CN201673128U - Wafer defect visual inspection device - Google Patents
Wafer defect visual inspection device Download PDFInfo
- Publication number
- CN201673128U CN201673128U CN201020130281XU CN201020130281U CN201673128U CN 201673128 U CN201673128 U CN 201673128U CN 201020130281X U CN201020130281X U CN 201020130281XU CN 201020130281 U CN201020130281 U CN 201020130281U CN 201673128 U CN201673128 U CN 201673128U
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- visual inspection
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- inspection mechanism
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201020130281XU CN201673128U (en) | 2010-03-12 | 2010-03-12 | Wafer defect visual inspection device |
Applications Claiming Priority (1)
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CN201020130281XU CN201673128U (en) | 2010-03-12 | 2010-03-12 | Wafer defect visual inspection device |
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CN201673128U true CN201673128U (en) | 2010-12-15 |
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CN201020130281XU Expired - Fee Related CN201673128U (en) | 2010-03-12 | 2010-03-12 | Wafer defect visual inspection device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102915938A (en) * | 2012-10-08 | 2013-02-06 | 上海华力微电子有限公司 | Device for detecting defects at back of wafer and method therefor |
CN108802059A (en) * | 2017-05-05 | 2018-11-13 | 上海新昇半导体科技有限公司 | Visual inspection apparatus |
WO2020042421A1 (en) * | 2018-08-27 | 2020-03-05 | 苏州精濑光电有限公司 | Wafer detection device |
-
2010
- 2010-03-12 CN CN201020130281XU patent/CN201673128U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102915938A (en) * | 2012-10-08 | 2013-02-06 | 上海华力微电子有限公司 | Device for detecting defects at back of wafer and method therefor |
CN102915938B (en) * | 2012-10-08 | 2015-09-30 | 上海华力微电子有限公司 | A kind of device and method detecting brilliant back of the body defect |
CN108802059A (en) * | 2017-05-05 | 2018-11-13 | 上海新昇半导体科技有限公司 | Visual inspection apparatus |
CN108802059B (en) * | 2017-05-05 | 2021-04-06 | 上海新昇半导体科技有限公司 | Visual inspection device |
WO2020042421A1 (en) * | 2018-08-27 | 2020-03-05 | 苏州精濑光电有限公司 | Wafer detection device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20190312 |
|
CF01 | Termination of patent right due to non-payment of annual fee |