CN201708147U - Composite graphite radiator - Google Patents
Composite graphite radiator Download PDFInfo
- Publication number
- CN201708147U CN201708147U CN 201020175084 CN201020175084U CN201708147U CN 201708147 U CN201708147 U CN 201708147U CN 201020175084 CN201020175084 CN 201020175084 CN 201020175084 U CN201020175084 U CN 201020175084U CN 201708147 U CN201708147 U CN 201708147U
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- graphite
- fin
- conducting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
A composite graphite radiator relates to the field of an electronic radiator. A plurality of long fins made of expanded graphite composite materials and a plurality of short fins made of flexible graphite materials are staggered in a clamping device. One end of each long fin is aligned to one end of each short fin. A heat-conducting layer is arranged on the aligned end face. The heat-conducting layer is made of flexible graphite materials or metal materials. The thickness of the heat-conducting layer is 0.15mm to 0.2mm. With light weight, small heat resistance, good contact, controllable temperature, short production cycle and low production cost, the composite graphite radiator makes the most of the disadvantage of high heat conductivity of the flexible graphite plate in the plane direction and optimizes the heat conduction structure in combination with high heat capacity of the expanded graphite composite materials, thereby forming good three-dimensional heat dissipation effect.
Description
Technical field
The utility model relates to a kind of heat sinks electronic products part field, particularly a kind of heat radiator with composite structure that the integrated circuit (IC) chip heat disseminates and preparation method thereof that is applicable to.
Background technology
The fast development of integrated circuit technique causes the volume of various electronic devices and product more and more littler at present, and the density of heat flow rate around the integrated device is increasing, is example with the computer CPU, and the density of heat flow rate that produces in its running has reached 60-100W/cm
2, in the semiconductor laser even reach 103W/cm
2The order of magnitude.On the other hand, the reliability of electronic device work is but very responsive to temperature, device temperature 1 ℃ of every increase on 70-80 ℃ of level, and reliability will descend 5%.Higher temperature levels becomes restriction electronic device bottleneck of performance day by day, and the control of the temperature of efficent electronic device has become a research focus at present.
Radiator commonly used at present adopts metal material more, and metal material has good capacity of heat transmission, but the thermal capacitance of metal material is less, and carbon, graphite material also have good thermal conduction characteristic, have the thermal capacitance smaller defect equally.One is aluminium and copper for the radiator material that common air-cooled radiator is selected, the thermal conductivity height of copper, can be rapidly the heat of heater members is conducted out, but the thermal capacitance of copper be very little, if air-cooled efficient deficiency, the temperature of copper material will raise comparatively fast, the temperature difference that forms is less, and heat conduction velocity will descend, thereby not reach the purpose of CPU overclocking, and the density of copper is bigger, and is relatively heavier and valuable; The thermal conductivity of aluminium is lower than copper, but density is less, and heat capacity ratio copper is big slightly, but fine aluminium is soft, need be processed into aluminium alloy, and heat dispersion will be had a greatly reduced quality.One is hard surface for a metal material surface, and coarse, with the heat-delivery surface loose contact, also can cause the uncontrollable factor of heat transferred.
Also have at present and adopt the improvement project of graphite material as radiator, Chinese patent 200510054362.x discloses a kind of " is the manufacture method of the radiating seat and the graphite thereof of substrate with graphite ", with graphite is the radiating seat of substrate, another side is provided with metal covering, the metal surface connects fins group, the thermal source that can promptly absorb electronic component and sent can improve the stability of electronic component integral body and increases the service life.But and the little problem of unresolved fin material thermal capacity, it is optimum that radiating efficiency does not reach.Though make radiating seat heat conduction become three-dimensional from two dimension by fragmentation, dipping and graphitizing method, but inevitably the direction thermal conductivity descends to some extent, the time of utilizing heating that its graphitization is needed in the final step of preparation is about 1 month in addition, has increased production cost.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of heat radiator with composite structure and preparation method thereof, can make full use of the high characteristic of graphite plane direction thermal conductivity, and in light weight, thermal resistance is little, contact, production cost is low.
For solving the problems of the technologies described above, the technical scheme that the utility model adopted is:
A kind of heat radiator with composite structure, multi-disc adopt the long fin of expanded graphite composite material and multi-disc to adopt the short fin of flexible graphite material to be staggered in clamping device;
The one end alignment of long fin and short fin, the end face of alignment is provided with heat-conducting layer.
Described heat-conducting layer is flexible graphite material or metal material.
Described heat-conducting layer thickness is 0.15-0.2mm.
Also be provided with protective layer with holes on the described heat-conducting layer.
Except that posting PET single face glued membrane edge sealing on the end face foreign minister fin that aligns and other end faces of short fin.
The radiator function is that the heat that will assemble in the electronic device is transmitted to bigger heat conductor and carries out heat exchange by huge area of dissipation and air.One is divided into two parts radiating element, i.e. the base of radiator and fin, and the base of radiator is the place that contacts and assemble heat with electronic device, and fin then is the terminal point of heat conduction, and heat dissipation is in air the most at last.Foot of radiator needs at short notice the heat that can absorption electronic device as much as possible discharges, promptly moment heat absorption capacity, the material that only possesses high heat-conduction coefficient could be competent at.Next is that radiator body should possess enough heat storage capacity, promptly bigger thermal capacity, and what bear this task usually is fin.Therefore, the performance of radiator not only with the structurally associated of radiator, be decided by that more the material of radiator is selected, the radiator material is meant the employed concrete material of radiator body.
A kind of heat radiator with composite structure that the utility model provides and preparation method thereof is by adopting the expanded graphite composite material as the fin material; Expanded graphite composite material and flexible graphite material make up as submount material, low profile flexible graphite cake material or metal material, and for example fine copper, fine aluminium are as the heat-conducting layer that contacts with electronic-device radiator spare.
The expanded graphite composite material that long fin adopts belongs to porous material, can adsorb organic media, such as paraffin, stearic acid etc., phase-change material is combined with preformed expanded graphite body, manufacture the graphite phase change composite material, the graphite phase change composite material has bigger heat of transformation capacity, and has the constant relatively characteristics of phase transition temperature, the preform expanded graphite keeps original conductor structure, is the good conductor of heat; The low profile flexible graphite material that flexible graphite material that short fin adopts and heat-conducting layer adopt is pure flexible graphite material of high density or high-strength flexible graphite composite material, the flexible graphite plate material is at the in-plane thermal conductivity height of parts, conductive coefficient reaches 550W/mK, convenient base with the heat transferred radiator, and the flexible graphite material form-dependent character is good, can closely contact with the electronic device face that generates heat, relatively have bigger advantage with metal material.Long fin and short fin are staggered, and compacted under the effect of clamping device, the in-plane thermal conductivity height of seal face, and short fin is delivered to the high long fin of heat of transformation capacity fast from absorbing heat fast to be beneficial to heat.The utility model has made full use of the high advantage of flexible graphite plate material in-plane thermal conductivity, cooperates with expanded graphite composite material high heat capacity performance and has optimized the heat conducting structure, forms good three-dimensional heat dissipation effect.
The method that clamping device adopts end plate and bolt clip to fasten, bolt can pass radiator fin, the end plate material is selected aluminium for use, to strengthen radiator three-dimensional heat dissipation effect, bolt also can not pass radiator fin, directly be fixed on and clamp radiator fin on the end plate, thus make in light weight, thermal resistance is little, contact, Controllable Temperature, with short production cycle, air-cooled radiator that production cost is low.Life cycle of the product in the utility model is in a working day.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a upward view of the present utility model.
Embodiment
In Fig. 1, Fig. 2, a kind of heat radiator with composite structure, multi-disc adopts the long fin 1 of expanded graphite composite material and multi-disc to adopt the short fin 2 of flexible graphite material to be staggered in clamping device;
The one end alignment of long fin 1 and short fin 2, the end face of alignment is provided with heat-conducting layer 7.
Described heat-conducting layer 7 is flexible graphite material or metal material.
Described heat-conducting layer 7 thickness are 0.15-0.2mm.
Also be provided with protective layer with holes 4 on the described heat-conducting layer 7.
End face foreign minister fin 1 and short fin 2 other end faces of removing alignment are provided with PET single face glued membrane edge sealing.
Embodiment 1:
Adopt 50 order crystalline flake graphites, carry out the oxidation intercalation according to a certain percentage, obtain expansible graphite behind the washing and drying with the concentrated sulfuric acid, nitric acid, expansible graphite expands under 850 ℃ of temperature, expansion multiplying power is at 200 times, and it is 0.2g/cm3 sheet material that expanded graphite is pressed into density, and sheet metal thickness is 3mm.According to the size of dipping box, the sheet material specifications design is 500 * 500mm.
Select for use paraffin as energy storage phase change material, phase transition temperature is 58 ℃, the heat of transformation is 190KJ/kg, phase transformation paraffin is melted in container, utilize the mode of vacuum impregnation case vacuum draw to enter in the vacuum tank that the low-density expanded graphite cake is housed, insulation is 65 ℃ in the vacuum tank, and before sucking paraffin, the vacuum tank vacuum degree that graphite cake is housed remains on-0.095MPa.
After the graphite cake dipping, the surface is with gasoline or other solvent clean, and it is closely knit to dry back compacting on platen-press, and THICKNESS CONTROL is below 2.5mm.Paraffin immersion amount is 85% ± 5% of a finished product total weight, and promptly graphite energy-accumulation material phase-transition heat-storage amount is 160KJ/kg.
Phase transformation paraffin expanded graphite composite panel face direction thermal conductivity is 153W/mK.Adopt the cutting edge die stamping to be processed into the long fin 1 that has installing hole 6 the expanded graphite composite panel, apparent size is 50 * 100mm, and adopting thickness is that 0.03mmPET single face glued membrane carries out encapsulation process.
The high density flexible graphite cake is superimposed upon the low-density graphite cake and vacuumizes after-applied pressure processing on the evacuated flat panel press, and high density flexible graphite cake thickness is 2mm and 0.18mm, and density is 1.5g/cm3, and plate face direction thermal conductivity reaches 550W/mK.
With the cutting edge mould highdensity flexible graphite plate is processed into the short fin 2 that has installing hole 6, is of a size of 50 * 50mm, part other three limit except that the base is adopted 0.03mmPET single face glued membrane to carry out edge sealing and is handled.
Heat-conducting layer 7 can be converted to vertical heat conduction with horizontal quick conductive fast the heat transferred base, and heat-conducting layer 7 can be out of shape and is beneficial to closely contact with electronic component, improves heat transfer efficiency.On protective layer 4, have and be convenient to the hole that contacts with electronic component.Protective layer 4 can be avoided heat-conducting layer 7 to touch circuit board causing short circuit.
The expanded graphite composite panel of employing parafin bath and high density or high-strength flexible graphite cake interval group are set up dress jointly, utilize the graphite composite material plate phase-change thermal storage characteristics of flexible graphite plate high thermal conductivity coefficient and parafin bath, the low profile flexible graphite cake that contacts with the electronic device heating position is given foot of radiator with heat along in-plane heat conduction fast, the understructure characteristics of radiator are the graphite cake vertical arrangements, the in-plane of graphite cake vertically contacts on heating face, the direction that instant heating transmits is the high direction of graphite cake thermal conductivity coefficient just, heat radiator thermal resistance is very little, flexible graphite plate surface heat transfer and the heat transfer efficiency of expanded graphite composite material own are all very high, these heats scatter and disappear by air-cooled convection current on the one hand, absorb by phase transformation paraffin on the one hand, and design by heat spreader structures, the temperature of radiator itself is controlled in the phase transition temperature scope, and electronic device will keep stable working temperature.
The foot of radiator area of assembling is 12.5cm
2, the fin height is 25 times with the fin pitch ratio, and assembling aluminium flake radiator and thermal conductivity in the same way is the common expanded graphite meterial radiator of 350W/mK, and the aluminium flake base adopts the precision grinder polishing.The thermal conductivity of aluminium sheet is 186W/mK.Adopt homemade radiating effect device to test, method of testing is: have one side to be copper smooth heat delivery surface in the testing apparatus, other faces are adiabatic face, hot-fluid adopts the pure water of heating, current pressure head and flow are controlled, and the base of radiator is closely contacted by assembling bolt with the heat delivery surface of device respectively, and constant flow is given the device water flowing, the import and export current temperature difference of measurement (5 minutes) device in official hour, the temperature difference is represented the heat-sinking capability of radiator.Test result is as follows:
Test result shows that the utility model radiator heat-dissipation effect is apparently higher than Aluminium Radiator and common expanded graphite meterial radiator.
The HYDP-4 thermal conductivity tester test of adopting the permanent electronics technology Co., Ltd more in Changchun to produce, the thermal resistance that the product of present embodiment records is: 0.05cm
2. ℃/W, the thermal resistance that common expanded graphite meterial radiator records is: 0.08cm
2℃/W, the thermal resistance that the radiator of aluminum is surveyed is 0.08cm
2℃/W.
Embodiment 2:
Expanded graphite paraffin composite board manufacture method is with embodiment 1.
Make the expanded graphite cystosepiment of 0.2g/cm3 according to embodiment 1, again thermosetting phenolic resin being become concentration with anhydrous alcohol solution is 20% solution, employing vacuumizes the method for dipping, in graphite cake, flood thermosetting phenolic resin, pulverize with plastic crusher after the graphite cake drying of dipping, be broken into 80 order powder with the stirring abrasive dust again, hot-forming is 1.7g/cm
3Density thickness is 2mm and 0.18mm graphite cake, with the cutting edge mould high-strength flexible graphite cake is processed into the part that has installing hole, and accessory size is 50 * 50mm.Graphite cake obtains the high-strength flexible graphite cake through 175 ℃ of temperature-curable.High-strength flexible graphite cake plate face direction thermal conductivity reaches 500W/mK.The in-plane thermal conductivity slightly reduces the lifting that brings the strength of materials.
Test equally according to embodiment 1 method, the utility model radiator heat-dissipation effect is better than Aluminium Radiator and common expanded graphite meterial radiator, and test result is as follows:
The thermal resistance that the product of present embodiment records is: 0.07cm
2℃/W.
Claims (5)
1. heat radiator with composite structure is characterized in that: the long fin (1) that multi-disc adopts the expanded graphite composite material is staggered in clamping device with the short fin (2) of multi-disc employing flexible graphite material;
The one end alignment of long fin (1) and short fin (2), the end face of alignment is provided with heat-conducting layer (7).
2. a kind of heat radiator with composite structure according to claim 1 is characterized in that: described heat-conducting layer (7) is flexible graphite material or metal material.
3. a kind of heat radiator with composite structure according to claim 1 and 2 is characterized in that: described heat-conducting layer (7) thickness is 0.15-0.2mm.
4. a kind of heat radiator with composite structure according to claim 1 is characterized in that: also be provided with protective layer with holes (4) on the described heat-conducting layer (7).
5. a kind of heat radiator with composite structure according to claim 1 is characterized in that: except that posting PET single face glued membrane edge sealing on the end face foreign minister fin (1) that aligns and other end faces of short fin (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020175084 CN201708147U (en) | 2010-04-29 | 2010-04-29 | Composite graphite radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201020175084 CN201708147U (en) | 2010-04-29 | 2010-04-29 | Composite graphite radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201708147U true CN201708147U (en) | 2011-01-12 |
Family
ID=43445301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201020175084 Expired - Lifetime CN201708147U (en) | 2010-04-29 | 2010-04-29 | Composite graphite radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201708147U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101825412A (en) * | 2010-04-29 | 2010-09-08 | 中科恒达石墨股份有限公司 | Heat radiator with composite structure and preparation method thereof |
| CN106356346A (en) * | 2016-11-23 | 2017-01-25 | 广东合新材料研究院有限公司 | Ultra-thin phase change cooling fin and production method thereof |
| CN107366887A (en) * | 2017-08-06 | 2017-11-21 | 潘金文 | A kind of LED heat dissipation structure |
| CN108007258A (en) * | 2017-10-18 | 2018-05-08 | 衢州学院 | The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method |
| CN108766948A (en) * | 2018-08-17 | 2018-11-06 | 威海云山科技有限公司 | A kind of flexible membrane radiator |
-
2010
- 2010-04-29 CN CN 201020175084 patent/CN201708147U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101825412A (en) * | 2010-04-29 | 2010-09-08 | 中科恒达石墨股份有限公司 | Heat radiator with composite structure and preparation method thereof |
| CN106356346A (en) * | 2016-11-23 | 2017-01-25 | 广东合新材料研究院有限公司 | Ultra-thin phase change cooling fin and production method thereof |
| CN107366887A (en) * | 2017-08-06 | 2017-11-21 | 潘金文 | A kind of LED heat dissipation structure |
| CN108007258A (en) * | 2017-10-18 | 2018-05-08 | 衢州学院 | The heat transfer of metal-containing polymer combined type micro-structure heat exchanger and forming method |
| CN108766948A (en) * | 2018-08-17 | 2018-11-06 | 威海云山科技有限公司 | A kind of flexible membrane radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101825412B (en) | Heat radiator with composite structure and preparation method thereof | |
| CN101232794B (en) | Soaking plate and heat radiating device | |
| CN201708147U (en) | Composite graphite radiator | |
| CN202443965U (en) | Metal-graphite composite heat-sink device | |
| CN201638805U (en) | Radiator fin set and radiator using the same | |
| CN101533810A (en) | Pulsating heat pipe radiator having foam | |
| CN102157761A (en) | Thermal management system for power battery based on pulsating heat pipe | |
| CN201839581U (en) | Equalizing thermal module | |
| CN105845648A (en) | Microelectronic device tree-shaped radiator | |
| CN201629328U (en) | Heat radiator structure | |
| CN207020614U (en) | A kind of graphite ene coatings cpu heat | |
| CN202485508U (en) | Two-phase cooling fin | |
| WO2013053174A1 (en) | High efficiency heat sink with porous metal structure | |
| CN202712234U (en) | Solar cell module having heat-dissipation packaging structure | |
| CN205864943U (en) | Servo-driver radiator | |
| CN108419416A (en) | A kind of high heat dissipation capacity heat-pipe radiator of IGBT | |
| CN206498369U (en) | Heat radiating type solar junction box | |
| CN203659934U (en) | Microgroove group heat radiating device of high-power LED (light emitting diode) | |
| CN202888236U (en) | High-efficiency radiating high-power light-emitting diode (LED) | |
| CN201985089U (en) | Integrated computer radiator | |
| CN202617578U (en) | Low-temperature soldered electronic radiator | |
| CN201156225Y (en) | Computer heat radiating apparatus | |
| CN201167448Y (en) | Radiating device | |
| CN201184990Y (en) | Radiator for display card | |
| CN110881266A (en) | Bulk phase heat conduction structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110112 Effective date of abandoning: 20110928 |