CN201781464U - Wafer type quartz crystal resonator - Google Patents
Wafer type quartz crystal resonator Download PDFInfo
- Publication number
- CN201781464U CN201781464U CN2010205316900U CN201020531690U CN201781464U CN 201781464 U CN201781464 U CN 201781464U CN 2010205316900 U CN2010205316900 U CN 2010205316900U CN 201020531690 U CN201020531690 U CN 201020531690U CN 201781464 U CN201781464 U CN 201781464U
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- CN
- China
- Prior art keywords
- quartz crystal
- ceramic
- crystal resonator
- wafer
- type quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The utility model relates a wafer type quartz crystal resonator, which is manufactured by the following steps of: coating a layer of sound-absorbing glue on a ceramic pedestal; pasting a quartz crystal wafer on the sound-absorbing glue; welding an inner lead; covering a ceramic cap; and sealing and connecting the ceramic cap and the ceramic pedestal with epoxy resin or metal. The layer of sound-absorbing glue is coated between the ceramic pedestal and the quartz crystal wafer, thereby avoiding the hard contact between the ceramic pedestal and the quartz crystal wafer, greatly cushioning the influence of the vibration on the quartz crystal wafer, and greatly enhancing the vibration resistant performance of the wafer type quartz crystal resonator.
Description
Affiliated technical field
The utility model relates to the high-frequency crystal resonator that a kind of modern information technologies are used, especially a kind of sheet type quartz crystal resonator with good resistance shock stability.
Background technology
In recent years, high speed development along with the modern information technologies industry, the electronic information machine product is to little, light, thinning development, the various electronic devices and components that match with it also develop to microminaturization, chip type, surface mount direction rapidly thereupon, to adapt to the needs of complete machine production and assembly automation, quartz-crystal resonator has high these characteristics of frequency stabilization because of it, and is widely used in this industry.At present, the encapsulation of quartz-crystal resonator, be that quartz wafer is fixed on the base of ceramic, welding lead and encapsulate then with ceramic cap, this quartz-crystal resonator of making, because between quartz wafer and the base of ceramic is hard the contact, they are Inorganic Non-metallic Materials all, the rupture strength of quartz wafer and base of ceramic is all relatively poor, some vibration is arranged slightly, just might cause the quartz wafer damage, so its anti-seismic performance is relatively poor, particularly present portable electronic complete machine, it more requires its components and parts to have good anti-seismic performance.
Summary of the invention
In order to overcome the existing relatively poor deficiency of quartz-crystal resonator product anti-seismic performance, the utility model provides a kind of sheet type quartz crystal resonator, and this resonator can not only produce stable high-frequency signal, and has better anti.
The technical scheme that its technical problem that solves the utility model adopts is: be coated with last layer sound absorption glue on base of ceramic earlier, again quartz wafer is sticked on the sound absorption glue, weld lead then, ceramic cap on the cover, between ceramic cap and the base of ceramic with the epoxy resin or the sealing-in of metallizing.
The beneficial effects of the utility model are, owing between quartz wafer and base of ceramic, scribble one deck sound absorption glue, thereby avoided hard contact the between quartz wafer and the base of ceramic, thereby greatly buffering vibration is to the influence of quartz wafer, has improved the anti-shake performance of sheet type quartz crystal resonator greatly.
Description of drawings
Below in conjunction with drawings and Examples the utility model is further specified.
Fig. 1 is a structural representation of the present utility model.
Among the figure: 1, base of ceramic; 2, sound absorption glue; 3, quartz wafer; 4, lead; 5, ceramic cap.
Embodiment
As shown in the figure, on base of ceramic (1), be coated with one deck sound absorption glue (2) earlier, quartz wafer (3) is sticked on the sound absorption glue (2), welding lead (4), ceramic cap on the cover (5), between ceramic cap (5) and the base of ceramic (1) with the epoxy resin or the sealing-in of metallizing.
Claims (1)
1. sheet type quartz crystal resonator, it is to go up closed assembly quartz wafer (3) at base of ceramic (1), welding lead (4), ceramic cap on the cover (5) is characterized in that: scribble one deck glue (2) that absorbs sound between base of ceramic (1) and the quartz wafer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205316900U CN201781464U (en) | 2010-09-14 | 2010-09-14 | Wafer type quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205316900U CN201781464U (en) | 2010-09-14 | 2010-09-14 | Wafer type quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201781464U true CN201781464U (en) | 2011-03-30 |
Family
ID=43794665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205316900U Expired - Fee Related CN201781464U (en) | 2010-09-14 | 2010-09-14 | Wafer type quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201781464U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185753A (en) * | 2015-08-13 | 2015-12-23 | 北京中科飞鸿科技有限公司 | Single bare surface acoustic wave chip miniaturized package based on LTCC technology |
-
2010
- 2010-09-14 CN CN2010205316900U patent/CN201781464U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105185753A (en) * | 2015-08-13 | 2015-12-23 | 北京中科飞鸿科技有限公司 | Single bare surface acoustic wave chip miniaturized package based on LTCC technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110330 Termination date: 20150914 |
|
| EXPY | Termination of patent right or utility model |