CN201918368U - Chemical mechanical lapping testing equipment - Google Patents
Chemical mechanical lapping testing equipment Download PDFInfo
- Publication number
- CN201918368U CN201918368U CN2010206443212U CN201020644321U CN201918368U CN 201918368 U CN201918368 U CN 201918368U CN 2010206443212 U CN2010206443212 U CN 2010206443212U CN 201020644321 U CN201020644321 U CN 201020644321U CN 201918368 U CN201918368 U CN 201918368U
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- China
- Prior art keywords
- lapping
- testing equipment
- grinding
- lapping liquid
- wafer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model provides chemical mechanical lapping testing equipment which comprises an adsorption table, a plurality of lapping heads distributed above the adsorption table, and a plurality of lapping liquid supply pipes respectively corresponding to the lapping heads; and a lapping pad is fixed on each lapping head. The chemical mechanical lapping testing equipment can conduct a plurality of chemical mechanical lapping tests with different lapping force, different lapping liquid types or different lapping liquid flow rates on a same wafer, thus effectively saving cost, and simultaneously saving testing time.
Description
Technical field
The utility model relates to semiconductor machinery field of milling, particularly a kind of cmp testing equipment.
Background technology
Along with the develop rapidly of very lagre scale integrated circuit (VLSIC) ULSI (Ultra Large Scale Integration), integrated circuit fabrication process becomes and becomes increasingly complex with meticulous.In order to improve integrated level, reduce manufacturing cost, the characteristic size of element (Feature Size) constantly diminishes, number of elements in the chip unit are constantly increases, plane routing has been difficult to satisfy the requirement that the element high density distributes, can only adopt polylaminate wiring technique to utilize the vertical space of chip, further improve the integration density of device.But the application of polylaminate wiring technique can cause substrate surface uneven, and is extremely unfavorable to graphic making, for this reason, often need carry out flattening surface (Planarization) to substrate and handle.At present, chemical mechanical milling method (CMP, Chemical Mechanical Polishing) be the best approach of reaching overall planarization, especially after semiconductor fabrication process entered sub-micron (sub-micron) field, it had become an indispensable manufacture craft technology.
Cmp (CMP) is to utilize the chemical solution and the finished surface generation chemical reaction that are mixed with minimum abrasive particle to change its surperficial valence bond, generate the product of mechanically removing easily, remove chemical reactant through mechanical friction again and obtain ultra-smooth undamaged planarized surface.In the prior art for accurately being held in when carrying out cmp with a kind of deposit film on the wafer, use different types of lapping liquid or use of the influence of the lapping liquid of different in flow rate, need on the cmp testing equipment, do test usually grinding rate.The cmp testing equipment of prior art comprises: the turntable of grinding pad is posted on the surface, a plurality of grinding heads and a plurality of lapping liquid supply pipe that corresponds respectively to the conveying lapping liquid of each grinding head.During grinding, adsorbing wafer to be ground on each described grinding head, to be ground that makes wafer to be ground towards described turntable; Each lapping liquid supply pipe is supplied to the lapping liquid of different types of lapping liquid or identical type different in flow rate on the grinding pad of corresponding grinding head region; Grinding head applies downward pressure, and wafer to be ground is pressed onto on the grinding pad; The turntable that grinding pad is posted on the surface rotates under the drive of motor, and grinding head also rotates in the same way, realizes mechanical lapping.Treat to measure the grinding effect of absorption wafer on each grinding head, thereby evaluate and test the influence to grinding effect of the lapping liquid of various types of lapping liquids or different in flow rate through after the grinding of certain hour.
But it is just passable that the cmp testing equipment of prior art once need be ground several pieces wafers in use simultaneously, thereby cost is higher, consuming time also very long, once can only grind 2 to 3 wafers simultaneously on turntable at most.
The utility model content
The technical problems to be solved in the utility model provides a kind of cmp testing equipment, and is higher with the cmp testing equipment use cost that solves prior art, length consuming time, and the limited problem of the wafer number of testing simultaneously.
For solving the problems of the technologies described above, the utility model provides a kind of cmp testing equipment, comprising: absorptive table is distributed in a plurality of grinding heads, a plurality of lapping liquid supply pipe that corresponds respectively to each described grinding head of described absorptive table top; Be fixed with grinding pad on the described grinding head.
Optionally, described grinding pad adheres on the described grinding head.
Optionally, described absorptive table is the vacuum suction platform.
Optionally, also can comprise wafer transferring arm and deionized water feed tube.
Whenever carrying out a kind of grinding test of grinding dynamics, lapping liquid kind and lapping liquid flow velocity in the prior art just needs to use a wafer, and can only test two wafer simultaneously at most when testing at every turn.Cmp testing equipment of the present utility model can be carried out the cmp test of multinomial different grinding dynamics, different lapping liquid kind or different lapping liquid flow velocitys on a wafer, therefore effectively provide cost savings, and has saved the testing time simultaneously.
Description of drawings
Fig. 1 is the structural representation of cmp testing equipment of the present utility model.
Embodiment
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
Cmp testing equipment of the present utility model can be widely used in multiple field; and can utilize multiple substitute mode to realize; be to be illustrated below by preferred embodiment; certainly the utility model is not limited to this specific embodiment, and the known general replacement of one of ordinary skilled in the art is encompassed in the protection range of the present utility model far and away.
Secondly, the utility model utilizes schematic diagram to describe in detail, and when the utility model embodiment was described in detail in detail, for convenience of explanation, schematic diagram disobeyed that general ratio is local amplifies, should be with this as to qualification of the present utility model.
Please referring to Fig. 1, Fig. 1 is the structural representation of cmp testing equipment of the present utility model.As shown in Figure 1, cmp testing equipment of the present utility model comprises: absorptive table 100 is distributed in a plurality of grinding heads 110 of described absorptive table 100 tops, a plurality of lapping liquid supply pipe 120 that corresponds respectively to the conveying lapping liquid of each described grinding head 110; Described absorptive table 100 is used to adsorb wafer; Be fixed with grinding pad on the described grinding head 110.Described grinding pad is fixed in mode on the described grinding head 110 for grinding pad is adhered on the grinding head.Described absorptive table 100 is the vacuum suction platform, and the mode of its absorption wafer is a vacuum suction.
Cmp testing equipment of the present utility model also can comprise wafer transferring arm 130 and deionized water feed tube (not shown).Described wafer transferring arm is used for transmitting wafer on described absorptive table; The wafer that described deionized water feed tube is used on described absorptive table is carried deionized water.
Cmp testing equipment of the present utility model at first is sent to wafer on the absorptive table by the wafer transferring arm in use, makes to be ground of wafer towards grinding head; The a plurality of grinding heads that then are distributed in the absorptive table top are started working successively, grind in certain zone during each grinding head work on wafer, different grinding heads are the different abrasive areas of correspondence on wafer, and different grinding heads can select to use different grinding dynamics; A certain grinding head is mated the abrasive areas supply lapping liquid of lapping liquid supply pipe this grinding head on wafer of use when work, the type or the flow velocity of the lapping liquid that the pairing lapping liquid feed tube of different grinding heads is carried are different; After each grinding head was finished grinding, the deionized water feed tube was delivered to deionized water on the wafer, lapping liquid on the wafer and grinding of particulate is rinsed well, and then begun the grinding work of next grinding head.
Whenever carrying out a kind of grinding test of grinding dynamics, lapping liquid kind and lapping liquid flow velocity in the prior art just needs to use a wafer, and can only test two wafer simultaneously at most when testing at every turn.Cmp testing equipment of the present utility model can be carried out the cmp test of multinomial different grinding dynamics, different lapping liquid kind or different lapping liquid flow velocitys on a wafer, therefore effectively provide cost savings, and has saved the testing time simultaneously.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (4)
1. a cmp testing equipment is characterized in that, comprising: absorptive table is distributed in a plurality of grinding heads, a plurality of lapping liquid supply pipe that corresponds respectively to each described grinding head of described absorptive table top; Be fixed with grinding pad on the described grinding head.
2. cmp testing equipment as claimed in claim 1 is characterized in that described grinding pad adheres on the described grinding head.
3. cmp testing equipment as claimed in claim 1 is characterized in that, described absorptive table is the vacuum suction platform.
4. cmp testing equipment as claimed in claim 1 is characterized in that, also can comprise wafer transferring arm and deionized water feed tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206443212U CN201918368U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical lapping testing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206443212U CN201918368U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical lapping testing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201918368U true CN201918368U (en) | 2011-08-03 |
Family
ID=44418158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206443212U Expired - Fee Related CN201918368U (en) | 2010-12-06 | 2010-12-06 | Chemical mechanical lapping testing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201918368U (en) |
-
2010
- 2010-12-06 CN CN2010206443212U patent/CN201918368U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130325 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130325 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110803 Termination date: 20181206 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |