CN202103085U - Thermoelectric separation type LED integrated light source board - Google Patents
Thermoelectric separation type LED integrated light source board Download PDFInfo
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- CN202103085U CN202103085U CN2011201114872U CN201120111487U CN202103085U CN 202103085 U CN202103085 U CN 202103085U CN 2011201114872 U CN2011201114872 U CN 2011201114872U CN 201120111487 U CN201120111487 U CN 201120111487U CN 202103085 U CN202103085 U CN 202103085U
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- light source
- bottom plate
- radiating bottom
- chip
- source board
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Abstract
The utility model discloses a thermoelectric separation type LED integrated light source board, which is low in cost, simple in structure and technology, high in production efficiency and fine in radiating effects. The thermoelectric separation type LED integrated light source board comprises an insulating substrate (1), a radiating bottom board (2) and a conducting sheet (3), wherein the radiating bottom board (2) is embedded into the bottom and the inside of the insulating substrate (1). The insulating substrate (1) is provided with a punching hole (12) and a chip positioning hole (13), the radiating bottom board (2) is provided with a punching abdication hole (22), the conducting sheet (3) comprises conducting bars (31) and a connecting portion (32), the connecting portion (32) is or the conducting bars (31) simultaneously are exposed out of the punching hole (12), the conducting bars (31) and the radiating bottom board (2) are exposed out of chip positioning hole (13), the conducting bars (31) and the connecting portion (32) are cut at the position of the punching hole (12) to form a circuit, an LED chip (6) or a chip group is arranged in the chip positioning hole (13), the bottom of the LED chip (6) or the chip group is fixedly with the radiating bottom board (2) for radiation, and a positive electrode and a negative electrode of the LED chip (6) or positive electrodes and negative electrodes of the chip group are electrically connected with the two conducting bars (31) at the position of the chip positioning hole (13).
Description
Technical field
The utility model relates to a kind of thermoelectric separated LED integrated light source board.
Background technology
LED is applied in various occasions as a kind of novel illumination light source with outstanding advantages such as its energy-saving and environmental protection, luminous efficiency height, life-span length just more and more widely.Adopting high-power LED light source to be applied in the light fixture uses as various light fixtures such as street lamp, wall lamp now.In high-power LED light source, generally led chip and lens are packaged into direct plug type light pearl or SMD encapsulation earlier; This is commonly referred to light source encapsulation for the first time; Again packaged LED is welded on a light source board that forms on heat conductive insulating substrate such as aluminium base, the copper base; Be called light source encapsulation for the second time, and the substrate that dispels the heat and connect as circuit through the heat conductive insulating substrate.Because it must pass through the secondary light source encapsulation, its complex procedures, cost is high, and production efficiency is low.
The plane integrated light source board has two kinds of common packing forms at present.As shown in Figure 1 is the not LED integrated light source board of separate type of a kind of thermoelectricity; The bottom of led chip 60 and the heat conduction that is connected of conduction fin 50; The positive and negative electrode of led chip 60 through metal wire 80 respectively with an electrode 70 and conduction fin 50 conduction that is connected; Be covered with fluorescent material and silica gel 90 on the led chip 60, form light source encapsulation for the first time through plastic body 40; Aluminium base 10 is provided with heat conductive insulating layer 20, on heat conductive insulating layer 20, is provided with the Copper Foil 30 that is used to form circuit connection and heat radiation, and electrode 70 and conduction fin 50 are fixedly welded on formation light source encapsulation for the second time on the Copper Foil 30.As shown in Figure 2 is a kind of LED integrated light source board of thermoelectric separate type; The bottom of led chip 60 and the heat conduction that is connected of conduction fin 50; The positive and negative electrode of led chip 60 is through metal wire 80 conduction that is connected with two electrodes 70 respectively; Be covered with fluorescent material and silica gel 90 on the led chip 60, form light source encapsulation for the first time through plastic body 40; Aluminium base 10 is provided with heat conductive insulating layer 20, on heat conductive insulating layer 20, is provided with the Copper Foil 30 that is used to form circuit connection and heat radiation, two electrodes 70 is fixedly welded on forms light source encapsulation for the second time on the Copper Foil 30.Above-mentioned two kinds of packing forms all need to dispel the heat through the heat conductive insulating layer, because the material thermal resistance of present heat conductive insulating layer is bigger, so the heat radiation of light source is relatively poor; And the manufacture process of above-mentioned light source board is all complicated, and production cost is high.
The utility model content
The utility model technical problem to be solved is the deficiency that overcomes prior art, provides that a kind of cost is low, simple in structure, technology is simple, production efficiency is high, the thermoelectric separated LED integrated light source board of good heat dissipation effect.
The technical scheme that the utility model adopted is: the utility model comprises insulating body, radiating bottom plate, conducting strip; Said radiating bottom plate is embedded in the bottom of said insulating body; Said conducting strip is embedded in the inside of said insulating body; Said insulating body is provided with several stamping-out holes, chip location hole; Said radiating bottom plate is provided with several and the corresponding stamping-out resigning hole in said stamping-out hole site; Several connecting portions that said conducting strip comprises the bus of parallel arrangement and connects said bus, place, said stamping-out hole correspondence is exposed said connecting portion or is exposed said bus simultaneously and said connecting portion, and said chip location hole place correspondence is exposed said bus and said radiating bottom plate; The circuit connection of said bus and said connecting portion severing formation serial or parallel connection in place, said stamping-out hole; Led chip or place in the said chip location hole by the chipset that led chip constitutes, bottom and said radiating bottom plate are fixedly connected and dispel the heat, and the both positive and negative polarity of led chip or the chipset that is made up of led chip is electrically connected with two corresponding said buss at said chip location hole place through metal wire respectively.
Said insulating body and said radiating bottom plate, said conducting strip integrated injection molding.
Said insulating body is provided with at least two location and installation holes, and said radiating bottom plate is provided with and the corresponding location and installation resigning hole in said location and installation hole site.
Said insulating body is insulation plastic cement matrix, and said radiating bottom plate is a metallic plate, and said conducting strip is a sheet metal.
Said radiating bottom plate is steel plate or copper coin, and said conducting strip is copper sheet or iron plate.
Be covered with reflector layer on the said radiating bottom plate, be covered with the routing weld layer on the said conducting strip.
Serial or parallel connection or connection in series-parallel are connected between the said chipset that is made up of said led chip, and serial or parallel connection or connection in series-parallel are connected between the said led chip in each said chipset.
The beneficial effect of the utility model is: because the utility model comprises insulating body, radiating bottom plate, conducting strip; Said radiating bottom plate is embedded in the bottom of said insulating body; Said conducting strip is embedded in the inside of said insulating body; Said insulating body is provided with several stamping-out holes, chip location hole, and said radiating bottom plate is provided with several and the corresponding stamping-out resigning hole in said stamping-out hole site, several connecting portions that said conducting strip comprises the bus of parallel arrangement and connects said bus; Place, said stamping-out hole correspondence is exposed said connecting portion or is exposed said bus simultaneously and said connecting portion; Said chip location hole place correspondence is exposed said bus and said radiating bottom plate, and severing forms the circuit connection of serial or parallel connection in said stamping-out hole place for said bus and said connecting portion, led chip or placed in the said chip location hole by the chipset that led chip constitutes; The bottom is fixedly connected with said radiating bottom plate and dispels the heat; The both positive and negative polarity of led chip or the chipset that is made up of led chip is electrically connected with two corresponding said buss at said chip location hole place through metal wire respectively, and the utility model adopts better simply manufacturing process, and said insulating body and said radiating bottom plate, said conducting strip are processed one; And the said radiating bottom plate of the bottom through being positioned at said insulating body dispels the heat separately; Be electrically connected separately through said conducting strip, utilize said radiating bottom plate, said conducting strip and the dislocation spatially of said insulating body, make conduction spatially separate with heat radiation; Do not influence mutually; And said radiating bottom plate is little more than the thermal resistance of heat conductive insulating layer, makes good heat dissipation effect, synchronous plane packaging LED chips or chipset on the integral slab that said insulating body and said radiating bottom plate, said conducting strip constitute; Make the cost of overall optical source plate low, production efficiency is high, so the thermoelectric separated LED integrated light source board cost of the utility model is low, simple in structure, technology is simple, production efficiency is high, good heat dissipation effect.
Description of drawings
Fig. 1 is the not encapsulating structure sketch map of the LED integrated light source board of separate type of a kind of existing thermoelectricity;
Fig. 2 is a kind of encapsulating structure sketch map of LED integrated light source board of existing thermoelectric separate type;
Fig. 3 is the not overall structure sketch map of packaged LED of the thermoelectric separated LED integrated light source board of the utility model;
Fig. 4 is the decomposition texture sketch map of thermoelectric separated LED integrated light source board shown in Figure 3;
Fig. 5 is the Facad structure sketch map of thermoelectric separated LED integrated light source board shown in Figure 3;
Fig. 6 is the structure sketch map of thermoelectric separated LED integrated light source board shown in Figure 3;
Fig. 7 is an A-A section structure for amplifying sketch map shown in Figure 5;
Fig. 8 is the local structure for amplifying sketch map in I shown in Figure 7 place;
Fig. 9 is corresponding to the structural representation behind the thermoelectric separated LED integrated light source board packaged LED of Fig. 8;
Figure 10 is the overall structure sketch map after the utility model embodiment one thermoelectric separated LED integrated light source board stamping-out conducting strip;
Figure 11 is the decomposition texture sketch map of thermoelectric separated LED integrated light source board shown in Figure 10;
Figure 12 is the overall structure sketch map after the utility model embodiment two thermoelectric separated LED integrated light source board stamping-out conducting strips;
Figure 13 is the decomposition texture sketch map of thermoelectric separated LED integrated light source board shown in Figure 12;
Figure 14 is the Facad structure sketch map of thermoelectric separated LED integrated light source board shown in Figure 10;
Figure 15 is the Facad structure sketch map of thermoelectric separated LED integrated light source board shown in Figure 12;
Figure 16 is the electric connection structure sketch map of thermoelectric separated LED integrated light source board shown in Figure 10;
Figure 17 is the electric connection structure sketch map of thermoelectric separated LED integrated light source board shown in Figure 12.
Embodiment
Embodiment one:
Like Fig. 3～Figure 11, Figure 14, shown in Figure 16, the thermoelectric separated LED integrated light source board of present embodiment comprises insulating body 1, radiating bottom plate 2, conducting strip 3, and said radiating bottom plate 2 is embedded in the bottom of said insulating body 1; Said conducting strip 3 is embedded in the inside of said insulating body 1, and said insulating body 1 and said radiating bottom plate 2, said conducting strip 3 integrated injection moldings are simple in structure; Production efficiency is high, and said insulating body 1 is provided with several stamping-out holes 12, chip location hole 13, and said radiating bottom plate 2 is provided with several and the corresponding stamping-out resigning hole 22 in 12 positions, said stamping-out hole; Several connecting portions 32 that said conducting strip 3 comprises the bus 31 of parallel arrangement and connects said bus 31, said stamping-out hole 12 place's correspondences expose said connecting portion 32 or expose said bus 31 and said connecting portion 32 simultaneously, and said chip location hole 13 place's correspondences are exposed said bus 31 and said radiating bottom plate 2; The circuit connection of said bus 31 and said connecting portion 32 severing formation serial or parallel connection in 12 places, said stamping-out hole, the chipset that is made up of led chip 6 places in the said chip location hole 13, and bottom and said radiating bottom plate 2 are fixedly connected and dispel the heat; The both positive and negative polarity of the chipset that is made up of led chip 6 is electrically connected with two corresponding said buss 31 at said chip location hole 13 places through metal wire 8 respectively; Said insulating body 1 is provided with at least two location and installation holes 11, and said radiating bottom plate 2 is provided with and the corresponding location and installation resigning hole 21 in 11 positions, said location and installation hole, is used to install and fix; Said insulating body 1 is insulation plastic cement matrix; Said radiating bottom plate 2 is a steel plate, and its cost is lower, can certainly be other metallic plates such as copper coin; Be covered with reflector layer on the said radiating bottom plate 2; Be used to improve the light reflection, improve light extraction efficiency, said conducting strip 3 is a copper sheet; Can certainly be other metallic conduction sheets such as iron plate; Be covered with the routing weld layer on the said conducting strip 3, be beneficial to the routing welding of led chip, also can not have the routing weld layer for copper sheet certainly; Be connected in series entirely between the said chipset that constitutes by said led chip 6; Connection in series-parallel is connected between the said led chip 6 in each said chipset, and circuit series and parallel relation can be provided with according to the voltage and the current conditions of practical power, certainly; The LED lighting circuit also possibly comprise other necessary electronic elements and module such as constant-current source device, decompression device etc., does not repeat them here.
The manufacturing approach of the thermoelectric separated LED integrated light source board of present embodiment is with said insulating body 1 and said radiating bottom plate 2, said conducting strip 3 integrated injection moldings; Said bus 31 and 32 severings of said connecting portion are formed the circuit connection of serial or parallel connection at 12 places, said stamping-out hole; And place in the said chip location hole 13 with led chip 6 or by the chipset that led chip 6 constitutes; Make its bottom be fixedly connected and dispel the heat with said radiating bottom plate 2; The both positive and negative polarity of led chip 6 or the chipset that is made up of led chip 6 is electrically connected with two corresponding said buss 31 at said chip location hole 13 places through metal wire 8 respectively; Be electroplate with the reflector layer of silver, nickel, chromium formation on the said radiating bottom plate 2, be electroplate with the routing weld layer of silver, nickel, chromium formation on the said conducting strip 3.Through earlier said conducting strip 3 whole embeddings being injected in the said insulating body 1, carry out stamping-out according to the circuit needs again, make technology simple, production efficiency is high.
Embodiment two:
Like Fig. 3～Fig. 9, Figure 12, Figure 13, Figure 15, shown in Figure 17, the thermoelectric separated LED integrated light source board of present embodiment and the difference of embodiment one are: be connected in parallel entirely between the said chipset that is made up of said led chip 6.
All the other characteristics of present embodiment are with embodiment one.
The utility model adopts better simply manufacturing process; Said insulating body 1 and said radiating bottom plate 2, said conducting strip 3 are processed one; And the said radiating bottom plate 2 of the bottom through being positioned at said insulating body 1 dispels the heat separately; Be electrically connected separately through said conducting strip 3, utilize said radiating bottom plate 2, said conducting strip 3 and the dislocation spatially of said insulating body 1, make conduction spatially separate with heat radiation; Do not influence mutually; And said radiating bottom plate 2 is little more than the thermal resistance of heat conductive insulating layer, makes good heat dissipation effect, synchronous plane packaging LED chips or chipset on the integral slab that said insulating body 1 and said radiating bottom plate 2, said conducting strip 3 constitute; Make the cost of overall optical source plate low, production efficiency is high, so the thermoelectric separated LED integrated light source board cost of the utility model is low, simple in structure, technology is simple, production efficiency is high, good heat dissipation effect.
The utility model can be widely used in LED integrated optical source field.
Claims (7)
1. thermoelectric separated LED integrated light source board; It is characterized in that: comprise insulating body (1), radiating bottom plate (2), conducting strip (3); Said radiating bottom plate (2) is embedded in the bottom of said insulating body (1); Said conducting strip (3) is embedded in the inside of said insulating body (1); Said insulating body (1) is provided with several stamping-out holes (12), chip location hole (13); Said radiating bottom plate (2) is provided with several and said stamping-out hole (12) the corresponding stamping-out resigning hole in position (22); Said conducting strip (3) comprises the bus (31) of parallel arrangement and several connecting portions (32) that connect said bus (31); Said stamping-out hole (12) is located correspondence and is exposed said connecting portion (32) or expose said bus (31) simultaneously and said connecting portion (32); Said chip location hole (13) is located correspondence and is exposed said bus (31) and said radiating bottom plate (2), and said bus (31) and said connecting portion (32) are located the circuit connection that severing forms serial or parallel connection in said stamping-out hole (12), and led chip (6) or the chipset that is made up of led chip (6) place in the said chip location hole (13); The bottom is fixedly connected and dispels the heat with said radiating bottom plate (2), and the both positive and negative polarity of led chip (6) or the chipset that is made up of led chip (6) is electrically connected through two corresponding said buss (31) that metal wire (8) and said chip location hole (13) are located respectively.
2. thermoelectric separated LED integrated light source board according to claim 1 is characterized in that: said insulating body (1) and said radiating bottom plate (2), said conducting strip (3) integrated injection molding.
3. thermoelectric separated LED integrated light source board according to claim 1; It is characterized in that: said insulating body (1) is provided with at least two location and installation holes (11), and said radiating bottom plate (2) is provided with and said location and installation hole (11) the corresponding location and installation resigning hole in position (21).
4. thermoelectric separated LED integrated light source board according to claim 1 is characterized in that: said insulating body (1) is insulation plastic cement matrix, and said radiating bottom plate (2) is a metallic plate, and said conducting strip (3) is a sheet metal.
5. thermoelectric separated LED integrated light source board according to claim 4 is characterized in that: said radiating bottom plate (2) is steel plate or copper coin, and said conducting strip (3) is copper sheet or iron plate.
6. thermoelectric separated LED integrated light source board according to claim 1 is characterized in that: said radiating bottom plate is covered with reflector layer on (2), and said conducting strip is covered with the routing weld layer on (3).
7. thermoelectric separated LED integrated light source board according to claim 1; It is characterized in that: be connected by serial or parallel connection or connection in series-parallel between the said chipset of said led chip (6) formation, serial or parallel connection or connection in series-parallel are connected between the said led chip (6) in each said chipset.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201114872U CN202103085U (en) | 2011-04-13 | 2011-04-13 | Thermoelectric separation type LED integrated light source board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201114872U CN202103085U (en) | 2011-04-13 | 2011-04-13 | Thermoelectric separation type LED integrated light source board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202103085U true CN202103085U (en) | 2012-01-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201114872U Expired - Lifetime CN202103085U (en) | 2011-04-13 | 2011-04-13 | Thermoelectric separation type LED integrated light source board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202103085U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102252279A (en) * | 2011-04-13 | 2011-11-23 | 广州南科集成电子有限公司 | Thermoelectric separation-type LED integrated light source plate and manufacturing method thereof |
| CN103234175A (en) * | 2013-04-02 | 2013-08-07 | 合肥宝龙达光电技术有限公司 | Method for installing LED in backlight module and LED jointing structure |
| CN104791632A (en) * | 2015-04-24 | 2015-07-22 | 中航华东光电有限公司 | Backlight structure of LED lamp |
| CN111446353A (en) * | 2019-01-16 | 2020-07-24 | 株式会社辉元 | Ceramic light emitting diode package and method of manufacturing the same |
-
2011
- 2011-04-13 CN CN2011201114872U patent/CN202103085U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102252279A (en) * | 2011-04-13 | 2011-11-23 | 广州南科集成电子有限公司 | Thermoelectric separation-type LED integrated light source plate and manufacturing method thereof |
| CN102252279B (en) * | 2011-04-13 | 2012-09-26 | 广州南科集成电子有限公司 | Thermoelectric separation-type LED integrated light source plate and manufacturing method thereof |
| CN103234175A (en) * | 2013-04-02 | 2013-08-07 | 合肥宝龙达光电技术有限公司 | Method for installing LED in backlight module and LED jointing structure |
| CN104791632A (en) * | 2015-04-24 | 2015-07-22 | 中航华东光电有限公司 | Backlight structure of LED lamp |
| CN111446353A (en) * | 2019-01-16 | 2020-07-24 | 株式会社辉元 | Ceramic light emitting diode package and method of manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120104 Effective date of abandoning: 20120926 |