CN201830547U - Ceramic printed circuit board - Google Patents

Ceramic printed circuit board Download PDF

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Publication number
CN201830547U
CN201830547U CN201020580281XU CN201020580281U CN201830547U CN 201830547 U CN201830547 U CN 201830547U CN 201020580281X U CN201020580281X U CN 201020580281XU CN 201020580281 U CN201020580281 U CN 201020580281U CN 201830547 U CN201830547 U CN 201830547U
Authority
CN
China
Prior art keywords
circuit board
ceramic
printed circuit
printed
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201020580281XU
Other languages
Chinese (zh)
Inventor
不公告发明人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DUJIANGYAN CITY SANMEI TECHNOLOGY Co Ltd
Original Assignee
DUJIANGYAN CITY SANMEI TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DUJIANGYAN CITY SANMEI TECHNOLOGY Co Ltd filed Critical DUJIANGYAN CITY SANMEI TECHNOLOGY Co Ltd
Priority to CN201020580281XU priority Critical patent/CN201830547U/en
Application granted granted Critical
Publication of CN201830547U publication Critical patent/CN201830547U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a ceramic printed circuit board, which comprises a ceramic substrate with electrical insulation performance, wherein the ceramic substrate is made of ceramic material. The ceramic printed circuit board is characterized by also comprising a silver colloid layer printed with circuit patterns, and the silver colloid layer is a dried printed coating and is also provided with a nano glaze layer with the electrical insulation performance. The ceramic printed circuit board has better insulation performance and is more dust-proof.

Description

Ceramic printed-circuit board
Technical field
The utility model relates to a kind of ceramic printed-circuit board.
Background technology
The dustproof effect of existing circuit board is bad, and grown service time, can influence the normal operation of machine, and is clear also very inconvenient.
Summary of the invention
The utility model is at market the problems referred to above, the technical scheme of taking is: a kind of ceramic printed-circuit board, comprise: one has the ceramic substrate of electrical insulating property, make by ceramic material, it is characterized in that: comprise that also one is printed with circuit pattern elargol layer, the elargol layer is the printing coating of oven dry, has the nanometer glaze layer of electrical insulating property on the elargol layer in addition.
Here nanometer glaze layer is used for covering elargol layer and electrical equipment original paper, in order to the electric insulation protection to be provided.Nanometer glaze layer forms for the nano particle sintering.
Insulation property of the present utility model are better, and more dustproof.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
A kind of ceramic printed-circuit board, comprise: one has the ceramic substrate 1 of electrical insulating property, is made by ceramic material, it is characterized in that: comprise that also one is printed with circuit pattern elargol layer 2, the elargol layer is the printing coating of oven dry, has the nanometer glaze layer 3 of electrical insulating property on the elargol layer in addition.

Claims (1)

1. ceramic printed-circuit board, comprise: one has the ceramic substrate of electrical insulating property, is made by ceramic material, it is characterized in that: comprise that also one is printed with circuit pattern elargol layer, the elargol layer is the printing coating of oven dry, has the nanometer glaze layer of electrical insulating property on the elargol layer in addition.
CN201020580281XU 2010-10-28 2010-10-28 Ceramic printed circuit board Expired - Fee Related CN201830547U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020580281XU CN201830547U (en) 2010-10-28 2010-10-28 Ceramic printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020580281XU CN201830547U (en) 2010-10-28 2010-10-28 Ceramic printed circuit board

Publications (1)

Publication Number Publication Date
CN201830547U true CN201830547U (en) 2011-05-11

Family

ID=43969057

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201020580281XU Expired - Fee Related CN201830547U (en) 2010-10-28 2010-10-28 Ceramic printed circuit board

Country Status (1)

Country Link
CN (1) CN201830547U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108546160A (en) * 2018-06-15 2018-09-18 北京梦之墨科技有限公司 A kind of ceramic base circuit and preparation method thereof
CN109392239A (en) * 2018-09-29 2019-02-26 江苏芯力特电子科技有限公司 A kind of heat-resisting flame-retardant ceramic printed-circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108546160A (en) * 2018-06-15 2018-09-18 北京梦之墨科技有限公司 A kind of ceramic base circuit and preparation method thereof
CN109392239A (en) * 2018-09-29 2019-02-26 江苏芯力特电子科技有限公司 A kind of heat-resisting flame-retardant ceramic printed-circuit board
CN109392239B (en) * 2018-09-29 2021-01-08 江苏芯力特电子科技有限公司 Heat-resistant flame-retardant ceramic printed circuit board

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110511

Termination date: 20111028