CN201918368U - Chemical mechanical lapping testing equipment - Google Patents
Chemical mechanical lapping testing equipment Download PDFInfo
- Publication number
- CN201918368U CN201918368U CN2010206443212U CN201020644321U CN201918368U CN 201918368 U CN201918368 U CN 201918368U CN 2010206443212 U CN2010206443212 U CN 2010206443212U CN 201020644321 U CN201020644321 U CN 201020644321U CN 201918368 U CN201918368 U CN 201918368U
- Authority
- CN
- China
- Prior art keywords
- lapping
- testing equipment
- grinding
- lapping liquid
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010206443212U CN201918368U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical lapping testing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010206443212U CN201918368U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical lapping testing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201918368U true CN201918368U (en) | 2011-08-03 |
Family
ID=44418158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010206443212U Expired - Fee Related CN201918368U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical lapping testing equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201918368U (en) |
-
2010
- 2010-12-06 CN CN2010206443212U patent/CN201918368U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130325 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130325 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110803 Termination date: 20181206 |
|
CF01 | Termination of patent right due to non-payment of annual fee |