CN201629318U - Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole - Google Patents
Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole Download PDFInfo
- Publication number
- CN201629318U CN201629318U CN201020122701XU CN201020122701U CN201629318U CN 201629318 U CN201629318 U CN 201629318U CN 201020122701X U CN201020122701X U CN 201020122701XU CN 201020122701 U CN201020122701 U CN 201020122701U CN 201629318 U CN201629318 U CN 201629318U
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- printed circuit
- heat
- inverted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a packaging structure with a printed circuit board, a flip chip and an inverted T-shaped heat dissipating block with a locking hole, which comprises the chip (3), the single-layer or multilayer printed circuit board (9) supported below the chip, metal convex blocks (10) for interconnecting signals from the chip to the single-layer or multilayer printed circuit board, a conductive or non-conductive heat conducting bonding material I (2) between the chip and the single-layer or multilayer printed circuit board and a plastic packaging body (8). The packaging structure is characterized in that the upper part of the chip (3) is provided with the heat dissipating block (7); the heat dissipating block (7) is provided with the locking hole (7.1); a conductive or non-conductive heat conducting bonding material II (6) is embedded between the heat dissipating block (7) and the chip (3); and the heat dissipating block (7) is of an inverted T-shaped structure. The utility model plays a function of heat dissipation of high heat by additionally arranging the heat dissipating block above the chip, can provide strong capability of dissipating heat and enables the heat of the chip to be rapidly conducted to the outside of the packaging body.
Description
(1) technical field
The utility model relates to a kind of chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, and providing a kind of can provide heat dissipation capability strong chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure.
The purpose of this utility model is achieved in that a kind of chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure, include chip, the single or multiple lift printed substrate that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I and plastic-sealed body, above described chip, be provided with radiating block, this radiating block has lock hole, is equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; This radiating block is inverted T-shape structure.
The beneficial effects of the utility model are:
The utility model is served as the function of the heat radiation of high heat by addition radiating block above chip, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is the utility model chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure schematic diagram.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, lock hole 7.1, plastic-sealed body 8, printed substrate 9, metal coupling 10.
(5) embodiment
Referring to Fig. 5, Fig. 5 is the utility model chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure schematic diagram.As seen from Figure 5, the utility model chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure, include chip 3, the single or multiple lift printed substrate 9 that is carried of chip below, the metal coupling 10 that chip is used to the signal interconnection of single or multiple lift printed substrate, conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I 2 and plastic-sealed body 8, above described chip 3, be provided with radiating block 7, this radiating block 7 has lock hole 7.1, is equipped with conduction or nonconducting heat conduction bonding material II6 between this radiating block 7 and the described chip 3; This radiating block 7 is inverted T-shape structure.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.
Claims (3)
1. chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift printed substrate (10), conduction between chip and the described single or multiple lift printed substrate or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7) in described chip (3) top, this radiating block (7) has lock hole (7.1), is equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3); This radiating block (7) is inverted T-shape structure.
2. a kind of chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of chip of printed circuit board upside-down mounting inverted T shape lock hole heat dissipation block packaging structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020122701XU CN201629318U (en) | 2010-01-29 | 2010-01-29 | Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020122701XU CN201629318U (en) | 2010-01-29 | 2010-01-29 | Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201629318U true CN201629318U (en) | 2010-11-10 |
Family
ID=43060716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020122701XU Expired - Fee Related CN201629318U (en) | 2010-01-29 | 2010-01-29 | Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201629318U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326486A (en) * | 2018-12-14 | 2020-06-23 | 深圳市中兴微电子技术有限公司 | Packaging structure and manufacturing method thereof |
-
2010
- 2010-01-29 CN CN201020122701XU patent/CN201629318U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326486A (en) * | 2018-12-14 | 2020-06-23 | 深圳市中兴微电子技术有限公司 | Packaging structure and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201629318U (en) | Packaging structure with printed circuit board, flip chip and inverted T-shaped heat dissipating block with locking hole | |
| CN201623133U (en) | Packaging structure of printed circuit board with flip chip and rectangular radiating block with locking hole | |
| CN201623033U (en) | Packaging structure with exposed inner pin, flip chip and heat dissipating block with T-shaped locking hole | |
| CN201623116U (en) | Package structure of inversed T-shaped heat dissipation part with locking hole of resin circuit board chip flip | |
| CN201623132U (en) | Package structure of rectangular heat dissipation part with locking hole of resin circuit board chip flip | |
| CN201623022U (en) | Packaging structure of printed circuit board with flip chip connected with external radiating board | |
| CN201629323U (en) | Packaging structure with printed circuit board, flip chip and heat dissipating block with locking hole and protruded surface | |
| CN201629325U (en) | Packaging structure with printed circuit board, flip chip and fully encapsulated heat dissipating block | |
| CN201629317U (en) | Packaging structure with printed circuit board, flip chip, heat dissipating block with locking hole and external heat dissipating cap | |
| CN201623122U (en) | Packaging structure of printed circuit board chip flip belt locking hole radiating block | |
| CN201623090U (en) | Packaging structure with exposed inner pin, flip chip and heat dissipating block with rectangular locking hole | |
| CN201623149U (en) | Packaging structure of printed circuit board chip flip inverted T-shaped locking hole radiating block with external radiator | |
| CN201623109U (en) | Packaging structure of printed circuit board with flip chip and radiating block with locking hole connected with external radiating board | |
| CN201623032U (en) | Packaging structure with exposed inner pin, flip chip and heat dissipating block with locking hole | |
| CN201629319U (en) | Flip sealing structure of resin circuit board chip with heat dissipation block | |
| CN201623100U (en) | Packaging structure of printed circuit board with flip chip and radiating block with locking hole connected with external radiator | |
| CN201623136U (en) | Packaging structure of printed circuit board chip flip inverted T-shaped radiating block | |
| CN201623074U (en) | Package structure of external radiator of heat dissipation part with locking hole of resin circuit board chip flip | |
| CN201623144U (en) | Package structure of heat dissipation part with locking hole of resin circuit board chip flip | |
| CN201623117U (en) | Fully-enclosed Packaging structure of printed circuit board chip flip inverted T-shaped radiating block | |
| CN201751983U (en) | Resin circuit board chip inverted lock hole rectangular heat-radiating block external radiator encapsulation structure | |
| CN201623055U (en) | Printed circuit board chip positive mounting heat radiation block surface protruding encapsulation structure with locking hole | |
| CN201751992U (en) | Encapsulation structure with inversely-mounted printed circuit board and chip, as well as rectangular heat dissipation block and external connected radiator | |
| CN201623102U (en) | Printed substrate chip inverted heat dissipation cap packaging structure externally connected with locking hole and heat dissipation block and protruding column | |
| CN201751995U (en) | Packaging structure of flipped chip heat radiation block externally connected with radiator for printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101110 Termination date: 20140129 |