CN201741724U - 发光二极管导线架 - Google Patents

发光二极管导线架 Download PDF

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CN201741724U
CN201741724U CN2010202437937U CN201020243793U CN201741724U CN 201741724 U CN201741724 U CN 201741724U CN 2010202437937 U CN2010202437937 U CN 2010202437937U CN 201020243793 U CN201020243793 U CN 201020243793U CN 201741724 U CN201741724 U CN 201741724U
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pin
conducting wire
wire frame
led conducting
protuberance
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钱正清
廖本扬
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Abstract

本实用新型关于一种发光二极管导线架，组装于印刷电路板之上，其包括设有中空功能区的胶座及若干金属接脚。金属接脚间隔暴露于功能区内并延伸至胶座之外。所述金属接脚设有用于插设入印刷电路板中的插脚，该插脚设有凸出部及贯穿凸出部的穿孔。本实用新型发光二极管导线架无需表面焊接，可大幅提高组装的便利性，随插即用而且易于维修及更换。

Description

发光二极管导线架 
【技术领域】
本实用新型涉及一种发光二极管导线架，尤其是一种方便组装及拆卸的发光二极管导线架。 
【背景技术】
发光二极管是一种固态的半导体元件，不同于钨丝灯泡发光原理，属于冷光发光，只需极小电流就可以发光。发光二极管不但具有寿命长、省电、耐用、耐震、牢靠、适合量产、体积小及反应快等优点，更普遍应用在生活中多项产品，如：手机、Personal Digital Assistant(PDA)产品的背光源、信息与消费性电子产品的指示灯、工业仪表设备、汽车用仪表指示灯与煞车灯及大型广告广告牌等。 
现有的发光二极管导线架通常包括胶座、两个金属接脚、发光芯片及二条导线。胶座具有中空状的功能区，金属接脚埋设于胶座中，其中金属接脚部分暴露于功能区底部，部分延伸出胶座相对两侧，并且沿胶座外侧弯折至胶座底面以作为后续制程的接点。 
现有的发光二极管导线架的金属接脚通过焊锡或者其它材料焊接于印刷电路板之上，需要焊接设备或者其它的机械，其制程较为繁琐。在焊接的过程中，会产生大量的热量影响到胶座，使其受热变黄而降低其发光效率，而且还会留下热应力，缩短发光二极管导线架的使用寿命。假设焊接完成的发光二极管导线架在使用过程中出现故障或者损坏时，维修及更换的过程均较为繁琐。 
因此，确有必要对现有的发光二极管导线架进行改进以克服现有技术的前述缺陷。 
【实用新型内容】
本实用新型的目的在于提供一种方便组装及拆卸至印刷电路板的发光二 极管导线架。 
本实用新型的目的是通过以下技术方案实现的：一种发光二极管导线架，组装于印刷电路板之上，其包括：设有中空功能区的胶座及间隔暴露于功能区内的若干金属接脚，该金属接脚设有延伸至胶座外的插脚，该插脚竖直向下延伸并设有插设入印刷电路板中的凸出部及贯穿凸出部的穿孔。 
所述凸出部向插脚宽度方向上的两侧凸伸。所述凸出部水平方向的宽度宽于插脚水平方向的宽度。所述金属接脚还包括安装部及自安装部向胶座外部延伸并向下弯折的弯折部，所述插脚自弯折部向下延伸。所述印刷电路板上设有通孔，所述通孔的侧缘镀有金属层，凸出部抵触金属层。 
本实用新型的目的还可以通过另一种技术方案实现：一种发光二极管导线架，组装于印刷电路板之上，其包括：设有中空功能区的胶座及间隔暴露于功能区内的若干金属接脚，所述金属接脚设有延伸至胶座外的插脚，该插脚设有插设入印刷电路板中的凸出部。 
相较于现有技术，本实用新型发光二极管导线架的金属接脚的插脚无需表面焊接，可直接组装于印刷电路板中，可大幅提高组装的便利性，随插即用而且易于维修及更换。 
【附图说明】
图1为本实用新型发光二极管导线架组装于印刷电路板的立体图。 
图2为本实用新型发光二极管导线架与印刷电路板的分解图。 
图3为本实用新型发光二极管导线架与印刷电路板的部分分解图。 
图4为本实用新型发光二极管导线架的侧视图。 
图5沿图1的A-A线发光二极管导线架组装于印刷电路板的剖视图。 
【具体实施方式】
请参阅图1至图5所示，本实用新型为一种发光二极管导线架100，其包括绝缘的胶座1及固持于胶座1中的一对金属接脚2。该发光二极管导线架100组装于印刷电路板5之上。 
请参阅图2至图4所示，胶座1大致呈长方体结构，通过塑料射出成型于金属接脚2上。胶座1外侧形成外胶壁11，胶座1的中部向下凹设形成中空状的功 能区10，该功能区10为长方形状，也可为圆形状、椭圆形状或其它多边形状。 
本实用新型的金属接脚2通过铜或者铜合金等导电金属以冲压成型方式形成。所述金属接脚2埋设于胶座1中，每一金属接脚2均有部分可见于功能区10的底部。所述金属接脚2包括位于功能区10底部的安装部20、自安装部20向胶座1外部延伸并沿胶座1的外胶壁11向下弯折的一对弯折部21及自弯折部21竖直向下延伸的一对插脚22。其中，发光芯片3组装于其中金属接脚2的上表面，通过导线4将发光芯片3与金属接脚2电性连接。请参阅图4所示，插脚22包括向其宽度方向上的两侧凸伸的凸出部220及贯穿该凸出部220的穿孔221。凸出部220水平方向的宽度宽于插脚22水平方向的宽度。 
请参阅图2及图5所示，印刷电路板5上组装有发光二极管导线架100，印刷电路板5上设有贯穿的通孔50，通孔50的侧缘镀有提供导电功能的金属层500。在进行封装时，将发光二极管导线架100的金属接脚2自上而下***印刷电路板5的通孔50中，在金属接脚2向下移动的过程中，金属接脚2的插脚22的凸出部220受到压力并借助穿孔221的设置产生轻微的变形，当组装完成后，金属接脚2的凸出部220抵触通孔50的金属层500与印刷电路板5产生电性连接，可以有效地将发光二极管导线架100固定于印刷电路板5之上。若在使用发光二极管导线架100的过程中，出现故障或者损坏时，只需将有问题的发光二极管导线架100从印刷电路板5的通孔50中拔出，再更换一颗新的发光二极管导线架100即可。 
本实用新型的发光二极管导线架100的金属接脚2的插脚22直接组装于印刷电路板5的通孔50中，可大幅提高组装的便利性，随插即用而且易于维修及更换。由于发光二极管导线架100采用直插的方式，免除了焊接这一过程，胶座1不会因受热变黄而降低发出光的亮度，也不会留下热应力，从而确保发光二极管导线架100的使用寿命，还可以有效降低发光二极管导线架100整体的高度。 

Claims (10)

1.一种发光二极管导线架，组装于印刷电路板之上，其包括：设有中空功能区的胶座及间隔暴露于功能区内的若干金属接脚，其特征在于：所述金属接脚设有延伸至胶座外的插脚，该插脚竖直向下延伸并设有插设入印刷电路板中的凸出部及贯穿凸出部的穿孔。
2.如权利要求1所述的发光二极管导线架，其特征在于：所述凸出部向插脚宽度方向上的两侧凸伸。
3.如权利要求2所述的发光二极管导线架，其特征在于：所述凸出部水平方向的宽度宽于插脚水平方向的宽度。
4.如权利要求3所述的发光二极管导线架，其特征在于：所述金属接脚还包括安装部及自安装部向胶座外部延伸并向下弯折的弯折部，所述插脚自弯折部向下延伸。
5.如权利要求1所述的发光二极管导线架，其特征在于：所述印刷电路板上设有通孔，所述通孔的侧缘镀有金属层，凸出部抵触金属层。
6.一种发光二极管导线架，组装于印刷电路板之上，其包括：设有中空的功能区的胶座及间隔暴露于功能区内的金属接脚，其特征在于：所述金属接脚设有延伸至胶座外的插脚，该插脚设有插设入印刷电路板中的凸出部。
7.如权利要求6所述的发光二极管导线架，其特征在于：所述凸出部向插脚宽度方向上的两侧凸伸。
8.如权利要求7所述的发光二极管导线架，其特征在于：所述凸出部水平方向的宽度宽于插脚水平方向的宽度。
9.如权利要求8所述的发光二极管导线架，其特征在于：所述插脚还包括贯穿凸出部的穿孔。
10.如权利要求9所述的发光二极管导线架，其特征在于：所述金属接脚还包括安装部及自安装部向胶座外部延伸并向下弯折的弯折部，所述插脚自弯折部向下延伸。
CN2010202437937U 2010-06-30 2010-06-30 发光二极管导线架 Expired - Fee Related CN201741724U (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102683563A (zh) * 2011-03-10 2012-09-19 富士康(昆山)电脑接插件有限公司 发光芯片导线架
CN109931511A (zh) * 2019-01-31 2019-06-25 青鸟半导体科技(铜陵)有限公司 陶瓷基封装led光源组件及其组装工艺

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102683563A (zh) * 2011-03-10 2012-09-19 富士康(昆山)电脑接插件有限公司 发光芯片导线架
CN109931511A (zh) * 2019-01-31 2019-06-25 青鸟半导体科技(铜陵)有限公司 陶瓷基封装led光源组件及其组装工艺
CN109931511B (zh) * 2019-01-31 2020-11-06 青鸟半导体科技(铜陵)有限公司 陶瓷基封装led光源组件及其组装工艺

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