CN201471038U - Selective de-bridging device for wave-soldering - Google Patents
Selective de-bridging device for wave-soldering Download PDFInfo
- Publication number
- CN201471038U CN201471038U CN2009201859708U CN200920185970U CN201471038U CN 201471038 U CN201471038 U CN 201471038U CN 2009201859708 U CN2009201859708 U CN 2009201859708U CN 200920185970 U CN200920185970 U CN 200920185970U CN 201471038 U CN201471038 U CN 201471038U
- Authority
- CN
- China
- Prior art keywords
- hot blast
- bridging
- guide rail
- selective
- wave soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a selective de-bridging device for wave-soldering, which comprises an air supply device (1) and a hot air blowing device (2) connected with the air supply device through an air delivery pipeline, and a heating device (3) is arranged between the air supply device (1) and the hot air blowing device. The selective de-bridging device is characterized in that a sliding guide track (4) is arranged at the lower end of a hot air treatment device, and a driving device (5) is arranged on one side of the sliding guide track and drives the hot air treatment device to conduct to-and-fro slippage on the sliding guide track. The selective de-bridging device has an accurate positioning of selective de-bridging position after wave-soldering, and has a distinct de-bridging effect; and can conduct the de-bridging treatment of multiple bridging regions by simply arranging one air delivery pipeline, resulting in simple structure and low cost.
Description
Technical field
Go the bridging technical field after the invention belongs to wave soldering, be specifically related to a kind of translation and locate heat treated selective bridging removing device for wave soldering.
Background technology
Wave-soldering is meant the solder (terne metal) with fusing, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder that is electrically connected between components and parts weldering end or pin and the printed board pad.Wave-soldering technology generally comprises to be inserted element in the corresponding component hole, pre-coated soldering flux, in the preheating zone of the about 1-1.8m of length temperature 90-100 ℃ of following preheating, scaling powder is activated, carry out wave-soldering under 220-240 ℃ of temperature then, excise unnecessary plug-in unit pin, check.In the process of carrying out the wiring board assembling with wave-soldering, the welding bridging is the defective that often occurs.Address this problem, except improving technological parameter, can also on Wave soldering apparatus, install a kind of selective bridging removing device additional.
The technical scope that printed substrate assembling comprises is very wide, the two-sided reflow assembling from the single face through-hole mounting to complexity, and ball grid array (BGA) device etc. that need carry out the selectivity wave soldering.When these planks are carried out wave soldering, often can see that (locating as connector etc.) can form bridging, and these defectives just can expect in fact in advance in some fixing zone.The carriage that bridging is used during normally because of the reason of plank design or welding causes, and wants thoroughly to separate anything but to be easy to, and therefore has only by reprocessing and eliminates defective, thereby prolonged the production cycle.From the angle of electronics manufacturer (EMS), the design of change plank generally is unlikely, has only from technology and tries every possible means.Experimental results show that with the selective bridging removing technology and can improve the yield rate of assembling greatly.
A kind of unsettled variable condition causes owing to scolder is in the welding bridging, and it occurs in the solder reflow zone of wave soldering back segment.Scolder bounced back suddenly and causes solder reflow when plank left crest, and the scolder of a large amount of fusions just forms bridging at last in the recirculating zone.Scolder under the molten condition runs into its wetability of any small sample perturbations and all can be easy to change, so the formation of scolder bridging and PCB and wave-soldering technology all have very big relation.
Crossed and gone to search bridging again after the wave-soldering and reprocess increases production cost and workload then, and people generally believe that the solder joint through repairing can reduce reliability of products.Through research for many years, developed the technology that a variety of final stage in wave soldering reduce bridging in the prior art, for example entire plate hot blast cutter is handled (solder joint that blows to fusion with a branch of air or nitrogen is with the removal bridging) is exactly a kind of standard technique for many years of having used in wave-soldering to postwelding.But this method does not have selectivity to welding region, and the solder joint that makes also is under some influence.To this, Chinese patent ZL03823359.2 discloses a kind of selectivity air knife that is used for wave-soldering on October 19th, 2005, this air knife is arranged on and is adapted at matrix and crosses the position that makes the air impingement matrix after the fusion welding crest, comprise numerous sections, each section all has one or more guide grooves that are used for sending by the selectivity air knife gas; With the adjuster that comprises independently the air-flow of regulating each section of flowing through.Because the air knife position is fixed in this patent, by the air knife that a plurality of guide grooves are connected with guide groove is set; The keying of control guide groove comes selectivity to open and close air flue realization selective bridging removing.
This selective bridging removing mode makes its contingent zone of aligning bridging reach the purpose of removing bridging by adjusting airflow direction.This instrument is used in the place that wiring board has just withdrawed from crest, and this moment, scolder still was in molten condition, and spray regime and other technological parameter are used program setting earlier, and are controlled by the computer in the welding system.The key that realizes selective bridging removing is to adjust air-flow exactly, and makes nozzle be positioned as close to PCB under discontiguous situation.Yet multiple tracks guide groove and gas supply adopt the solenoid mode to make whole cost too high, and the selection location of wiring board is not accurate enough, also make the involving great expense of integral device, and the present invention is in order to solve these defectives.
Summary of the invention
The object of the invention is to provide a kind of selective bridging removing device for wave soldering, has solved problems such as welding region selectivity location poor effect, the single unit system cost of selectivity air knife in the prior art is too high.
In order to solve these problems of the prior art, technical scheme provided by the invention is:
A kind of selective bridging removing device for wave soldering, the device that comprises gas supply device and the blowing hot-air that is connected by gas transmission pipeline with gas supply device, between the device of described gas supply device and blowing hot-air heater is set, it is characterized in that described hot blast treating apparatus lower end is provided with the slippage guide rail, described slippage guide rail one side is provided with drive unit, and described drive unit drives the hot blast treating apparatus and slidably reciprocates on the slippage guide rail.
Preferably, described slippage guide rail fixed mount is located at the lower end of wave-soldering carrier chain, and described hot blast treating apparatus comprises the hot blast cutter, and described hot blast cutter lower end is provided with the slippage guide rail and cooperates the slide block that slides, and described slide block can slidably reciprocate on linear guides.
Preferably, described slippage guide rail is arranged on the lower end of the carrier chain at tin cylinder rear, Way out place, and the hot blast of described hot blast cutter blows to the carrier chain transmission direction and parallels.
Preferably, described device also comprises control system, and described slippage guide rail two ends are set with the position sensor that detects the hot blast processing unit, and described position sensor is connected with control system.
Preferably, described heater heats with heating rod, and described heating rod is arranged in the gas transmission pipeline, the temperature sensor that an end setting of described heating rod is connected with control system.
Preferably, described drive unit is a stepper motor, two ends are set with belt pulley in the described rail plate, sheathed synchronous band on the described belt pulley, described hot blast processing unit is vertical spacing on the slippage guide rail by slide block, and fix with synchronous band, the belt pulley of described stepper motor transmission one side rotates and drives hot blast treating apparatus horizontal slip location.
Preferably, described control system is connected with drive unit, the drive displacement of accessory drive and speed.
Preferably, described hot blast cutter lower end is provided with displacement governor, and described displacement governor can be used for regulating the position of hot blast cutter.
Preferably, described slippage guide rail is the aluminum guide rail.
The solder joint bridging and causes short circuit phenomenon together when the plug-in unit welding process can be owing to components and parts are too intensive cause soldering to connect.Adopt hot blast to blow disconnected connection status point when liquid, hot blast is by heating rod the gas heating to be blown out by pressure again, and gas temperature can control, hot-air mouth direction and can regulate to the distance of pcb board.Bridging position on the pcb board and bridging zone can be selected to handle by software editing.The motion of this device is to drive the belt pulley of rail unit by stepper motor, thereby realizes the mechanical movement back and forth of whole unit.The gas control mode of supply is controlled the flow direction by pressure switch and unidirectional quick connector, makes that being unlikely to high-temperature gas has backflow.
With respect to scheme of the prior art, advantage of the present invention is:
1. technical solution of the present invention is provided with the slippage guide rail in hot blast treating apparatus lower end, navigate to bridging zone or bridging position by the hot blast treating apparatus at the enterprising line slip of slippage guide rail, thereby more go accurately the bridging work of treatment, prevent the interference of bridging processing normal solder joint.Because the hot blast treating apparatus is advanced and retreat by the drive unit stepper drive; Handle the position that can use control system such as software location hot blast treating apparatus to arrive bridging.
2. the described heater of optimal technical scheme of the present invention is arranged in the gas transmission pipeline, gas temperature after temperature sensor by other end setting will heat passes to control system, open and close the hot blast cutter by control system control, make the gas after the heating have the temperature that needs.Displacement governor and pressure regulator also are set in apparatus of the present invention in addition, make the hot blast cutter keep accurate bridging position and required gas pressure, finish bridging and handle.
3. be provided with in the slippage guide rail in the optimal technical scheme of the present invention synchronously with sheathed belt pulley, drive the radial slippage location of hot blast treating apparatus along carrier chain thereby drive unit such as stepper motor motor drive belt pulley.Preferably, the air-blowing direction of the hot blast cutter of described hot blast treating apparatus is near paralleling with the throughput direction of carrier chain, and the crest that reduces soldered circuit board exerts an influence, and has also reduced gas and has entered crest, makes the crest instability.
In sum, behind the wave-soldering of this device selective bridging removing position location accurately, go the bridging effect remarkable, and only go the bridging processing with what be provided with that a gas transmission pipeline just can finish bridging zone, many places, device simple in structure reduced cost.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1 is the upward view of embodiment of the invention selective bridging removing device for wave soldering;
Fig. 2 is the front view of embodiment of the invention selective bridging removing device for wave soldering;
Fig. 3 is the right view of embodiment of the invention selective bridging removing device for wave soldering.
Wherein: 1 is gas supply device, and 2 is the hot blast treating apparatus, and 3 is heater, and 4 are the slippage guide rail, and 5 is drive unit, and 6 is position sensor, and 21 is the hot blast cutter, and 22 is slide block, and 23 is displacement governor, and 24 is pressure regulator; 31 is temperature sensor.
The specific embodiment
Below in conjunction with specific embodiment such scheme is described further.Should be understood that these embodiment are used to the present invention is described and are not limited to limit the scope of the invention.The implementation condition that adopts among the embodiment can be done further adjustment according to the condition of concrete producer, and not marked implementation condition is generally the condition in the normal experiment.
Embodiment is as figure, this selective bridging removing device for wave soldering, the device 2 and the control system that comprise gas supply device 1 and the blowing hot-air that is connected by gas transmission pipeline with gas supply device, between the device of described gas supply device 1 and blowing hot-air heater 3 is set, described heater is a heating rod, described heating rod is arranged in the gas transmission pipeline, the temperature sensor 31 that an end setting of described heating rod is connected with control system.
Hot blast treating apparatus lower end is provided with slippage guide rail 4, and described slippage guide rail one side is provided with drive unit 5, and described drive unit 5 drives the hot blast treating apparatus and close slip on the slippage guide rail.Described slippage guide rail 4 fixed mounts are located at the lower end of the carrier chain at tin cylinder rear, Way out place, described hot blast treating apparatus comprises hot blast cutter 21, described hot blast cutter lower end is provided with the slippage guide rail and cooperates the slide block 22 that slides, and described slide block can slidably reciprocate on linear guides.Described slippage guide rail two ends are set with the position sensor 6 that detects hot blast treating apparatus position, and described position sensor 6 is connected with control system.
This slippage guide rail 4 is arranged on the lower end of the carrier chain at tin cylinder rear, Way out place, and the hot blast of described hot blast cutter blows to the carrier chain transmission direction and parallels.Described drive unit 5 is a stepper motor, two ends are set with belt pulley in the described slippage guide rail, sheathed synchronous band on the described belt pulley, described hot blast treating apparatus is vertical spacing on the slippage guide rail by slide block 22, and fix with synchronous band, the belt pulley of described stepper motor transmission one side rotates and drives hot blast treating apparatus horizontal slip location.
Control system is connected with drive unit, the drive displacement of accessory drive and speed.Described hot blast cutter lower end is provided with displacement governor 23, and described displacement governor 23 can be used to regulate the position of hot blast cutter.Described slippage guide rail is the aluminum guide rail.
The selective bridging removing device of present embodiment drives the hot blast treating apparatus by drive unit and slides on the slippage guide rail that radially is provided with, the bridging operation is gone in the bridging position or the bridging zone that navigate to circuit board, adopt the stepper motor control position accurate, go the bridging effect superior, and simplified the structure of bridging removing device, make cost greatly reduce.
Above-mentioned example only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the people who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.All spirit essence is done according to the present invention equivalent transformation or modification all should be encompassed within protection scope of the present invention.
Claims (9)
1. selective bridging removing device for wave soldering, the device (2) that comprises gas supply device (1) and the blowing hot-air that is connected by gas transmission pipeline with gas supply device, heater (3) is set between the device of described gas supply device (1) and blowing hot-air, it is characterized in that described hot blast treating apparatus lower end is provided with slippage guide rail (4), described slippage guide rail one side is provided with drive unit (5), and described drive unit (5) drives the hot blast treating apparatus and slidably reciprocates on the slippage guide rail.
2. selective bridging removing device for wave soldering according to claim 1, it is characterized in that described slippage guide rail (4) is fixed on the lower end of the carrier chain at tin cylinder rear, Way out place, described hot blast treating apparatus comprises hot blast cutter (21), described hot blast cutter lower end is provided with the slippage guide rail and cooperates the slide block (22) that slides, and described slide block can slidably reciprocate on linear guides.
3. selective bridging removing device for wave soldering according to claim 1 is characterized in that described slippage guide rail (4) is arranged on the lower end of the carrier chain at tin cylinder rear, Way out place, and the hot blast of described hot blast cutter blows to the carrier chain transmission direction and parallels.
4. selective bridging removing device for wave soldering according to claim 1, it is characterized in that described device also comprises control system, described slippage guide rail two ends are set with the position sensor (6) that detects the hot blast processing unit, and described position sensor (6) is connected with control system.
5. selective bridging removing device for wave soldering according to claim 1, it is characterized in that described heater is to heat with heating rod, described heating rod is arranged in the gas transmission pipeline, the temperature sensor (31) that an end setting of described heating rod is connected with control system.
6. selective bridging removing device for wave soldering according to claim 1, it is characterized in that described drive unit (5) is a stepper motor, two ends are set with belt pulley in the described rail plate, sheathed synchronous band on the described belt pulley, described hot blast processing unit is vertical spacing on the slippage guide rail by slide block (22), and fix with synchronous band, the belt pulley of described stepper motor transmission one side rotates and drives hot blast treating apparatus horizontal slip location.
7. selective bridging removing device for wave soldering according to claim 1 is characterized in that described control system is connected the drive displacement and the speed of accessory drive (5) with drive unit (5).
8. selective bridging removing device for wave soldering according to claim 1 is characterized in that described hot blast cutter lower end is provided with displacement governor (23), and described displacement governor (23) can be used for regulating the position of hot blast cutter on transmission direction.
9. selective bridging removing device for wave soldering according to claim 1 is characterized in that described slippage guide rail is the aluminum guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201859708U CN201471038U (en) | 2009-07-21 | 2009-07-21 | Selective de-bridging device for wave-soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201859708U CN201471038U (en) | 2009-07-21 | 2009-07-21 | Selective de-bridging device for wave-soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201471038U true CN201471038U (en) | 2010-05-19 |
Family
ID=42407278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201859708U Expired - Fee Related CN201471038U (en) | 2009-07-21 | 2009-07-21 | Selective de-bridging device for wave-soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201471038U (en) |
-
2009
- 2009-07-21 CN CN2009201859708U patent/CN201471038U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6168065B1 (en) | Movable selective debridging apparatus for debridging soldered joints on printed circuit boards | |
| CN112045268A (en) | Full-automatic selective wave soldering device | |
| CN101352773B (en) | Device for selectively welding through-hole component and welding method | |
| CN206356711U (en) | A kind of full-automatic stud welding device | |
| CN101648306A (en) | Selective bridging removing device for wave soldering | |
| KR20150032099A (en) | Soldering apparatus using induction heating | |
| WO2008030272A2 (en) | System, apparatus and methods for board cooling | |
| CN1684789A (en) | Selective gas knife for wave soldering | |
| CN203265821U (en) | Compact type selective welding system | |
| CN107398615B (en) | Jet flow soft brazing filler metal trough and jet flow soldering device | |
| CN201471038U (en) | Selective de-bridging device for wave-soldering | |
| CN208276312U (en) | A kind of camera module sensitive chip encapsulation soldering removal device | |
| CN212577735U (en) | Full-automatic selective wave soldering device | |
| CN205356821U (en) | PCB reprocesses heating device | |
| CN112139620B (en) | Device and method for full-automatic control of selective wave soldering | |
| CN219395438U (en) | Curing oven of SMT assembly line | |
| CN113751817A (en) | Dip soldering device and corresponding full-automatic dip soldering machine | |
| CN206277012U (en) | A kind of wire riveting position adds tin equipment | |
| CN104470245A (en) | Wave soldering process for LED plug-in lamp panel | |
| CN201629916U (en) | Full-automatic wave wind reflow welding machine | |
| JP2012146842A (en) | Selective soldering device and selective soldering method | |
| CN204669740U (en) | Sweep welding machine | |
| CN206005032U (en) | Bonding machine | |
| CN204129498U (en) | A kind of crest welder intelligent monitoring and controlling device | |
| JP7141001B1 (en) | jet soldering machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100519 Termination date: 20160721 |