CN201926189U - Novel efficient heat-exchanging structure for semiconductor refrigerating system - Google Patents
Novel efficient heat-exchanging structure for semiconductor refrigerating system Download PDFInfo
- Publication number
- CN201926189U CN201926189U CN2010206400946U CN201020640094U CN201926189U CN 201926189 U CN201926189 U CN 201926189U CN 2010206400946 U CN2010206400946 U CN 2010206400946U CN 201020640094 U CN201020640094 U CN 201020640094U CN 201926189 U CN201926189 U CN 201926189U
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- water inlet
- base plate
- cover plate
- buckle
- water
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Abstract
A novel efficient heat-exchanging structure for semiconductor refrigerating system comprises an aluminium base plate and an aluminium cover plate, wherein the aluminium base plate is provided with a water inlet and a water outlet for connecting with a water inlet pipe and a water outlet pipe, and the aluminium cover plate is welded or adhered to the base plate to form a sealing cavity. The cover plate is provided with separating boards distributed at intervals to form water channels. Two side edges of each separating board on the cover plate form a continuous concave cambered corrugation structure. The continuous concave cambered corrugation structure formed at the rims of the side edges of the separating boards enables water flow to be more stable and uniform and heat exchanging effect to be better. Additionally, due to the water inlet and the water outlet arranged at both sides of the heat exchanger, a modularized assembly structure can be formed, thereby being applicable to large devices and large systems.
Description
Technical field
The utility model belongs to electronic technology field, is relevant with a kind of new and effective heat converter structure that is used for semiconductor refrigeration system.
Background technology
The heat converter structure of conventional semiconductor refrigeration device comprises a base plate A as Figure 1-3, which is provided with water inlet B and discharge outlet C and connects water inlet pipe and drainpipe; One buckle D, be fastened on and form annular seal space on the base plate, base plate is provided with spaced shelf-shaped E and became aquaporin, the dividing plate E edge of prior art is erose structure so that cross water, during this kind arrangement works, its current are not steady, cooling effect is undesirable, and existing heat exchanger can't modularization, in the use of large-scale device and system as need be used in combination the time, need to connect each interchanger with pipeline, after a plurality of interchanger combinations of prior art, current pass through each interchanger successively, are a kind of cascaded structures, non-uniform temperature on the different heat exchangers, cooling effect is also undesirable.
Summary of the invention
The purpose of this utility model is at prior art problems, and a kind of new and effective heat converter structure that is used for semiconductor refrigeration system is provided, and it is simple in structure, and heat exchange effect is better, but and modularization formation modular construction, the convenient use.
To achieve these goals, solution of the present utility model is:
A kind of new and effective heat converter structure that is used for semiconductor refrigeration system comprises an aluminum base, which is provided with water inlet and delivery port and connects water inlet pipe and drainpipe; One aluminum buckle welds or is adhesive in and forms annular seal space on the base plate, and buckle is provided with spaced dividing plate and formed aquaporin, and the dividing plate dual-side on the described buckle is along the ripple struction that forms continuous indent arc.
Described heat exchanger is for to arrange the formation modular construction in turn by base plate, and described water inlet pipe connects the water inlet of base plate in the outside and the delivery port of homonymy or opposite side base plate, and described base plate water inlet and delivery port joint are provided with seal.
Adopt technique scheme, the utility model is because the dividing plate dual-side along the ripple struction that forms continuous indent arc, makes current more steady, current are more even, heat exchange effect is better, in addition, because each radiator both sides is equipped with into, discharge outlet, can form modular modular construction, after the combination of a plurality of interchangers, the water that is flow to by water inlet is parallel to pass through each interchanger simultaneously, is a kind of parallel-connection structure, temperature uniformity on the different interchangers is fit to big device and big system uses.
Description of drawings
Fig. 1 is the utility model prior art constructions schematic diagram one;
Fig. 2 is the utility model prior art constructions schematic diagram two;
Fig. 3 is the utility model prior art constructions schematic diagram three;
Fig. 4 is the perspective view of the utility model embodiment;
Fig. 5 is the planar structure schematic diagram of the utility model embodiment;
Decomposing schematic representation when Fig. 6 is the combination of the utility model embodiment;
Schematic diagram when Fig. 7 is two combinations of the utility model embodiment;
Schematic diagram when Fig. 8 is three combinations of the utility model embodiment;
Schematic diagram when Fig. 9 is four combinations of the utility model embodiment;
Schematic diagram when Figure 10 is five combinations of the utility model embodiment.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further specified.
As Fig. 4-shown in Figure 9, a kind of new and effective heat converter structure that is used for semiconductor refrigeration system comprises an aluminum base 1, which is provided with water inlet 11 and delivery port 12 connects water inlet pipe and drainpipes; One aluminum buckle 2 welds or is adhesive in and forms annular seal space on the base plate, and buckle is provided with spaced dividing plate 21 and formed aquaporin, and the dividing plate dual-side on the described buckle is along the ripple struction that forms continuous indent arc.
In actual the use, described heat exchanger can form modular modular construction, for arranging the formation modular construction in turn by base plate, the water inlet of the base plate outside described water inlet pipe connects and the delivery port of homonymy or opposite side base plate, described base plate water inlet and delivery port joint are provided with seal.
The utility model is owing to the ripple struction of dividing plate dual-side along the continuous indent arc of formation, make current more steady, current are more even, and heat exchange effect is better, in addition, because each radiator both sides is equipped with into, discharge outlet, can form modular modular construction, after a plurality of interchanger combinations, parallel each interchanger that passes through simultaneously of the water that flows to by water inlet, be a kind of parallel-connection structure, the temperature uniformity on the different interchangers is fit to big device and big system uses.
Claims (2)
1. a new and effective heat converter structure that is used for semiconductor refrigeration system comprises an aluminum base, which is provided with water inlet and discharge outlet and connects water inlet pipe and outlet pipe; One aluminum buckle welds or is adhesive in and forms annular seal space on the base plate, and buckle is provided with spaced dividing plate and formed aquaporin, it is characterized in that: the dividing plate dual-side on the described buckle is along the ripple struction that forms continuous indent arc.
2. a kind of new and effective heat converter structure that is used for semiconductor refrigeration system as claimed in claim 1, it is characterized in that: described heat exchanger forms modular construction for being arranged in turn by base plate, the water inlet of the base plate outside described water inlet pipe connects and the delivery port of homonymy or opposite side base plate, described base plate water inlet and delivery port joint are provided with seal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206400946U CN201926189U (en) | 2010-11-30 | 2010-11-30 | Novel efficient heat-exchanging structure for semiconductor refrigerating system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206400946U CN201926189U (en) | 2010-11-30 | 2010-11-30 | Novel efficient heat-exchanging structure for semiconductor refrigerating system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201926189U true CN201926189U (en) | 2011-08-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206400946U Expired - Fee Related CN201926189U (en) | 2010-11-30 | 2010-11-30 | Novel efficient heat-exchanging structure for semiconductor refrigerating system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201926189U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105318597A (en) * | 2014-07-07 | 2016-02-10 | 现代自动车株式会社 | Thermo-electric device heat exchanger |
-
2010
- 2010-11-30 CN CN2010206400946U patent/CN201926189U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105318597A (en) * | 2014-07-07 | 2016-02-10 | 现代自动车株式会社 | Thermo-electric device heat exchanger |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110810 Termination date: 20161130 |