CN202239160U - Slicing device of lead frame - Google Patents
Slicing device of lead frame Download PDFInfo
- Publication number
- CN202239160U CN202239160U CN2011203174952U CN201120317495U CN202239160U CN 202239160 U CN202239160 U CN 202239160U CN 2011203174952 U CN2011203174952 U CN 2011203174952U CN 201120317495 U CN201120317495 U CN 201120317495U CN 202239160 U CN202239160 U CN 202239160U
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- slicing
- lead frame
- product
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- utility
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a slicing device of a lead frame, which comprises a raw material feeding device and a slicing controller, wherein a flattener, a slice feeding device and a slicing die are sequentially arranged on the same water level in the downstream of the raw material feeding device, the slicing die is connected with a slicing cylinder, and the flattener, the slice feeding device and the slicing die are all electronically connected with the slicing controller. Products sliced by the slicing device of the lead frame are accurate in dimension, product replacement is fast, and the slicing procedures are simplified. The utility model solves the problem of unstable product position and dimension during the product slicing process, the product quality is improved, labor and material wastes caused by multiple operations are reduced, and the production efficiency is improved.
Description
Technical field
The utility model relates to a kind of lead frame slicing device.
Background technology
Lead frame is as the chip carrier of integrated circuit; Be a kind of being electrically connected by means of bonding gold wire realization chip internal circuit exit and outer lead; Form the key structure spare of electric loop, it has played the function served as bridge that is connected with outer lead, all need use lead frame in the semiconductor integrated package of the overwhelming majority; Thereby lead frame is a basic material important in the electronics and information industry.
The lead frame product type has TO, DIP, ZIP, SIP, SOP, SSOP, QFP (QFJ), SOD, SOT etc.Mainly produce with mould pressing and chemical etching method.
The product space size is unstable in the existing lead frame slicing device slicing processes.
The utility model content
The utility model technical issues that need to address just are to overcome the defective of prior art, and a kind of lead frame slicing device is provided, and the product size that the utility model cuts out is accurate, and it is quick to change product, and slicing process is simplified.Solve product product space size instability problem in slicing processes, improved product quality, reduced the waste of the human and material resources that cause because of multiple operation, improved production efficiency.
For addressing the above problem, the utility model adopts following technical scheme:
The utility model provides a kind of lead frame slicing device; Comprise former feed device and section controller; On the same horizontal plane in former feed device downstream tenderizer is installed successively, send sheet device and section mould; Said section mould is connected with the section cylinder, tenderizer, send sheet device and section mould respectively with section controller electrical connection.
Be provided with photoelectric sensor between former feed device and the tenderizer, said photoelectric sensor is electrically connected with the section controller.
The product size that the utility model cuts out is accurate, and it is quick to change product, simplifies slicing process.Solve product product space size instability problem in slicing processes, improved product quality, reduced the waste that causes human and material resources because of multiple operation is suffered, improved production efficiency.
Description of drawings
Fig. 1 is the utility model structural representation.
The specific embodiment
As shown in Figure 1; The utility model provides a kind of lead frame slicing device; Comprise former feed device 1 and section controller 2; On the same horizontal plane in former feed device downstream tenderizer 3 is installed successively, send sheet device 4 and section mould 5, said section mould is connected with section cylinder 6, tenderizer, send sheet device and section mould respectively with the controller electrical connection of cutting into slices.
Be provided with photoelectric sensor 7 between former feed device and the tenderizer, said photoelectric sensor is electrically connected with the section controller.
The product size that the utility model cuts out is accurate, and it is quick to change product, simplifies slicing process.Solve product product space size instability problem in slicing processes, improved product quality, reduced the waste that causes human and material resources because of multiple operation is suffered, improved production efficiency.
What should explain at last is: obviously, the foregoing description only be for explain clearly that the utility model does for example, and be not qualification to embodiment.For the those of ordinary skill in affiliated field, on the basis of above-mentioned explanation, can also make other multi-form variation or change.Here need not also can't give exhaustive to all embodiments.And conspicuous variation of being amplified out thus or change still are among the protection domain of the utility model.
Claims (2)
1. lead frame slicing device; It is characterized in that: comprise former feed device and section controller; On the same horizontal plane in former feed device downstream tenderizer is installed successively, send sheet device and section mould; Said section mould is connected with the section cylinder, tenderizer, send sheet device and section mould respectively with section controller electrical connection.
2. lead frame slicing device as claimed in claim 1 is characterized in that: be provided with photoelectric sensor between former feed device and the tenderizer, said photoelectric sensor is electrically connected with the section controller.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203174952U CN202239160U (en) | 2011-08-29 | 2011-08-29 | Slicing device of lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203174952U CN202239160U (en) | 2011-08-29 | 2011-08-29 | Slicing device of lead frame |
Publications (1)
Publication Number | Publication Date |
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CN202239160U true CN202239160U (en) | 2012-05-30 |
Family
ID=46100463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011203174952U Expired - Fee Related CN202239160U (en) | 2011-08-29 | 2011-08-29 | Slicing device of lead frame |
Country Status (1)
Country | Link |
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CN (1) | CN202239160U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103084504A (en) * | 2013-03-05 | 2013-05-08 | 铜陵三佳山田科技有限公司 | Idler wheel feeding mechanism for integrated circuit punching and molding device |
CN106825195A (en) * | 2016-12-26 | 2017-06-13 | 铜陵富仕三佳机器有限公司 | A kind of anti-bias detection means in swash of wave road for full-automatic semiconductor packaging device |
-
2011
- 2011-08-29 CN CN2011203174952U patent/CN202239160U/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103084504A (en) * | 2013-03-05 | 2013-05-08 | 铜陵三佳山田科技有限公司 | Idler wheel feeding mechanism for integrated circuit punching and molding device |
CN103084504B (en) * | 2013-03-05 | 2015-04-15 | 铜陵三佳山田科技有限公司 | Idler wheel feeding mechanism for integrated circuit punching and molding device |
CN106825195A (en) * | 2016-12-26 | 2017-06-13 | 铜陵富仕三佳机器有限公司 | A kind of anti-bias detection means in swash of wave road for full-automatic semiconductor packaging device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20120829 |