CN201699054U - 贴片发光二极管 - Google Patents

贴片发光二极管 Download PDF

Info

Publication number
CN201699054U
CN201699054U CN2010202166371U CN201020216637U CN201699054U CN 201699054 U CN201699054 U CN 201699054U CN 2010202166371 U CN2010202166371 U CN 2010202166371U CN 201020216637 U CN201020216637 U CN 201020216637U CN 201699054 U CN201699054 U CN 201699054U
Authority
CN
China
Prior art keywords
rack
shaped cavity
emitting diode
reflective layer
metal reflective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2010202166371U
Other languages
English (en)
Inventor
蒋文霞
阳云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Lianzhong Optoelectronic Technology Co Ltd
Original Assignee
Zhejiang Lianzhong Optoelectronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Lianzhong Optoelectronic Technology Co Ltd filed Critical Zhejiang Lianzhong Optoelectronic Technology Co Ltd
Priority to CN2010202166371U priority Critical patent/CN201699054U/zh
Application granted granted Critical
Publication of CN201699054U publication Critical patent/CN201699054U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)

Abstract

本实用新型公开了一种贴片发光二极管，尤其是指一种支架反光杯内壁表面镀有金属反光层的发光二极管。包括支架，置于支架上的绝缘层，支架与绝缘层形成一个碗杯状腔体，芯片通过固晶胶固定于碗杯状腔体内，芯片的两电极与作为导电体的两根金钱电性连接，光电胶设置于碗杯状腔体内，其特征在于：在碗杯状腔体内壁表面设有金属反光层。本实用新型采用有金属反光层支架制作的发光二极管，由于金属反光层反光效率高以及与光电胶结合良好，金属反光层导热好，增加金属反光层后对支架绝缘层反光的要求没有了故可以用低成本的材料做支架的绝缘层，所以出光效率高10％-30％、热阻小、寿命长、成本低。

Description

贴片发光二极管
技术领域
本实用新型涉及一种贴片发光二极管，尤其是指一种支架反光杯内壁表面镀有金属反光层的发光二极管。
背景技术
现有的TOP型贴片发光二极管的支架是由金属片材与聚邻苯二酰胺树脂(简称PPA)组成，PPA注塑成一个碗杯状，发光二极管芯片的光大部分就是靠PPA的杯内壁表面反射到外面的，公知的TOP型贴片发光二极管在PPA杯内填充的是电子级硅胶，用这种方式制作的发光二极管由于PPA的白度有限，有很多光线被PPA吸收，发光二极管经过长时间工作后PPA会黄变造成发光二极管出光下降，且现有的电子级硅胶与大部分的PPA等有机物结合力不强，造成PPA与硅胶的结合处产生裂缝，湿气或有害气体就会慢慢从裂缝处进入支架内部的金属片材处造成支架的金属片材氧化发黑，最后导致发光二极管的出光量下降，发光颜色产生漂移(特别是白色发光二极管)。
发明内容
本实用新型针对现有技术中的不足，提出了一种贴片发光二极管，能简单、合理的处理支架，而使发光二极管的出光效率提升，并且让硅胶与支架结合良好，有效的延长发光二极管的寿命。
本实用新型是通过下述技术方案得以实现的：
一种贴片发光二极管，包括支架，置于支架上的绝缘层，支架与绝缘层形成一个碗杯状腔体，芯片通过固晶胶固定于碗杯状腔体内，芯片的两电极与作为导电体的两根金钱电性连接，光电胶设置于碗杯状腔体内，其特征在于：在碗杯状腔体内壁表面设有金属反光层。
作为优选，该金属反光层是通过真空电镀于碗杯状腔体内壁表面的，金属反光层材质可以为金属或金属合金。
作为优选，上述的一种贴片发光二极管，所述的光电胶1，可以为硅胶、硅树脂、环氧树脂以及添加荧光粉的硅胶、硅树脂与环氧树脂。
作为优选，上述的一种贴片发光二极管，所述的支架绝缘层5，材质可以为PPA、玻璃、陶瓷。
作为最佳选择，上述的一种贴片发光二极管，所述的金属反光层6，材质可以为金属、金属合金。
本实用新型的有益效果：采用有金属反光层支架制作的发光二极管，由于金属反光层反光效率高以及与光电胶结合良好，金属反光层导热好，增加金属反光层后对支架绝缘层反光的要求没有了故可以用低成本的材料做支架的绝缘层，所以用带有金属反光层支架封装的贴片发光二极管比用普通支架封装的贴片发光二极管出光效率高10％-30％、热阻小、寿命长、成本低。
下面结合附图和具体实施方式对本实用新型作具体说明：
附图说明
图1为本实用新型的剖面结构示意图。
图中标号：1光电胶、2芯片、3金线、4支架、5绝缘层、6金属反光层、7固晶胶。
具体实施方式
如图1所示，本实用新型的贴片发光二极管，包括支架4，置于支架4上的绝缘层5，绝缘层5材质可以为PPA、玻璃或陶瓷。支架4与绝缘层5形成一个碗杯状腔体，芯片2通过固晶胶7固定于碗杯状腔体内，芯片2的两电极与作为导电体的两根金钱3电性连接，在碗杯状腔体内壁表面设有金属反光层6，该金属反光层6是通过真空电镀于碗杯状腔体内壁表面的，金属反光层6材质可以为金属或金属合金。光电胶1设置于碗杯状腔体内，光电胶1可以为硅胶、硅树脂、环氧树脂，或者为添加荧光粉的硅胶、硅树脂、环氧树脂。
本实用新型的封装方式与常规的贴片二极管封装方式完全相同，仅仅只是改变原有支架的内表面结构，在支架碗杯内壁表面真空电镀一层金属反光层，用此支架按正常的封装工艺固晶(在支架内点上固晶胶7然后在固晶胶7上面放上芯片2)、固晶烘烤、焊线(在芯片与支架金属片材之间焊上金线3)、点胶(在支架碗杯内点入光电胶1)、点胶烘烤、测试分级、编带包装。
当然本实用新型还可有其它多种实施例，在不背离本实用新型精神及其实质的情况下，熟悉本领域的技术人员可根据本实用新型作出各种相应的改变和变形，但这些相应的改变和变形都应属于本实用新型所附的权利要求的保护范围。

Claims (2)

1.一种贴片发光二极管，包括支架，置于支架上的绝缘层，支架与绝缘层形成一个碗杯状腔体，芯片固定于碗杯状腔体内，芯片与金钱电性连接，光电胶设置于碗杯状腔体内，其特征在于：在碗杯状腔体内壁表面设有金属反光层。
2.根据权利要求1所述的一种贴片发光二极管，其特征在于：金属反光层是通过真空电镀于碗杯状腔体内壁表面的。
CN2010202166371U 2010-06-04 2010-06-04 贴片发光二极管 Expired - Lifetime CN201699054U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202166371U CN201699054U (zh) 2010-06-04 2010-06-04 贴片发光二极管

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202166371U CN201699054U (zh) 2010-06-04 2010-06-04 贴片发光二极管

Publications (1)

Publication Number Publication Date
CN201699054U true CN201699054U (zh) 2011-01-05

Family

ID=43400300

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202166371U Expired - Lifetime CN201699054U (zh) 2010-06-04 2010-06-04 贴片发光二极管

Country Status (1)

Country Link
CN (1) CN201699054U (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102185078A (zh) * 2011-03-30 2011-09-14 深圳雷曼光电科技股份有限公司 贴片式户外led的封装结构及封装方法
CN102324459A (zh) * 2010-10-15 2012-01-18 广东昭信灯具有限公司 一种led灯封装结构及其制备方法
CN102760816A (zh) * 2011-04-26 2012-10-31 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102324459A (zh) * 2010-10-15 2012-01-18 广东昭信灯具有限公司 一种led灯封装结构及其制备方法
CN102185078A (zh) * 2011-03-30 2011-09-14 深圳雷曼光电科技股份有限公司 贴片式户外led的封装结构及封装方法
CN102185078B (zh) * 2011-03-30 2013-02-06 深圳雷曼光电科技股份有限公司 贴片式户外led的封装结构及封装方法
CN102760816A (zh) * 2011-04-26 2012-10-31 展晶科技(深圳)有限公司 发光二极管封装结构及其制造方法

Similar Documents

Publication Publication Date Title
CN102270725A (zh) 发光二极管封装结构
TW201101548A (en) LED package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
CN101621107A (zh) 一种高光效发光二极管及其封装方法
CN103618041B (zh) 一种esd保护的led封装结构及其封装方法
CN105280781A (zh) 一种倒装白光led器件及其制作方法
CN202839741U (zh) 一种贴片式发光二极管支架
CN201699054U (zh) 贴片发光二极管
CN205282504U (zh) 一种贴片式白光led封装体
CN209104187U (zh) 一种led封装体
TW201244178A (en) LED package and method for manufacturing the same
CN102683544B (zh) 贴片式发光二极管
CN102194975B (zh) 光半导体封装体及光半导体装置
CN101834256A (zh) 发光器件封装
CN106356437B (zh) 一种白光led封装器件及其制备方法
CN203674260U (zh) 一种esd保护的led封装结构
CN102569595A (zh) 发光二极管封装结构
CN105070813A (zh) 一种大功率led支架及其封装方法
CN102479907A (zh) 发光二极管封装结构
CN201893369U (zh) 一种发光二极管
CN203536466U (zh) 一种顶部发光二极管支架及顶部发光二极管器件
CN112786769A (zh) 一种防硫化led器件及其制备方法
CN203536465U (zh) 一种顶部发光二极管支架及顶部发光二极管器件
CN206992109U (zh) 一种户外大间距led器件及led显示屏
CN201946628U (zh) 发光二极管封装及其模具
CN205692865U (zh) 反射镜式金属基板led封装结构

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20110105

CX01 Expiry of patent term