CN201904374U - 发光二极管结构 - Google Patents
发光二极管结构 Download PDFInfo
- Publication number
- CN201904374U CN201904374U CN2010205580797U CN201020558079U CN201904374U CN 201904374 U CN201904374 U CN 201904374U CN 2010205580797 U CN2010205580797 U CN 2010205580797U CN 201020558079 U CN201020558079 U CN 201020558079U CN 201904374 U CN201904374 U CN 201904374U
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- light emitting
- epoxy resin
- diode structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Led Device Packages (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205580797U CN201904374U (zh) | 2010-10-12 | 2010-10-12 | 发光二极管结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010205580797U CN201904374U (zh) | 2010-10-12 | 2010-10-12 | 发光二极管结构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201904374U true CN201904374U (zh) | 2011-07-20 |
Family
ID=44274967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010205580797U Expired - Lifetime CN201904374U (zh) | 2010-10-12 | 2010-10-12 | 发光二极管结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201904374U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103904201A (zh) * | 2012-12-25 | 2014-07-02 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管组合 |
-
2010
- 2010-10-12 CN CN2010205580797U patent/CN201904374U/zh not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103904201A (zh) * | 2012-12-25 | 2014-07-02 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管组合 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: BEIJING YANDONG MICROELECTRNIC CO.,LTD. Free format text: FORMER OWNER: BEIJING JILE ELECTRONICS GROUP CO., LTD. Effective date: 20141127 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100016 CHAOYANG, BEIJING TO: 100015 CHAOYANG, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141127 Address after: 100015 Beijing city Chaoyang District Dongzhimen West eight room Wanhong No. 2 West Street Patentee after: Beijing Yandong Microelectronic Co., Ltd. Address before: 100016 No. 5 South Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: Beijing Jile Electronics Group Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20110720 |
|
CX01 | Expiry of patent term |