CN201804320U - Hot plug type BMC upgrade module - Google Patents

Hot plug type BMC upgrade module Download PDF

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Publication number
CN201804320U
CN201804320U CN2010205005047U CN201020500504U CN201804320U CN 201804320 U CN201804320 U CN 201804320U CN 2010205005047 U CN2010205005047 U CN 2010205005047U CN 201020500504 U CN201020500504 U CN 201020500504U CN 201804320 U CN201804320 U CN 201804320U
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CN
China
Prior art keywords
plug
mainboard
upgrade
plug division
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205005047U
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Chinese (zh)
Inventor
彭培栋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitac International Corp
Original Assignee
Mitac International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac International Corp filed Critical Mitac International Corp
Priority to CN2010205005047U priority Critical patent/CN201804320U/en
Application granted granted Critical
Publication of CN201804320U publication Critical patent/CN201804320U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a hot plug type BMC upgrade module. The hot plug type BMC upgrade module is plugged into a mainboard of a computer device, and a first plug-in part is arranged on the mainboard. The hot plug type BMC upgrade module comprises a storage module and a second plug-in part, wherein an upgrade password is stored in the storage module; the second plug-in part is plugged and matched with the first plug-in part, and when the second plug-in part is plugged and matched with the first plug-in part, the mainboard reads the upgrade password and keeps an upgrade state; and when the second plug-in part is detached from the first plug-in part, the mainboard keeps a VGA state. The utility model changes the plug-in state between the hot plug type BMC upgrade module and the mainboard to realize different BMC functions; the mainboard keeps the upgrade state in case of plug-in connection and an original state in case of non-plug-in connection; and the BMC upgrade function is realized only by virtue of plug-in operation, so that the operation process is very simple.

Description

The hot swap type BMC module of upgrading
[technical field]
The utility model relates to a kind of hot swap type BMC upgrading module, the simple hot swap type BMC upgrading of particularly a kind of operating process module.
[background technology]
Existing BMC (Baseboard Management Controller) function is divided three kind: VGA, IPMI, iKVM.The user wants to be upgraded to IPMI or IKVM from the state of VGA, or IPMI is upgraded to iKVM, present way is to ask the user to provide SN number of mainboard to manufacturer, manufacturer calculates two passwords according to SN number according to cryptographic algorithm and supports IPMI and IKVM respectively then, and manufacturer provides corresponding password according to user's demand.The shortcoming of this way is: one, operating process is loaded down with trivial details.Two, keep this follow-up service, wasting manpower and material resources's resource.
[summary of the invention]
Fundamental purpose of the present utility model is to provide the simple hot swap type BMC upgrading of a kind of operating process module.
The utility model provides a kind of hot swap type BMC upgrading module, it is inserted on the mainboard of computer apparatus, and described mainboard is provided with first Plug Division, and described hot swap type BMC upgrading module comprises the memory module and second Plug Division, wherein, described memory module stored upgrade cipher; Pegging graft with described first Plug Division and cooperate in described second Plug Division, pegs graft when cooperating in second Plug Division and first Plug Division, and mainboard reads upgrade cipher and keeps upgrade status; And when second Plug Division and the disengaging of first Plug Division, mainboard keeps the VGA state.
Compared with prior art, the utility model changes inserting state between hot swap type BMC upgrading module and the mainboard to realize different BMC functions, during grafting, mainboard keeps upgrade status, and when not pegging graft, mainboard keeps virgin state, and upgrading BMC function only can realize just that by means of the operation of pegging graft operating process is very simple.
[description of drawings]
User mode figure when Fig. 1 is the utility model hot swap type BMC upgrading module and mainboard disengaging.
Fig. 2 is the user mode figure of the utility model hot swap type BMC upgrading module when cooperating with the mainboard grafting.
[embodiment]
See also Figure 1 and Figure 2, the utility model provides a kind of hot swap type BMC upgrading module 10, it is inserted on the mainboard 20 of computer apparatus, and described mainboard 20 is provided with first Plug Division 21, and described hot swap type BMC upgrading module 10 comprises the memory module 11 and second Plug Division 12, wherein, and described memory module 11 stored upgrade cipher, in present embodiment, upgrade cipher is IPMI password or IKVM password; Pegging graft with described first Plug Division 21 and cooperate in described second Plug Division 12, pegs graft when cooperating in second Plug Division 12 and first Plug Division 21, and mainboard 20 reads upgrade cipher and keeps upgrade status; And when second Plug Division 12 and 21 disengagings of first Plug Division, mainboard 20 keeps the VGA states.When described upgrade cipher is the IPMI password, described upgrade status is the IPMI state; When described upgrade cipher is the IKVM password, described upgrade status is the IKVM state.In addition, for the circuit structure of avoiding memory module 11 is exposed, can outside described memory module 11, be provided with clad (figure does not show).
The utility model changes inserting state between hot swap type BMC upgrading module 10 and the mainboard 20 to realize different BMC functions, when BMC upgrading module 10 is plugged to mainboard 20, mainboard 20 keeps upgrade status, and BMC upgrading module 10 is not when being plugged to mainboard 20, mainboard 20 keeps virgin state, upgrading BMC function only can realize just that by means of the operation of pegging graft operating process is very simple.

Claims (4)

1. hot swap type BMC upgrading module, it is inserted on the mainboard of computer apparatus, and described mainboard is provided with first Plug Division, it is characterized in that described hot swap type BMC upgrading module comprises:
Memory module, its stored upgrade cipher;
Second Plug Division, it is pegged graft with described first Plug Division and cooperates, and pegs graft when cooperating in second Plug Division and first Plug Division, and mainboard reads upgrade cipher and keeps upgrade status; And when second Plug Division and the disengaging of first Plug Division, mainboard keeps the VGA state.
2. hot swap type BMC upgrading module according to claim 1, it is characterized in that: described upgrade cipher is the IPMI password, described upgrade status is the IPMI state.
3. hot swap type BMC upgrading module according to claim 1, it is characterized in that: described upgrade cipher is the IKVM password, described upgrade status is the IKVM state.
4. hot swap type BMC upgrading module according to claim 1, it is characterized in that: described memory module is provided with clad outward.
CN2010205005047U 2010-08-20 2010-08-20 Hot plug type BMC upgrade module Expired - Fee Related CN201804320U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205005047U CN201804320U (en) 2010-08-20 2010-08-20 Hot plug type BMC upgrade module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205005047U CN201804320U (en) 2010-08-20 2010-08-20 Hot plug type BMC upgrade module

Publications (1)

Publication Number Publication Date
CN201804320U true CN201804320U (en) 2011-04-20

Family

ID=43873822

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205005047U Expired - Fee Related CN201804320U (en) 2010-08-20 2010-08-20 Hot plug type BMC upgrade module

Country Status (1)

Country Link
CN (1) CN201804320U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150169310A1 (en) * 2013-12-12 2015-06-18 Lenovo (Singapore) Pte, Ltd. Maintaining firmware
CN113886307A (en) * 2021-09-30 2022-01-04 阿里巴巴(中国)有限公司 Thermal maintenance method and system for BMC module, server mainboard and BMC module

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150169310A1 (en) * 2013-12-12 2015-06-18 Lenovo (Singapore) Pte, Ltd. Maintaining firmware
CN113886307A (en) * 2021-09-30 2022-01-04 阿里巴巴(中国)有限公司 Thermal maintenance method and system for BMC module, server mainboard and BMC module

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110420

Termination date: 20150820

EXPY Termination of patent right or utility model