CN201673128U - Wafer defect visual inspection device - Google Patents
Wafer defect visual inspection device Download PDFInfo
- Publication number
- CN201673128U CN201673128U CN201020130281XU CN201020130281U CN201673128U CN 201673128 U CN201673128 U CN 201673128U CN 201020130281X U CN201020130281X U CN 201020130281XU CN 201020130281 U CN201020130281 U CN 201020130281U CN 201673128 U CN201673128 U CN 201673128U
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a wafer defect visual inspection device. The device comprises a macroscopic visual inspection mechanism and a microscopic visual inspection mechanism. Wafers are respectively sent to the macroscopic visual inspection mechanism and the microscopic visual inspection mechanism by a conveying mechanism for inspection. The utility model is characterized in that an optical element for detecting wafer microscopic structures is arranged on the platform of the macroscopic visual inspection mechanism. Detectors can inspect the annular defects, the ring-shaped defects and the edge defects of the wafers with the wafer defect visual inspection device through the optical element on the platform of the macroscopic visual inspection mechanism, so the defect that the microscopic visual inspection mechanism of the existing wafer defect visual inspection device can not detect the defects above is overcome. The utility model can comprehensively detect wafers, effectively improve wafer detection efficiency and improve product detection reliability.
Description
Technical field
The utility model relates to a kind of wafer defect visual inspection apparatus.
Background technology
Existing wafer defect visual inspection apparatus also claims wafer defect visual inspection optical microscope system, see also Fig. 1, as seen from the figure, described wafer defect visual inspection apparatus comprises macroscopical visual inspection mechanism 1 and microcosmic visual inspection mechanism 2, and described wafer delivers to macroscopical visual inspection mechanism 1 respectively by connecting gear and microcosmic visual inspection mechanism 2 checks.But, the wafer carrier of existing microcosmic visual inspection mechanism 2 is because limitation of movement, can only carry out the motion of X, Y direction, therefore, the supervisory personnel usually can not detect ring-type defective, round defective and the edge defect of wafer by the microscope of microcosmic visual inspection mechanism 2.Yet can ring-type defective, round defective and the edge defect that detect these wafers effectively have sizable relation to the yield rate of controlling product, thereby this is very important defective.
Therefore, how providing a kind of wafer defect visual inspection apparatus that can observe ring-type defective, round defective and the edge defect of product wafer is the technical matters that this area needs to be resolved hurrily.
The utility model content
The purpose of this utility model is to provide a kind of wafer defect visual inspection apparatus, can observe ring-type defective, round defective and the edge defect of product wafer, thereby improves the wafer detection efficiency.
To achieve the above object, the utility model adopts following technical scheme:
A kind of wafer defect visual inspection apparatus, comprise macroscopical visual inspection mechanism and microcosmic visual inspection mechanism, described wafer delivers to macroscopical visual inspection mechanism respectively by connecting gear and microcosmic visual inspection mechanism checks, the platform of described macroscopical visual inspection mechanism is provided with the optical element of the micromechanism that is used to detect wafer.
Described optical element is a magnifier.
Described magnifier is movably connected on the described platform by a connecting link.
Described connecting link is connected on the described platform by a rotational structure.
Described connecting link is connected the place that keeps to the side of described platform.
The beneficial effects of the utility model are as follows:
The utility model wafer defect visual inspection apparatus, by the optical element on the platform that is arranged on macroscopical visual inspection mechanism, the testing staff can observe ring-type defective, round defective and the edge defect of wafer, thereby the deficiency of above-mentioned defective can't detect in the microcosmic visual inspection mechanism that has remedied existing wafer defect visual inspection apparatus, thereby, can realize the complete detection of wafer, effectively improve the detection efficiency of wafer, and then improve the confidence level that product detects.
Description of drawings
Wafer defect visual inspection apparatus of the present utility model is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of existing wafer defect visual inspection apparatus;
Fig. 2 is the structural representation of wafer defect visual inspection apparatus of the present utility model;
Fig. 3 is the structural representation of macroscopical visual inspection of the present utility model mechanism;
Fig. 4 is the magnifier of macroscopical visual inspection of the present utility model mechanism and the use synoptic diagram of wafer suction disc;
Among the figure, 1-macroscopic view visual inspection mechanism, 100-platform, 111-magnifier, 112-connecting link, 113-rotational structure, 121-wafer suction disc, 122-support bar, 130-handle, 2-microcosmic visual inspection mechanism.
Embodiment
Below will be described in further detail wafer defect visual inspection apparatus of the present utility model.
Below with reference to accompanying drawings the utility model is described in more detail, has wherein represented preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.In the following description, be not described in detail known function and structure, because they can make the utility model because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development may be complicated and time-consuming, but only be routine work to those skilled in the art.
For the purpose of this utility model, feature are become apparent, embodiment of the present utility model is further described below in conjunction with accompanying drawing.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
See also Fig. 2-Fig. 4, Fig. 2 is the structural representation of wafer defect visual inspection apparatus of the present utility model; Fig. 3 is the structural representation of macroscopical visual inspection of the present utility model mechanism; Fig. 4 is the magnifier of macroscopical visual inspection of the present utility model mechanism and the use synoptic diagram of wafer suction disc.
This wafer defect visual inspection apparatus, comprise macroscopical visual inspection mechanism 1 and microcosmic visual inspection mechanism 2, described wafer delivers to macroscopical visual inspection mechanism 1 respectively by connecting gear and microcosmic visual inspection mechanism 2 checks, the platform 100 of described macroscopical visual inspection mechanism 1 is provided with the optical element of the micromechanism that is used to check wafer.Described optical element is a magnifier 111.Described magnifier 111 is movably connected on the described platform 100 by a connecting link 112.Described connecting link 112 is connected on the described platform 100 by a rotational structure 113.Described connecting link 112 platform 100 is relatively done 180 degree rotations, thereby described optical element and connecting link 1 can be folded on the platform 100, to save the space.Described connecting link 112 can be connected the place that keeps to the side of described platform 100, with the defective of convenient monitoring personnel inspection wafer, increases work efficiency.The length of described connecting link need be enough to make the supervisory personnel can observe wafer by described magnifier 111.
Described wafer vacuum is adsorbed on the wafer suction disc 121.In the process of wafer macroscopic view visual inspection and in the process that detects by magnifier, wafer suction disc 121 drives by rotary drive mechanism and is rotated, thereby the wafer that drives on it is rotated, so that the testing staff observes.Simultaneously, described wafer suction disc 121 is moved up and down within the specific limits by support bar 122 drives under lift drive mechanism drives.In addition, wafer suction disc 121 also is provided with angle-adjusting mechanism, regulates the angle of wafer suction disc 121 by handle 130.Because rotary drive mechanism, lift drive mechanism and the angle-adjusting mechanism of vacuum cup 121 are existing routine techniques, so do not repeat them here.
The using method of the utility model wafer defect visual inspection apparatus is as follows:
See also Fig. 2-Fig. 4, at first, wafer to be detected is adsorbed on the wafer suction disc 121, utilize the lifting drives structure to drive support bar 122 and come described wafer suction disc 121 of lifting and wafer to certain altitude.Then, regulate the angle of wafer suction disc 121, so that the testing staff observes.Then, drive described wafer suction disc 121 by rotary drive mechanism and be rotated, promptly start the automatic spinfunction of wafer, the testing staff has or not gross imperfection by the visual inspection wafer.Then, the angle of regulating wafer suction disc 121 is positioned at wafer alignment under the magnifier of platform edges, starts the automatic spinfunction of wafer, and whether the testing staff has round defective, ring-type defective or edge defect by the visual inspection wafer.At last, be sent to the micro that microcosmic visual inspection mechanism carries out wafer after wafer being reduced to platform.
The utility model wafer defect visual inspection apparatus, by the optical element on the platform that is arranged on macroscopical visual inspection mechanism, the testing staff can observe ring-type defective, round defective and the edge defect of wafer, thereby the deficiency of above-mentioned defective can't detect in the microcosmic visual inspection mechanism that has remedied existing wafer defect visual inspection apparatus, thereby, can realize the complete detection of wafer, effectively improve the detection efficiency of wafer, and then improve the confidence level that product detects.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (5)
1. wafer defect visual inspection apparatus, comprise macroscopical visual inspection mechanism and microcosmic visual inspection mechanism, described wafer delivers to macroscopical visual inspection mechanism respectively by connecting gear and microcosmic visual inspection mechanism checks, it is characterized in that the platform of described macroscopical visual inspection mechanism is provided with the optical element of the micromechanism that is used to detect wafer.
2. wafer defect visual inspection apparatus as claimed in claim 1 is characterized in that described optical element is a magnifier.
3. wafer defect visual inspection apparatus as claimed in claim 2 is characterized in that described magnifier is movably connected on the described platform by a connecting link.
4. wafer defect visual inspection apparatus as claimed in claim 3 is characterized in that described connecting link is connected on the described platform by a rotational structure.
5. wafer defect visual inspection apparatus as claimed in claim 3 is characterized in that, described connecting link is connected the place that keeps to the side of described platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020130281XU CN201673128U (en) | 2010-03-12 | 2010-03-12 | Wafer defect visual inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020130281XU CN201673128U (en) | 2010-03-12 | 2010-03-12 | Wafer defect visual inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201673128U true CN201673128U (en) | 2010-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020130281XU Expired - Fee Related CN201673128U (en) | 2010-03-12 | 2010-03-12 | Wafer defect visual inspection device |
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| Country | Link |
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| CN (1) | CN201673128U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102915938A (en) * | 2012-10-08 | 2013-02-06 | 上海华力微电子有限公司 | Device for detecting defects at back of wafer and method therefor |
| CN108802059A (en) * | 2017-05-05 | 2018-11-13 | 上海新昇半导体科技有限公司 | Visual inspection apparatus |
| WO2020042421A1 (en) * | 2018-08-27 | 2020-03-05 | 苏州精濑光电有限公司 | Wafer detection device |
-
2010
- 2010-03-12 CN CN201020130281XU patent/CN201673128U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102915938A (en) * | 2012-10-08 | 2013-02-06 | 上海华力微电子有限公司 | Device for detecting defects at back of wafer and method therefor |
| CN102915938B (en) * | 2012-10-08 | 2015-09-30 | 上海华力微电子有限公司 | A kind of device and method detecting brilliant back of the body defect |
| CN108802059A (en) * | 2017-05-05 | 2018-11-13 | 上海新昇半导体科技有限公司 | Visual inspection apparatus |
| CN108802059B (en) * | 2017-05-05 | 2021-04-06 | 上海新昇半导体科技有限公司 | Visual inspection device |
| WO2020042421A1 (en) * | 2018-08-27 | 2020-03-05 | 苏州精濑光电有限公司 | Wafer detection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130219 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20190312 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |