation piece, including machine
Case ontology, mainboard IC and heat conducting pipe in machine case body are provided with heat conduction tabletting, institute at the top of the mainboard IC
The top for stating machine case body is equipped with the cooling fin being located on the outside of machine case body, and the bottom of the cooling fin is provided with positioned at machine
The heat dissipation tabletting of case body interior, described heat conducting pipe one end are interted to heat conduction tabletting, and the other end interts to heat dissipation tabletting.
Further, the both ends of the heat conducting pipe are respectively formed D-shape configuration, and the heat conduction tabletting is bonded at the top of mainboard IC
Bottom be equipped with D-shaped groove, the heat dissipation tabletting at the top being bonded with cooling fin bottom equipped with D-shaped groove, the heat conducting pipe
The D-shape configuration at both ends is inserted into respectively in upper and lower two D-shaped grooves, the exterior arc surface of the D-shape configuration and the D-shaped groove
Inner arc surface be fitted close.
Further, the central angle corresponding to the exterior arc surface of the D-shaped groove is more than 180 °, the D-shape configuration appearance
Plane and the open end of D-shaped groove it is coplanar.
Further, the heat conducting pipe is U-shaped, and the D-shape configuration at the heat conducting pipe both ends is pressed from heat conduction tabletting and heat dissipation
The same side of piece is inserted into D-shaped groove.
Further, the heat conduction tabletting and heat dissipation tabletting are slab construction.
Further, between the mainboard IC and heat conduction tabletting be equipped with heat dissipation patch, the plane of the D-shape configuration appearance with dissipate
Heat posted fits closely.
Further, the heat conducting pipe is metal solid circular pipe.
Further, the metal solid circular pipe is copper heat conduction pipe.
Further, more heat conducting pipes are provided between the heat conduction tabletting and heat dissipation tabletting.
Further, the cooling fin is equipped with cooling fan.
Advantageous effect：In the small casing structure of the present invention, in the heat transfer to heat conduction tabletting of mainboard IC, in heat conduction tabletting
Heat is transferred to through heat conducting pipe in heat dissipation tabletting, and bottom of the heat through cooling fin radiated in tabletting is up transferred to cooling fin
Multiple radiating fins, well by outside the heat transfer to cabinet on mainboard IC, effectively realize machine under the connection of heat conducting pipe
The heat dissipation of mainboard IC inside case.Meanwhile the present invention is external by cooling fin, can effective controlling machine box volume so that the present invention
Small casing structure has had both the advantages of small and perfect heat-dissipating.
Description of the drawings
The present invention is described further with reference to the accompanying drawings and examples：
Fig. 1 is the internal structure front view of the small casing structure of external heat radiation piece of the embodiment of the present invention；
Fig. 2 is the internal structure left view sectional view of the small casing structure of external heat radiation piece of the embodiment of the present invention.
Specific implementation mode
Referring to figs. 1 to Fig. 2, a kind of small casing structure of external heat radiation piece of the embodiment of the present invention, which includes
Machine case body 1, the mainboard 9 in machine case body 1, the mainboard IC2 being arranged on mainboard 9 and heat conducting pipe 4.As shown in the figure
Mainboard IC2 be two, the top of two mainboard IC2 is provided with heat conduction tabletting 3, meanwhile, the top of machine case body 1 is set
There is the cooling fin 6 positioned at 1 outside of machine case body, the bottom of cooling fin 6 is provided with the heat dissipation pressure inside machine case body 1
Piece 5.One can be made with the top of machine case body 1 in the bottom of the cooling fin 6, then the top of tabletting 5 of radiating directly with heat dissipation
The bottom of piece 6 is bonded；The bottom of cooling fin 6 can also be with the top of machine case body 1 closely patch and and be fixedly connected, then radiate
The top of tabletting 5 is bonded with the top surface lower part of machine case body 1, and top of the heat through machine case body 1 is transferred to the bottom of radiator.
4 one end of heat conducting pipe is interted to heat conduction tabletting 3, and the other end interts to heat dissipation tabletting 5.
In the small casing structure of the present invention, in the heat transfer to heat conduction tabletting 3 of mainboard IC2, the heat warp in heat conduction tabletting 3
Heat conducting pipe 4 is transferred in heat dissipation tabletting 5, and bottom of the heat through cooling fin 6 radiated in tabletting 5 is up transferred to cooling fin 6
Multiple radiating fins, well by outside the heat transfer to cabinet on mainboard IC2, effectively realize under the connection of heat conducting pipe 4
The heat dissipation of cabinet inside mainboard IC2.Meanwhile the present invention is external by cooling fin 6, can effective controlling machine box volume so that this
Invent the advantages of small casing structure has had both small and perfect heat-dissipating.The smaller small casing structure of occupied space is placed
It is more convenient, the requirement to space substantially reduces；Meanwhile the space inside small casing structure reduces, and is advantageously implemented preferably
It is dust-proof.
Preferably, the both ends of heat conducting pipe 4 are respectively formed D-shape configuration, heat conduction tabletting 3 with the bottom that is bonded at the top of mainboard IC2
Portion is equipped with D-shaped groove, and heat dissipation tabletting 5 is equipped with D-shaped groove, the D-shaped at 4 both ends of heat conducting pipe at the top being bonded with 6 bottom of cooling fin
Structure is inserted into respectively in upper and lower two D-shaped grooves, and the exterior arc surface of D-shape configuration is closely matched with the inner arc surface of D-shaped groove
It closes.The D-shape configuration includes a plane and an arc surface, on the one hand, the plane of the structure and the top surfaces mainboard IC2 and heat dissipation
6 bottom surface of piece fits closely, it can be achieved that the heat that heat is transferred directly on heat conducting pipe 4 and on heat conducting pipe 4 on mainboard IC2 is direct
It is transferred on cooling fin 6.On the other hand, the arc surface of the structure is fitted closely with heat conduction tabletting 3 and heat dissipation tabletting 5, due to
Contact surface is arc surface, and the efficiency of conduction heat is much higher than the efficiency of planar conductive heat, this has been considerably improved heat conduction
Pipe 4 transmits the efficiency of heat conduction tabletting 3 and 5 heat of tabletting that radiates, and then improves heat dissipation performance.
Meanwhile the central angle corresponding to the exterior arc surface of D-shaped groove is more than 180 °, the plane and D-shaped of D-shape configuration appearance are recessed
The open end of slot is coplanar.D-shaped groove is consistent with the appearance and size of D-shape configuration, and interference is used between D-shaped groove and D-shape configuration
Cooperation.After D-shape configuration is inserted into D-shaped groove, under the restriction effect of D-shaped groove, mainboard IC2 and cooling fin 6, the heat conducting pipe
4 can not rotate, meanwhile, under the squeezing action of the inner arc surface of D-shaped groove, heat conducting pipe 4 is also more difficult to be axially moved.
The limit that heat conducting pipe 4 not only may be implemented in the structure is fixed, moreover it is possible to heat conducting pipe 4 be effectively ensured and connect with the close of each parts
It touches, ensures preferable heat-conductive characteristic.
Preferably, heat conducting pipe 4 is U-shaped, the D-shape configuration at 4 both ends of heat conducting pipe is from heat conduction tabletting 3 and heat dissipation tabletting 5
The same side is inserted into D-shaped groove；Meanwhile heat conduction tabletting 3 and heat dissipation tabletting 5 are slab construction.Using the arrangement and
Slab construction, can preferable each parts occupied space in cabinet, be conducive to space optimization and further decrease cabinet
Volume.
Specifically, heat dissipation patch 8, the plane of D-shape configuration appearance and heat dissipation are provided between mainboard IC2 and heat conduction tabletting 3
Patch 8 fits closely.Due to the difference of material, directly make the effect that heat conduction tabletting 3 is fitted closely with mainboard IC2 poor.Setting exists
Heat dissipation patch 8 between mainboard IC2 and heat conduction tabletting 3, upper and lower surface is fitted closely with mainboard IC2 and heat conduction tabletting 3 respectively,
It is good to be bonded effect, is conducive to the transmission of heat.
Preferably, heat conducting pipe 4 is metal solid circular pipe, metal solid circular pipe is copper heat conduction pipe.Copper heat conduction circle
The heat conductivility of pipe is excellent, while pipe is easy to implement the bending of all directions, can increase the flexibility of arrangement heat conducting pipe 4.
Meanwhile being provided with more heat conducting pipes 4 between heat conduction tabletting 3 and heat dissipation tabletting 5.In combination with the fever journey of mainboard IC2
Degree, selection more heat conducting pipes 4 of setting, to further improve the efficiency of heat transmission.
Preferably, cooling fin 6 is equipped with cooling fan 7, to accelerate distributing for heat on cooling fin 6.
Embodiments of the present invention are explained in detail above in conjunction with attached drawing, but the present invention is not limited to above-mentioned embodiment party
Formula, the technical field those of ordinary skill within the scope of knowledge, can also be before not departing from present inventive concept
Put that various changes can be made.
Claims (10)
1. a kind of small casing structure of external heat radiation piece, it is characterised in that：Mainboard including machine case body, in machine case body
IC and heat conducting pipe are provided with heat conduction tabletting at the top of the mainboard IC, and the top of the machine case body, which is equipped with, is located at machine
The bottom of the cooling fin of case outer body, the cooling fin is provided with the heat dissipation tabletting inside machine case body, described
Heat conducting pipe one end is interted to heat conduction tabletting, and the other end interts to heat dissipation tabletting.
2. the small casing structure of external heat radiation piece according to claim 1, it is characterised in that：The both ends of the heat conducting pipe are equal
Form D-shape configuration, the heat conduction tabletting is being equipped with D-shaped groove with the bottom that is bonded at the top of mainboard IC, the heat dissipation tabletting with
The top of cooling fin bottom fitting is equipped with D-shaped groove, and the D-shape configuration at the heat conducting pipe both ends is inserted into upper and lower two D-shapeds respectively
In groove, the exterior arc surface of the D-shape configuration and the inner arc surface of the D-shaped groove are fitted close.
3. the small casing structure of external heat radiation piece according to claim 2, it is characterised in that：The outer circle of the D-shaped groove
Central angle corresponding to cambered surface is more than 180 °, and the plane and the open end of D-shaped groove of the D-shape configuration appearance are coplanar.
4. the small casing structure of external heat radiation piece according to claim 3, it is characterised in that：The heat conducting pipe is U-shaped, institute
The D-shape configuration for stating heat conducting pipe both ends is inserted into D-shaped groove from the same side of heat conduction tabletting and tabletting of radiating.
5. the small casing structure of external heat radiation piece according to claim 4, it is characterised in that：The heat conduction tabletting and heat dissipation
Tabletting is slab construction.
6. according to the small casing structure of claim 2~5 any one of them external heat radiation piece, it is characterised in that：The mainboard
Heat dissipation patch is equipped between IC and heat conduction tabletting, plane and the heat dissipation patch of the D-shape configuration appearance fit closely.
7. according to the small casing structure of Claims 1 to 5 any one of them external heat radiation piece, it is characterised in that：The heat conduction
Pipe is metal solid circular pipe.
8. the small casing structure of external heat radiation piece according to claim 7, it is characterised in that：The metal solid circular pipe is
Copper heat conduction pipe.
9. according to the small casing structure of Claims 1 to 5 any one of them external heat radiation piece, it is characterised in that：The heat conduction
It is provided with more heat conducting pipes between tabletting and heat dissipation tabletting.
10. according to the small casing structure of Claims 1 to 5 any one of them external heat radiation piece, it is characterised in that：The heat dissipation
On piece is equipped with cooling fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810713495.0A CN108681373A (en) | 2018-07-02 | 2018-07-02 | A kind of small casing structure of external heat radiation piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810713495.0A CN108681373A (en) | 2018-07-02 | 2018-07-02 | A kind of small casing structure of external heat radiation piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108681373A true CN108681373A (en) | 2018-10-19 |
Family
ID=63813113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810713495.0A Pending CN108681373A (en) | 2018-07-02 | 2018-07-02 | A kind of small casing structure of external heat radiation piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108681373A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109917873A (en) * | 2019-04-12 | 2019-06-21 | 南京南瑞继保电气有限公司 | A kind of Sheet-metal machine box structure of external plug-in radiating module |
| CN112835434A (en) * | 2021-01-15 | 2021-05-25 | 浪潮电子信息产业股份有限公司 | Server and external modular heat dissipation mechanism thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2826507Y (en) * | 2005-09-26 | 2006-10-11 | 郭军 | Computer with external radiator |
| CN200990051Y (en) * | 2006-09-01 | 2007-12-12 | 利民科技开发有限公司 | Main board internal storage radiating device |
| CN101221931A (en) * | 2008-01-23 | 2008-07-16 | 黄崇贤 | Radiator without base plate |
| CN201935144U (en) * | 2010-11-16 | 2011-08-17 | 浙江新强照明科技有限公司 | Heat dissipation structure of high power LED lamp |
| CN203786647U (en) * | 2014-04-28 | 2014-08-20 | 吉首大学 | Radiating structure of computer case |
| CN105892598A (en) * | 2016-04-22 | 2016-08-24 | 嘉兴澎湃网络科技有限公司 | Integrated computer case structure |
| CN205540474U (en) * | 2016-01-28 | 2016-08-31 | 上海申彩信息***有限公司 | Dustproof host computer |
| CN207301961U (en) * | 2017-10-25 | 2018-05-01 | 四川云玦科技有限公司 | A kind of computer cabinet heat conducting and heat radiating device |
| CN208689491U (en) * | 2018-07-02 | 2019-04-02 | 广州洛图终端技术有限公司 | A kind of small casing structure of external heat radiation piece |
-
2018
- 2018-07-02 CN CN201810713495.0A patent/CN108681373A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2826507Y (en) * | 2005-09-26 | 2006-10-11 | 郭军 | Computer with external radiator |
| CN200990051Y (en) * | 2006-09-01 | 2007-12-12 | 利民科技开发有限公司 | Main board internal storage radiating device |
| CN101221931A (en) * | 2008-01-23 | 2008-07-16 | 黄崇贤 | Radiator without base plate |
| CN201935144U (en) * | 2010-11-16 | 2011-08-17 | 浙江新强照明科技有限公司 | Heat dissipation structure of high power LED lamp |
| CN203786647U (en) * | 2014-04-28 | 2014-08-20 | 吉首大学 | Radiating structure of computer case |
| CN205540474U (en) * | 2016-01-28 | 2016-08-31 | 上海申彩信息***有限公司 | Dustproof host computer |
| CN105892598A (en) * | 2016-04-22 | 2016-08-24 | 嘉兴澎湃网络科技有限公司 | Integrated computer case structure |
| CN207301961U (en) * | 2017-10-25 | 2018-05-01 | 四川云玦科技有限公司 | A kind of computer cabinet heat conducting and heat radiating device |
| CN208689491U (en) * | 2018-07-02 | 2019-04-02 | 广州洛图终端技术有限公司 | A kind of small casing structure of external heat radiation piece |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109917873A (en) * | 2019-04-12 | 2019-06-21 | 南京南瑞继保电气有限公司 | A kind of Sheet-metal machine box structure of external plug-in radiating module |
| CN112835434A (en) * | 2021-01-15 | 2021-05-25 | 浪潮电子信息产业股份有限公司 | Server and external modular heat dissipation mechanism thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101072482A (en) | Radiating device and radiating system using same | |
| TWM459692U (en) | Portable communication device with heat dissipation structure | |
| WO2021083142A1 (en) | Electronic device | |
| US20110168358A1 (en) | Lap-joined heat pipe structure and thermal module using same | |
| CN108681373A (en) | A kind of small casing structure of external heat radiation piece | |
| CN108695275A (en) | Radiator | |
| TW201906522A (en) | Electronic device | |
| CN201229136Y (en) | Heat conducting structure and heat radiating device with the heat conducting structure | |
| US20050225942A1 (en) | Plug-in cooling device | |
| TW201215302A (en) | Thermal module and electronic device incorporating the same | |
| CN208689491U (en) | A kind of small casing structure of external heat radiation piece | |
| CN109814693A (en) | Electronic device | |
| JP4996569B2 (en) | Electronic device and heat transport member | |
| JP2009181215A (en) | Electronic equipment | |
| TWI328736B (en) | Radiation structure for processors | |
| CN108304049A (en) | Laptop heat-dissipation component | |
| CN207294673U (en) | A kind of heat conduction and heat radiation adhesive tape | |
| JPH10107192A (en) | Heat sink | |
| CN208175228U (en) | A kind of combined cooling fin for high-power Surface Mount electronic device | |
| CN208061806U (en) | A kind of dust-proof auxiliary heat-radiating device of transformer | |
| CN206698557U (en) | A kind of heat radiator of electronic element | |
| US20100243204A1 (en) | Heat radiating unit for adapter | |
| JP3151098U (en) | Heat dissipation module | |
| CN219285684U (en) | Notebook heat dissipation module | |
| JP3140181U (en) | Structure of heat dissipation unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |