CN201773829U - Pickup device for die bonder - Google Patents
Pickup device for die bonder Download PDFInfo
- Publication number
- CN201773829U CN201773829U CN2010201995866U CN201020199586U CN201773829U CN 201773829 U CN201773829 U CN 201773829U CN 2010201995866 U CN2010201995866 U CN 2010201995866U CN 201020199586 U CN201020199586 U CN 201020199586U CN 201773829 U CN201773829 U CN 201773829U
- Authority
- CN
- China
- Prior art keywords
- thimble
- die bonder
- pressure
- chip
- pickup device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a pickup device for a die bonder. The pickup device comprises a sucker, a thimble and a thimble seat, wherein the thimble is placed on the thimble seat; and a pressure detection device is arranged on the thimble seat. In the process of jacking up a chip on a blue tape by using the thimble, a transmission rod is contacted with the body of the die bonder to generate and transmit a pressure to a pressure sensor; and the pressure sensor converts the pressure into an electric signal and outputs the electric signal to a control device. When the pressure exceeds a set value, a control device sends a signal to control the pickup device of the die bonder to shut down, so as to ensure that the chip cannot be damaged by the thimble and improve the rate of finished products.
Description
Technical field
The utility model relates to a kind of pick-up unit, specifically, relates to a kind of die Bonder pick-up unit, belongs to electronic technology field.
Background technology
At present, in the production process of electronic device, need to use the die Bonder pick-up unit to pick up chip, during operation, the thimble of die Bonder pick-up unit breaks away from the edge of chip and blue film the chip jack-up that upwards will place under the active force of thimble seat on the blue film, has reduced the suction between chip and the blue film, at this moment, suction nozzle is picked up chip fast.In this process, if the active force of thimble seat is excessive, thimble is easy to chip is pushed up bad, has reduced the rate of finished products of product, has increased production cost.
The utility model content
The technical problems to be solved in the utility model is at above deficiency, and a kind of die Bonder pick-up unit that can detect thimble pressure size, improve rate of finished products is provided.
In order to solve above technical problem, the technical solution adopted in the utility model is as follows: a kind of die Bonder pick-up unit, comprise suction nozzle, thimble and thimble seat, and thimble is placed on the thimble seat, it is characterized in that: described thimble seat is provided with pressure-detecting device.
As further improvement in the technical proposal:
Described pressure-detecting device comprises the pressure sensor and the control device of electrical connection, and pressure sensor is provided with conductive bar.
The utility model is taked above technical scheme; have the following advantages: in the process of thimble with chip jack-up on the blue film; conductive bar contacts with the body of die Bonder; produce a pressure and conduct to pressure sensor; pressure sensor is converted into the signal of telecommunication and exports control device to, and when pressure exceeded set point, control device sent signal controlling die Bonder pick-up unit and shuts down; guarantee that chip can not break by thimble, improved rate of finished products.
The utility model is described in further detail below in conjunction with drawings and Examples.
Description of drawings
Accompanying drawing is the structural representation of die Bonder pick-up unit among the utility model embodiment.
Among the figure,
The 1-suction nozzle, 2-chip, the blue film of 3-, 4-thimble, 5-thimble seat, 6-pressure sensor, 7-conductive bar, 8-control device.
Embodiment
Embodiment, as shown in the figure, a kind of die Bonder pick-up unit, comprise suction nozzle 1, thimble 4 and thimble seat 5, thimble 4 is placed on the thimble seat 5, and thimble seat 5 is provided with pressure-detecting device, pressure-detecting device comprises pressure sensor 6, the control device 8 of electrical connection, pressure sensor 6 is provided with conductive bar 7, and chip 2 is placed on blue film 3 upper surfaces
During operation; thimble 4 is chip 2 jack-up that upwards will place under the effect of thimble seat 5 on the blue film 3; the edge and the blue film 3 of chip 2 are broken away from; reduced the suction between chip 2 and the blue film 3; at this moment; suction nozzle 1 is picked up chip 2 fast; conductive bar 7 contacts with the body of die Bonder in this process; produce a pressure and conduct to pressure sensor; pressure sensor is converted into the signal of telecommunication and exports control device to, and when pressure exceeded set point, control device sent signal controlling die Bonder pick-up unit and shuts down; guarantee that chip can not break by thimble, improved rate of finished products.
Claims (2)
1. a die Bonder pick-up unit comprises suction nozzle (1), thimble (4) and thimble seat (5), and thimble (4) is placed on the thimble seat (5), it is characterized in that: described thimble seat (5) is provided with pressure-detecting device.
2. a kind of die Bonder pick-up unit as claimed in claim 1 is characterized in that: described pressure-detecting device comprises the pressure sensor (6) and the control device (8) of electrical connection, and pressure sensor (6) is provided with conductive bar (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201995866U CN201773829U (en) | 2010-05-24 | 2010-05-24 | Pickup device for die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201995866U CN201773829U (en) | 2010-05-24 | 2010-05-24 | Pickup device for die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201773829U true CN201773829U (en) | 2011-03-23 |
Family
ID=43753672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201995866U Expired - Fee Related CN201773829U (en) | 2010-05-24 | 2010-05-24 | Pickup device for die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201773829U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI485786B (en) * | 2012-04-16 | 2015-05-21 | Gallant Micro Machining Co Ltd | Grain Stripping Method and Device |
| CN104681476A (en) * | 2013-12-02 | 2015-06-03 | 无锡华润安盛科技有限公司 | Chip suction device and chip suction method |
| CN108281373A (en) * | 2017-12-15 | 2018-07-13 | 华灿光电（浙江）有限公司 | A kind of pick device of light-emitting diode chip for backlight unit |
-
2010
- 2010-05-24 CN CN2010201995866U patent/CN201773829U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI485786B (en) * | 2012-04-16 | 2015-05-21 | Gallant Micro Machining Co Ltd | Grain Stripping Method and Device |
| CN104681476A (en) * | 2013-12-02 | 2015-06-03 | 无锡华润安盛科技有限公司 | Chip suction device and chip suction method |
| CN108281373A (en) * | 2017-12-15 | 2018-07-13 | 华灿光电（浙江）有限公司 | A kind of pick device of light-emitting diode chip for backlight unit |
| CN108281373B (en) * | 2017-12-15 | 2020-07-07 | 华灿光电（浙江）有限公司 | Pickup device of light emitting diode chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 Termination date: 20140524 |