CN201663152U - Crystal grain picking device - Google Patents
Crystal grain picking device Download PDFInfo
- Publication number
- CN201663152U CN201663152U CN2010201593618U CN201020159361U CN201663152U CN 201663152 U CN201663152 U CN 201663152U CN 2010201593618 U CN2010201593618 U CN 2010201593618U CN 201020159361 U CN201020159361 U CN 201020159361U CN 201663152 U CN201663152 U CN 201663152U
- Authority
- CN
- China
- Prior art keywords
- crystal grain
- picking device
- cutting machine
- grain picking
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The utility model relates to a picking device when a semiconductor alloy rod is cut into crystal grains. The crystal grain picking device comprises a crystal grain cutting machine which is provided with an upper part and a lower part, a molybdenum wire is connected between the upper part and the lower part, and a fixing device used for fixing the alloy rod is also arranged between the upper part and the lower part. The crystal grain picking device is characterized in that an inclined plane device is arranged below the fixing device, and provided with a small hole for the molybdenum wire to pass through. The crystal grain picking device has the advantages that the semiconductor crystal grains can not fall into a seam of the cutting machine, and also the product quality is improved.
Description
Technical field
The utility model relates to the pick device when the semiconducting alloy rod cut into crystal grain.
Background technology
Alloy bar cuts into electric spark cutting that crystal grain is to use, the frame of such cutting machine bottom be the plane many slits are arranged again, cause the wafer of cutting to drop in the slit or wafer bumps the assorted product quality that influences mutually.
Summary of the invention
The purpose of this utility model is to provide a kind of semiconductor grain that cuts into can not fall into the die pick device that can improve the quality of products again in the cutting machine slit.
The technical solution of the utility model is achieved in that the die pick device, comprise the crystal grain cutting machine, the crystal grain cutting machine has the upper and lower, be connected with molybdenum filament between the upper and lower, also has the fixedly fixture of alloy bar between the upper and lower, it is characterized in that: below fixture, have an incline device, have the aperture that passes molybdenum filament on the incline device.
The beneficial effects of the utility model are: such die pick device has semiconductor grain can not fall into the advantage that can improve the quality of products again in the cutting machine slit.
Description of drawings
Fig. 1 is the structural representation of the utility model die pick device
Wherein, 1, top 2, bottom 3, fixture 4, molybdenum filament 5, incline device 6, aperture
Embodiment
The utility model will be further described below in conjunction with accompanying drawing.
As shown in Figure 1, the die pick device, comprise the crystal grain cutting machine, the crystal grain cutting machine has top 1 and bottom 2, be connected with molybdenum filament 4 between top 1 and the bottom 2, also have the fixedly fixture 3 of alloy bar between top 1 and the bottom 2, it is characterized in that: below fixture 3, have an incline device 5, have the aperture 6 that passes molybdenum filament on the incline device 5.
The crystal grain that cutting is finished glides along the inclined-plane, avoided it mutually to collide, be conducive to improve the quality of products, again because incline device only has an aperture that improves molybdenum filament, crystal grain can not fall in the slit of following cutting machine, has the advantage of saving and minimizing flight-line maintenance.
Claims (1)
1. die pick device, comprise the crystal grain cutting machine, the crystal grain cutting machine has the upper and lower, be connected with molybdenum filament between the upper and lower, also has the fixedly fixture of alloy bar between the upper and lower, it is characterized in that: below fixture, have an incline device, have the aperture that passes molybdenum filament on the incline device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201593618U CN201663152U (en) | 2010-04-15 | 2010-04-15 | Crystal grain picking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201593618U CN201663152U (en) | 2010-04-15 | 2010-04-15 | Crystal grain picking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201663152U true CN201663152U (en) | 2010-12-01 |
Family
ID=43233573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201593618U Expired - Fee Related CN201663152U (en) | 2010-04-15 | 2010-04-15 | Crystal grain picking device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201663152U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452648A (en) * | 2016-05-31 | 2017-12-08 | 致茂电子股份有限公司 | Die pick-up method |
-
2010
- 2010-04-15 CN CN2010201593618U patent/CN201663152U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107452648A (en) * | 2016-05-31 | 2017-12-08 | 致茂电子股份有限公司 | Die pick-up method |
| CN107452648B (en) * | 2016-05-31 | 2019-08-20 | 致茂电子股份有限公司 | Die pick-up method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101201 Termination date: 20110415 |