CN201725812U - High heat dissipation Light Emitting Diode (LED) integrated circuit board - Google Patents
High heat dissipation Light Emitting Diode (LED) integrated circuit board Download PDFInfo
- Publication number
- CN201725812U CN201725812U CN2010202332225U CN201020233222U CN201725812U CN 201725812 U CN201725812 U CN 201725812U CN 2010202332225 U CN2010202332225 U CN 2010202332225U CN 201020233222 U CN201020233222 U CN 201020233222U CN 201725812 U CN201725812 U CN 201725812U
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- integrated circuit
- heat
- mounted integrated
- led surface
- layer
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Abstract
The utility model relates to a high heat dissipation Light Emitting Diode (LED) integrated circuit board. The high heat dissipation LED integrated circuit board is in a strip shape, a plurality of strip shapes form a rectangle which can be cut into strip shapes by using a cutter, and a row or a line of LED chips is arranged in the length direction of the rectangle. The LED chips are electrically connected according to the preset structure of the strip-shaped circuit board, and the two ends of the circuit board are respectively connected with a power supply. The utility model has the advantages that an aluminum basic layer (1) using aluminum as raw material on the high heat dissipation LED integrated circuit board has good heat dissipation performance.
Description
Technical field
The utility model belongs to a kind of field of circuit boards, particularly relates to a kind of high-heat-dispersion LED surface-mounted integrated circuit.
Background technology
LED has been widely used in aspects such as LED liquid crystal display, LED illumination, ad decoration at present, advantage such as with respect to conventional light source, that LED has is energy-conservation, life-span length, environmental protection, low energy are efficient.
The area of existing led circuit plate is little, produces better function again, makes product produce a large amount of thermals source, is unfavorable for the heat radiation of product.
Summary of the invention
This practical full mold purpose is to overcome above-mentioned weak point of the prior art and a kind of high-heat-dispersion LED surface-mounted integrated circuit is provided.
The utility model is realized in the following way:
A kind of high-heat-dispersion LED surface-mounted integrated circuit, it is characterized in that: described high-heat-dispersion LED surface-mounted integrated circuit is strip, a plurality of strips are formed square, the slitting shape of rectangular-shaped available cutting knife, its length direction is provided with a row or a row led chip, preset structure according to described strip circuit board between the described led chip is electrically connected, and the two ends of described circuit board connect power supply respectively.
Described high-heat-dispersion LED surface-mounted integrated circuit includes aluminum base layer 1, insulating barrier 2, copper coin layer 3, pcb layer 4, skin of paint 5, label layer 6; Aluminum base layer 1 is located at bottom, and insulating barrier 2 is located on the aluminum base layer 1, and copper coin layer 3 is located on the insulating barrier 2, and pcb layer 4 is located on the copper coin layer 3, and skin of paint 5 is located on the pcb layer 4, and label layer 6 is located on the skin of paint 5.
The two ends of described high-heat-dispersion LED surface-mounted integrated circuit are respectively equipped with the plug connector that is used for connecting power supply.
Wire connecting power is passed through at the two ends of described high-heat-dispersion LED surface-mounted integrated circuit respectively.
Described high-heat-dispersion LED surface-mounted integrated circuit is provided with the position, hole that the LED light fixture is installed.
Product is installed on the mounting hole site that the high-heat-dispersion LED surface-mounted integrated circuit is provided with, and can produce heat energy because product works long hours, and heat energy can not in time be discharged and can be produced adverse influence to product, and product is shortened useful life.From heat dispersion, copper, aluminium are best, secondly are steel, are cast iron once more.If copper, steel are used on the circuit board as heat sink material, then the cost of entire circuit plate can be wasted more than aluminium.
The utility model advantage is: have good performance of heat dissipation by aluminium as raw-material aluminum base layer 1 on the high-heat-dispersion LED surface-mounted integrated circuit.
Description of drawings
Fig. 1 the utility model structural representation;
The inner decomposition face in A place in Fig. 2 the utility model structure chart 1;
Embodiment
Now in conjunction with the accompanying drawings, the utility model embodiment is described in detail in detail:
As shown in Figure 1 and Figure 2, a kind of high-heat-dispersion LED surface-mounted integrated circuit, it is characterized in that: described high-heat-dispersion LED surface-mounted integrated circuit is strip, a plurality of strips are formed rectangle, the slitting shape of rectangular-shaped available cutting knife, its length direction is provided with a row or a row led chip, and the preset structure according to described strip circuit board between the described led chip is electrically connected, and the two ends of described circuit board connect power supply respectively.
Described high-heat-dispersion LED surface-mounted integrated circuit includes aluminum base layer 1, insulating barrier 2, copper coin layer 3, pcb layer 4, skin of paint 5, label layer 6; Aluminum base layer 1 is located at bottom, and insulating barrier 2 is located on the aluminum base layer 1, and copper coin layer 3 is located on the insulating barrier 2, and pcb layer 4 is located on the copper coin layer 3, and skin of paint 5 is located on the pcb layer 4, and label layer 6 is located on the skin of paint 5.
The two ends of described high-heat-dispersion LED surface-mounted integrated circuit are respectively equipped with the plug connector that is used for connecting power supply.
Wire connecting power is passed through at the two ends of described high-heat-dispersion LED surface-mounted integrated circuit respectively.
Described high-heat-dispersion LED surface-mounted integrated circuit is provided with the position, hole that the LED light fixture is installed.
Product is installed on the mounting hole site that the high-heat-dispersion LED surface-mounted integrated circuit is provided with, and can produce heat energy because product works long hours, and heat energy can not in time be discharged and can be produced adverse influence to product, and product is shortened useful life.From heat dispersion, copper, aluminium are best, secondly are steel, are cast iron once more.If copper, steel are used on the circuit board as heat sink material, then just waste of entire circuit plate.
The utility model advantage is to have good performance of heat dissipation by aluminium as raw-material aluminum base layer 1 on the high-heat-dispersion LED surface-mounted integrated circuit.
Claims (5)
1. high-heat-dispersion LED surface-mounted integrated circuit, it is characterized in that: described high-heat-dispersion LED surface-mounted integrated circuit is strip, a plurality of strips are formed rectangle, the slitting shape of rectangular-shaped available cutting knife, its length direction is provided with a row or a row led chip, preset structure according to described strip circuit board between the described led chip is electrically connected, and the two ends of described circuit board connect power supply respectively.
2. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1 is characterized in that: described high-heat-dispersion LED surface-mounted integrated circuit includes aluminum base layer (1), insulating barrier (2), copper coin layer (3), pcb layer (4), skin of paint (5), label layer (6); Aluminum base layer (1) is located at bottom, and insulating barrier (2) is located on the aluminum base layer (1), and copper coin layer (3) is located on the insulating barrier (2), and pcb layer (4) is located on the copper coin layer (3), and skin of paint (5) is located on the pcb layer (4), and label layer (6) is located on the skin of paint (5).
3. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1, it is characterized in that: the two ends of described high-heat-dispersion LED surface-mounted integrated circuit are respectively equipped with the plug connector that is used for connecting power supply.
4. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1, it is characterized in that: wire connecting power is passed through at the two ends of described high-heat-dispersion LED surface-mounted integrated circuit respectively.
5. a kind of high-heat-dispersion LED surface-mounted integrated circuit according to claim 1 is characterized in that: described high-heat-dispersion LED surface-mounted integrated circuit is provided with the position, hole that the LED light fixture is installed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202332225U CN201725812U (en) | 2010-06-22 | 2010-06-22 | High heat dissipation Light Emitting Diode (LED) integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202332225U CN201725812U (en) | 2010-06-22 | 2010-06-22 | High heat dissipation Light Emitting Diode (LED) integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201725812U true CN201725812U (en) | 2011-01-26 |
Family
ID=43494160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202332225U Expired - Fee Related CN201725812U (en) | 2010-06-22 | 2010-06-22 | High heat dissipation Light Emitting Diode (LED) integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201725812U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| CN105934078A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Double-side component heat dissipation flexible printed circuit board |
-
2010
- 2010-06-22 CN CN2010202332225U patent/CN201725812U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| CN102916111B (en) * | 2012-10-19 | 2016-09-28 | 杨勇平 | LED integrated optical source substrate and preparation method thereof |
| CN105934078A (en) * | 2016-07-20 | 2016-09-07 | 苏州福莱盈电子有限公司 | Double-side component heat dissipation flexible printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110126 Termination date: 20130622 |