CN212577735U - Full-automatic selective wave soldering device - Google Patents
Full-automatic selective wave soldering device Download PDFInfo
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- CN212577735U CN212577735U CN202022139199.XU CN202022139199U CN212577735U CN 212577735 U CN212577735 U CN 212577735U CN 202022139199 U CN202022139199 U CN 202022139199U CN 212577735 U CN212577735 U CN 212577735U
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Abstract
The application provides a full-automatic selectivity wave soldering device, includes: the conveying guide rail is provided with a spraying fixing position, a preheating fixing position and a welding fixing position, and is provided with a sliding tray which slides along the plate inlet guide rail and the plate outlet guide rail, and a printed circuit board to be welded is placed on the sliding tray; scaling powder spraying mechanism is located spraying fixed position and is in slip tray below, includes: a vertical double-shaft moving table and a soldering flux sprayer; double-deck mechanism of preheating is located and preheats fixed position, includes: an upper preheater and a lower preheater; an upper preheater; selective welding mechanism, be located the weld fixture position and be in the slip tray below, include: a vertical three-axis mobile station and a soldering tin furnace; and the controller is connected with the conveying guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism. The utility model discloses can realize saving scaling powder, reduce energy consumption, and have the automatic wave-soldering of stronger uniformity, repeatability, reliability and traceability.
Description
Technical Field
The application relates to the technical field of welding, in particular to a full-automatic selective wave soldering device.
Background
Wave soldering is a soldering process in which the soldering surface of a plug-in board is directly contacted with high-temperature liquid tin, the high-temperature liquid tin keeps an inclined surface, and the liquid tin forms a wave-like phenomenon by a special device, so the wave soldering is called as wave soldering, and the main material of the wave soldering is a soldering tin bar. With the rapid development of Surface Mount Technology (SMT) technology driven by the trend of high density and miniaturization of electronic product manufacturing processes, the conventional wave soldering process cannot meet the soldering requirements of the remaining few through-hole components, and it is difficult to manually solder the components with large thermal capacity or fine pitch, and the cost advantage of labor force compared with machine equipment is gradually lost.
The selective wave soldering, also called selective soldering, applies equipment in the field of PCB plug-in through hole soldering, and is a multi-axis control platform which is controlled by a program and is provided with a soldering flux nozzle and a tin furnace. In the field of through hole welding of PCBs in recent years, the trend gradually becomes popular in through hole welding, and the method is applied to multi-layer PCB through hole welding with high welding requirements and complex processes. After the PCB is transported and positioned on line through a track, firstly, the soldering flux is accurately sprayed on the part to be welded on the PCB, then, an accurate annular mini solder wave crest is created through a small-sized nozzle (the diameter is usually 2-4 mm) and a solder pump, and welding is carried out from the bottom of the PCB through a multi-axis control platform.
The selective wave soldering is divided into off-line selective wave soldering and on-line selective wave soldering: off-line selective wave soldering, namely an off-line mode with a production line, wherein the welding mode that the welding agent spraying machine and the selective welding machine are separated is adopted, and the preheating module follows the welding part and is combined with a man-machine. On-line selective wave soldering can receive full-automatic butt joint of production line data in real time, and the welding agent module of group preheats module welding module integral type structure, is fit for the higher production mode of automation requirement through full-automatic chain transmission. However, in the current linear selective wave soldering, manually adjusting the position of the MARK point is needed, and a positioning welding error is caused in the welding process; the soldering flux is easy to scatter, the spraying is not accurate, the welding process cannot be displayed in real time, and the purpose of accurate and automatic welding cannot be achieved.
Therefore, how to provide a wave soldering scheme with strong consistency, repeatability, reliability and traceability, which can save soldering flux and reduce energy consumption, is a technical problem to be solved in the field.
SUMMERY OF THE UTILITY MODEL
An object of the application is to provide a full-automatic selectivity wave soldering device, solve prior art and do not have the scaling powder that can save, reduce energy consumption, and have the technical problem of the wave soldering scheme of stronger uniformity, repeatability, reliability and traceability.
To achieve the above object, the present application provides a full-automatic selective wave soldering apparatus, comprising: the device comprises a conveying guide rail, a soldering flux spraying mechanism, a double-layer preheating mechanism, a selective welding mechanism and a controller; wherein the content of the first and second substances,
the conveying guide rail comprises a board inlet guide rail and a board outlet guide rail, wherein the guide rail between the board inlet guide rail and the board outlet guide rail is provided with a spraying fixing position, a preheating fixing position and a welding fixing position, a sliding tray sliding along the board inlet guide rail and the board outlet guide rail is arranged, and a printed circuit board to be welded is placed on the sliding tray;
scaling powder spraying mechanism is located spraying fixed position is in slide tray below, includes: a vertical double-shaft moving table and a soldering flux sprayer; a movable platen is arranged on the vertical double rails of the vertical double-shaft movable table; the scaling powder sprayer is positioned on the movable platen and driven by the movable platen to perform biaxial movement, and a spray head of the scaling powder sprayer faces the printed circuit board;
double-deck preheating machine constructs, is located preheat fixed position, include: an upper preheater and a lower preheater; the upper preheater is positioned above the printed circuit board and preheats the printed circuit board; the lower preheater is positioned below the printed circuit board and used for preheating the lower part of the printed circuit board;
the selective welding mechanism, located at the weld fixture location, is located below the sliding tray, comprising: the welding tin furnace is positioned on a movable platen of the vertical three-axis movable table, and a welding nozzle faces the printed circuit board; further comprising: the positioning camera is connected with the controller and shoots and transmits the shot to the controller by aiming at the welding surface of the printed circuit board; the high-bottom probe is positioned at the wave crest correction position of the selective welding mechanism and detects the wave crest height when the welding tin furnace moves to the correction position;
the controller is connected with the transportation guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism; and controlling a motor to drive the conveying guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism to move according to a control instruction.
Optionally, wherein the apparatus further comprises: the clamping plate mechanism is positioned above the spraying fixing position, the preheating fixing position and the welding fixing position, is provided with an up-and-down moving track and is connected with the controller; and the controller controls the downward movement to be matched with the sliding tray, the printed circuit board is clamped and fixed, and the controller moves upward to release the clamping of the printed circuit board.
Optionally, wherein the vertical dual-axis mobile station comprises: the driving guide rail, the driven guide rail and the movable bedplate; wherein the content of the first and second substances,
the active guide rail comprises: the main guide rail body, the main ball screw and the main ball fixing block; the main ball screw is fixed on the blocking plate at one end of the main guide rail body through the main ball fixing block and extends along the guide rail direction of the main guide rail body;
the driven guide rail includes: the auxiliary guide rail body, the auxiliary ball screw, the auxiliary ball fixing block and the main screw rod slide block; the auxiliary ball screw is fixed on the stop plate at one end of the auxiliary guide rail body through the auxiliary ball fixing block and extends along the guide rail direction of the auxiliary guide rail body; the main screw rod slide block is arranged on the auxiliary guide rail body, extends in a direction perpendicular to the guide rail direction of the auxiliary guide rail body, and is matched with the main ball screw rod to drive the driven guide rail to move back and forth in the direction of the main ball screw rod;
the movable bedplate is provided with a slave screw rod slide block, extends along the guide rail direction of the slave guide rail body, and is matched with the slave ball screw rod to drive the movable bedplate to move back and forth in the slave ball screw rod direction.
Optionally, a dust guard is further disposed on the movable platen, and the length and the width of the dust guard are greater than the widths of the driving guide rail and the driven guide rail.
Optionally, wherein the vertical three-axis mobile station includes: the device comprises a vertical guide rail, a horizontal driving guide rail, a horizontal driven guide rail and a movable bedplate; wherein the content of the first and second substances,
the vertical guide rail, the perpendicular to horizontal initiative guide rail and the vertical placing of horizontal driven guide rail include: the vertical rail body, the vertical ball screw and the vertical ball fixing block; the vertical ball screw is fixed on the blocking plate at one end of the vertical rail body through the vertical ball fixing block and extends along the direction of the guide rail of the vertical rail body;
the horizontal active guide rail comprises: the main guide rail body, the main ball screw, the main ball fixing block and the vertical screw rod sliding block are arranged on the main guide rail body; the main ball screw is fixed on the blocking plate at one end of the main guide rail body through the main ball fixing block and extends along the guide rail direction of the main guide rail body; the vertical screw rod sliding block is arranged on the main guide rail body, extends in a direction perpendicular to the guide rail direction of the main guide rail body, and is matched with the vertical ball screw rod to drive the driving guide rail to move back and forth in the direction of the vertical ball screw rod;
the horizontally driven guide rail comprises: the auxiliary guide rail body, the auxiliary ball screw, the auxiliary ball fixing block and the main screw rod slide block; the auxiliary ball screw is fixed on the stop plate at one end of the auxiliary guide rail body through the auxiliary ball fixing block and extends along the guide rail direction of the auxiliary guide rail body; the main screw rod slide block is arranged on the auxiliary guide rail body, extends in a direction perpendicular to the guide rail direction of the auxiliary guide rail body, and is matched with the main ball screw rod to drive the driven guide rail to move back and forth in the direction of the main ball screw rod;
the movable bedplate is provided with a slave screw rod slide block, extends along the guide rail direction of the slave guide rail body, and is matched with the slave ball screw rod to drive the movable bedplate to move back and forth in the slave ball screw rod direction.
Optionally, in the double-layer preheating mechanism, the lower preheater is a far infrared spot lamp and is located below the printed circuit board; go up the pre-heater, for hot-blast accuse temperature goes up the pre-heater, include: the wind control device comprises a wind control shell, a fan and a position adjusting track; the wind control shell is a wind cover positioned above the printed circuit board; the fan is positioned in the fan cover and used for extracting hot air upwards; the position adjusting track is connected with and drives the wind control shell to move.
Optionally, a heat insulating layer is surrounded outside the casing of the wind control casing, and a heat dissipation air suction hood is arranged above the wind control casing.
Optionally, wherein the apparatus further comprises: a rail adjuster, comprising: the guide rail adjusting motor, the guide rail width adjusting screw rod and the guide rail height adjusting screw rod are arranged on the guide rail; the guide rail width adjusting screw is positioned between the two guide rail strips of the conveying guide rail, and is driven by the guide rail adjusting motor to move by matching with screw rod sliding blocks on the two guide rail strips so as to adjust the width between the two guide rail strips; the guide rail height adjusting lead screw is perpendicular to the conveying guide rail, and the guide rail adjusting motor drives the guide rail adjusting lead screw to be matched with a lead screw sliding block on the conveying guide rail to move and adjust the height of the conveying guide rail.
Optionally, clamping plates are arranged on two sides of the transport rail, and the printed circuit board is clamped on two sides; and the spraying blocking plate, the preheating blocking plate and the welding blocking plate are respectively arranged at the spraying fixing position, the preheating fixing position and the welding fixing position, when the printed circuit board is respectively in the spraying stage, the preheating stage or the welding stage, the printed circuit board is movably blocked in front of the printed circuit board, and when the spraying stage, the preheating stage or the welding stage is completed, the printed circuit board is movably unblocked.
Optionally, wherein the transport rail comprises: two opposite guide rail strips, a motor and a guide rail belt; the inner side of the guide rail strip is provided with a guide rail belt groove which is sunken inwards; the guide rail belt is a roller and/or a chain, is arranged in the guide rail belt groove and is positioned below the sliding tray, and the sliding tray is driven to move by the motor.
The utility model provides a full-automatic selectivity wave soldering device, the beneficial effect who realizes is at least as follows:
(1) the full-automatic selective wave soldering device controls the transportation guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism through the controller, selective partial welding is carried out on the PCB on line, the scaling powder spraying is carried out in a production line type series connection mode, double-layer preheating and selective welding are carried out, the welded PCB is completed, the transportation guide rail is used for outputting, welding operation cost is reduced, labor expenditure is saved, and operation benefits are improved.
(2) According to the full-automatic selective wave soldering device, the soldering flux can be prevented from scattering in a mode of spraying below and adsorbing above the PCB, and the soldering flux is only accurately sprayed on the part to be soldered on the bottom surface of the PCB instead of the whole PCB, so that the area outside the soldering point is not polluted; the spraying welding adopts the biax to remove during the spraying welding, blocks and the centre gripping location, has promoted the spraying precision, and then has improved welding quality, has promoted welded through rate by a wide margin.
(3) The utility model provides a full-automatic selectivity wave soldering device, through PCB board below fluorescent tube, combine the good PCB board of top wind-heat convulsions preheating spraying, set up in the wind-heat shell outside and prevent heat radiation structure and insulating layer, join in marriage the far infrared shot-light heating from top to bottom, the position is adjustable, and heating power is adjustable, can carry out online selectivity wave soldering more accurately, high-efficiently.
(4) The full-automatic selective wave soldering device carries out Mark's camera location through the location camera, shows welding process in real time, combines high base probe to regularly carry out wave positioning adjustment proofreading, has promoted selective wave soldering's accuracy.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art according to the drawings.
Fig. 1 is a schematic structural view of a full-automatic selective wave soldering apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a spraying, preheating and welding mechanism of the full-automatic selective wave soldering apparatus according to the embodiment of the present invention;
fig. 3 is a schematic structural view of a transportation rail of the full-automatic selective wave soldering apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a flux spraying mechanism of the fully automatic selective wave soldering apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a vertical dual-axis mobile station of a flux spraying mechanism of a full-automatic selective wave soldering apparatus according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an applied vertical dual-axis mobile station of a flux spraying mechanism of a full-automatic selective wave soldering apparatus according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an upper preheater of a double-layer preheating mechanism of the full-automatic selective wave soldering apparatus according to the embodiment of the present invention;
fig. 8 is a schematic structural diagram of a vertical three-axis mobile station of a full-automatic selective wave soldering apparatus according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of an embodiment of the present invention, in which a vertical three-axis mobile station is applied, in a full-automatic selective wave soldering apparatus;
fig. 10 is a schematic structural diagram of a housing of a full-automatic selective wave soldering apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application are clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Examples
As shown in fig. 1 to 10, fig. 1 is a schematic structural diagram of a full-automatic selective wave soldering apparatus in the present embodiment; FIG. 2 is a schematic structural diagram of a spraying, preheating and welding mechanism of the fully automatic selective wave soldering apparatus according to the present embodiment; FIG. 3 is a schematic structural view of a transportation rail of the full-automatic selective wave soldering apparatus according to the present embodiment; FIG. 4 is a schematic diagram of a flux spraying mechanism of the fully automatic selective wave soldering apparatus according to the present embodiment; FIG. 5 is a schematic diagram of a vertical dual-axis mobile station of a flux spraying mechanism of the fully automatic selective wave soldering apparatus according to the embodiment; FIG. 6 is a schematic diagram of a vertical dual-axis mobile station applied to a flux spraying mechanism of the fully automatic selective wave soldering apparatus according to the embodiment; FIG. 7 is a schematic structural diagram of an upper preheater of a dual preheating mechanism of the fully automatic selective wave soldering apparatus according to the present embodiment; FIG. 8 is a schematic diagram of a vertical three-axis mobile station of the fully automatic selective wave soldering apparatus of the present embodiment; FIG. 9 is a schematic diagram of a vertical three-axis mobile station of the full-automatic selective wave soldering apparatus of the present embodiment; fig. 10 is a schematic structural diagram of a housing of the full-automatic selective wave soldering apparatus according to the embodiment. The full-automatic selective wave soldering device of this embodiment need not manual operation, can carry out the selective wave soldering of PCB board automatically, and the scaling powder consumption is few, reduce the tin dross and produce, energy saving consumption, save nitrogen gas consumption, intelligent operation controller makes production fall to minimumly to artificial dependency, and welded uniformity, repeatability, reliability and traceability obtain great promotion.
Specifically, the full-automatic selective wave soldering device of the embodiment includes: a transport rail 101, a flux spraying mechanism 102, a double-layer preheating mechanism 103, a selective welding mechanism 104 and a controller 105.
The transport guide rail 101 comprises a board inlet guide rail 111 and a board outlet guide rail 112, wherein a spraying fixing position 113, a preheating fixing position 114 and a welding fixing position 115 are arranged on the guide rails between the board inlet guide rail and the board outlet guide rail, a sliding tray sliding along the board inlet guide rail and the board outlet guide rail is arranged, and a printed circuit board to be welded is placed on the sliding tray.
Double-deck preheating machine constructs 103 is located and preheats fixed position, includes: an upper preheater 131 and a lower preheater 132; an upper preheater 131 located above the printed circuit board to preheat the printed circuit board; and a lower pre-heater 132 under the printed circuit board to pre-heat the printed circuit board.
A selective welding mechanism 104, located in a welding position below the sliding tray, comprising: a vertical three-axis moving table 141 and a soldering tin furnace 142, wherein the soldering tin furnace 142 is positioned on a moving table plate 143 of the vertical three-axis moving table, and a soldering nozzle faces towards the printed circuit board; further comprising: the positioning camera is connected with the controller and shoots and transmits the shot to the controller by aiming at the welding surface of the printed circuit board; and the high bottom position probe is positioned at the wave crest correction position of the selective welding mechanism and detects the wave crest height when the soldering tin furnace moves to the correction position.
The two sets of soldering tin furnaces, called tin furnaces for short, independently control tin temperature, nitrogen temperature and wave height, are arranged on a platform, and the distance between the tin furnace spray heads can be manually adjusted. The temperature of the tin furnace, the temperature of nitrogen, the height of wave peak, the wave peak correction and the like can be set by a computer, and the inner container of the tin furnace is made of titanium alloy and has no leakage. The external heating plate has uniform heat transfer, and the tin furnace is matched with the tin liquid level for alarming. The whole tin furnace (wave crest motor, tin furnace body, pump body, tin furnace heating body and nitrogen heating body) can be exchanged with the tin furnace on the existing machine, and all wiring needs to be connected by adopting a quick socket without wiring. The nozzles can be customized according to the requirements of the actual PCB, such as fine-hole nozzles with the inner diameter of 1.5mm or 2mm, elongated nozzles, special-shaped nozzles and the like.
Through the positioning camera, after the number of the PCBs is set in each welding process, Mark points of the PCBs are positioned, and the positioning accuracy is further improved. The wave crest positioning adjustment of the soldering tin furnace is carried out through the high-bottom position probe, and after the set number of the PCB boards is soldered, the platform automatically moves the soldering tin furnace to a specified position to carry out wave crest height correction.
The controller 105 is connected with the conveying guide rail 101, the scaling powder spraying mechanism 102, the double-layer preheating mechanism 103 and the selective welding mechanism 104; and controlling the motor to drive the conveying guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism to move and start and stop time points of each working unit according to the control instruction so as to realize full-automatic on-line selective wave soldering with high efficiency and high precision. The transmission in each stage of selective wave soldering is set to move through the controller according to the characteristics of the PCB, and the PCB, the spraying layer, the double-layer preheating layer and the selective soldering layer are positioned, so that the positioning soldering can be accurately performed, the efficiency of the whole selective wave soldering is improved, excessive labor is not needed, and the soldering cost is reduced.
The work flow of the full-automatic selective wave soldering device is as follows: the motor drives the transportation guide rail to move, and then drives the slip tray that the cooperation transported the guide rail and advance the board on line from advancing board guide rail end, and the PCB board is placed in the tool on the slip tray, and along with slip tray transmission to spraying fixed position department, the splint mechanism that can reciprocate that is located the PCB board top moves down, and the cooperation slip tray is held the PCB board and is fixed between the two. And a spray head of the soldering flux sprayer aims at the area to be welded at the lower end of the PCB to spray the soldering flux. Optionally, 6 PCBs or 3 jigs (2 PCBs/jig) are simultaneously arranged in the whole machine and work at the positions of spraying, preheating and welding respectively, so that the whole capacity of the machine is improved. The soldering flux is stored in a pressure tank, so that the constant spraying pressure is ensured and the soldering flux is not influenced by the quantity of the soldering flux. And after the PCB sprayed with the soldering flux is conveyed to a position between an upper preheater and a lower preheater along with the conveying guide rail for preheating, the PCB is conveyed to a welding fixed position along with the conveying guide rail, the soldering tin furnace moves to a region to be welded of the PCB along with the vertical three-axis moving table, and the soldering tin spraying welding is carried out according to the soldering strategy of the PCB. The welded PCB is conveyed out of the device along with the conveying guide rail.
In some optional embodiments, the apparatus further comprises: the clamping plate mechanism is positioned above the spraying fixing position, the preheating fixing position and the welding fixing position, is provided with an up-and-down moving track and is connected with the controller; the controller controls the downward movement to be matched with the sliding tray, the printed circuit board is clamped and fixed, and the upward movement releases the clamping of the printed circuit board.
In some alternative embodiments, the vertical dual-axis translation stage 121 includes: a driving rail 301, a driven rail 302, and a moving platen 123. Wherein, active guide 301 includes: a main guide body 311, a main ball screw 312, and a main ball fixing block 313; and a main ball screw 312 fixed on the stopper at one end of the main guide rail body by a main ball fixing block and extending along the guide rail direction of the main guide rail body.
A driven rail 302 comprising: a slave rail body 321, a slave ball screw 322, a slave ball fixing block 323, and a master screw slider 324; from the ball screw 322, by being fixed from the ball fixing block to the stopper plate from one end of the rail body 321, extends in the rail direction from the rail body; and the main screw rod slide block 324 is arranged on the auxiliary guide rail body and extends in a direction perpendicular to the guide rail direction of the auxiliary guide rail body, and is matched with the main ball screw 312 to drive the driven guide rail to move back and forth in the main ball screw direction. Motion power is provided through the servo driver and the motor, the ball screw and the linear guide rail are matched for guiding, the positioning is accurate, the noise is low, and the movement is stable.
The movable platen 123 is provided with a slave screw slider 331 extending in the guide direction of the slave guide body, and is moved back and forth in the slave ball screw direction in cooperation with the slave ball screw 322.
Optionally, a dust-proof plate 303 is further disposed on the moving stage 123 plate, and the length and width of the dust-proof plate are greater than the widths of the driving guide rail and the driven guide rail. The moving platform is provided with a dust guard plate to prevent dirt from dropping on the ball screw.
In some alternative embodiments, vertical three-axis mobile station 141, comprises: a vertical guide rail 401, a horizontal driving guide rail 402, a horizontal driven guide rail 403, and a movable platen 143; wherein, vertical guide rail, perpendicular to level initiative guide rail and the vertical placing of horizontal driven guide rail include: the vertical rail body, the vertical ball screw and the vertical ball fixing block; and the vertical ball screw is fixed on the barrier plate at one end of the vertical rail body through a vertical ball fixing block and extends along the direction of the guide rail of the vertical rail body.
A horizontal active rail comprising: the main guide rail body, the main ball screw, the main ball fixing block and the vertical screw rod sliding block are arranged on the main guide rail body; the main ball screw is fixed on the barrier plate at one end of the main guide rail body through a main ball fixing block and extends along the guide rail direction of the main guide rail body; and the vertical screw rod sliding block is arranged on the main guide rail body and extends in a direction perpendicular to the guide rail of the main guide rail body, and is matched with the vertical ball screw rod to drive the driving guide rail to move back and forth in the direction of the vertical ball screw rod.
A horizontally driven rail comprising: the auxiliary guide rail body, the auxiliary ball screw, the auxiliary ball fixing block and the main screw rod slide block; the auxiliary ball screw is fixed on the stop plate at one end of the auxiliary guide rail body through the auxiliary ball fixing block and extends along the guide rail direction of the auxiliary guide rail body; and the main screw rod slide block is arranged on the slave guide rail body and extends in a direction vertical to the guide rail of the slave guide rail body, and is matched with the main ball screw rod to drive the slave guide rail to move back and forth in the direction of the main ball screw rod.
And the movable bedplate is provided with a slave screw rod slide block, extends along the guide rail direction of the slave guide rail body, and is matched with the slave ball screw rod to drive the movable bedplate to move back and forth along the slave ball screw rod direction.
In some alternative embodiments, in the double-layer preheating mechanism 103, the lower preheater 132, which is a far infrared spot lamp, is located below the printed circuit board; go up pre-heater 131 for the hot-blast temperature control goes up the pre-heater, includes: a wind control housing 601, a fan 602 and a position adjusting track; the wind control shell 601 is a wind cover positioned above the printed circuit board; a fan 602 located in the fan housing to draw hot air upward; and the position adjusting track is connected with and drives the wind control shell to move. The heating power can be adjusted, for example, the heating power can be designed to be in a mode of temperature rise in a step degree, and the heating power can also be adjusted in real time according to the welding time of the PCB.
Optionally, a heat insulation layer is surrounded outside the casing of the wind control casing, a heat dissipation air suction cover is arranged above the wind control casing, the air suction cover can be an air suction cover body with an opening at the lower end, and the air suction cover body is formed by gathering air from the lower part to the upper part and has a large opening and a small gathering part.
In some optional embodiments, the apparatus further comprises: a rail adjuster, comprising: the guide rail adjusting motor, the guide rail width adjusting screw rod and the guide rail height adjusting screw rod are arranged on the guide rail; the guide rail width adjusting screw is positioned between the two guide rail strips of the conveying guide rail and is driven by the guide rail adjusting motor to move by matching with screw rod sliding blocks on the two guide rail strips so as to adjust the width between the two guide rail strips; the guide rail height adjusting lead screw is perpendicular to the conveying guide rail and is driven by a guide rail adjusting motor to be matched with a lead screw sliding block on the conveying guide rail to move and adjust the height of the conveying guide rail. The width and the height between the guide rails can be adjusted to be suitable for the online welding of PCB plates with different sizes, and the applicability of the equipment is improved. More preferably, the controller can automatically detect the size of the PCB through a set strategy, and then automatically select the adjusting range of the width of the guide rail to adjust the guide rail, so as to realize the automatic adjusting function of the width of the guide rail for replacing the size of the PCB.
In some alternative embodiments, clamping plates 701 are provided on both sides of the transport rail, clamping the printed circuit board on both sides; a stop plate 702 is respectively arranged at the spraying fixing position, the preheating fixing position and the welding fixing position: the spraying blocking plate, the preheating blocking plate and the welding blocking plate move to block in front of the printed circuit board when the printed circuit board is in the spraying, preheating or welding stage respectively, and move to remove the blocking of the printed circuit board when the spraying, preheating or welding stage is finished.
In some alternative embodiments, a transport rail comprises: two opposite guide rail strips, a motor and a guide rail belt; the inner side of the guide rail strip is provided with a guide rail belt groove which is sunken inwards; the guide rail belt is a roller and/or a chain, is arranged in the guide rail belt groove and is positioned under the sliding tray, and the sliding tray is driven to move by the motor.
The front guide rail and the rear guide rail are respectively driven by independent stepping motors and are transported by stainless steel rollers, so that the operation is smooth, and no abrasion is caused after long-term use. Meanwhile, the tin furnace nozzle can reach the 3mm position of the edge of the PCB, and the clamping plate mechanism is arranged on the transportation guide rail, so that the accurate positioning is ensured.
The device of this embodiment mainly divides three-section guide rail transportation PCB board: the first stage is a spraying section: the guide wheel conveying mechanism quickly conveys the PCB to a light eye close to the stop position; the conveying speed is reduced to convey the PCB to the blocking cylinder; the clamping plate mechanism positions the PCB; the spray head carries out spraying work according to a specified path; after spraying, loosening the clamping plate mechanism; the guide wheel conveying mechanism conveys the PCB quickly and outputs the PCB. A second-stage preheating section: the guide wheel conveying mechanism quickly conveys the PCB to the blocking cylinder; heating the product; after preheating is finished, the guide wheel conveying mechanism conveys the PCB quickly and outputs the PCB. The third stage is a welding stage: the guide wheel conveying mechanism quickly conveys the PCB to a light eye close to the stop position; the conveying speed is reduced to convey the PCB to the blocking cylinder; the clamping plate mechanism positions the PCB; two soldering tin heads on a platform carry out welding work according to a specified path; loosening the clamping plate mechanism after welding is finished; the guide wheel conveying mechanism conveys the PCB quickly and outputs the PCB. Based on the modularized design, different modules can be selected for wiring according to different products and yields, and the yield can be doubled by additionally arranging one welding module. The whole machine is in a steel structure, and a base plate is added at the bottom of the whole machine to improve the stability of the machine and reduce vibration. The full-automatic selective wave soldering device can be in butt joint with the previous PCB material preparation device system, manual butt joint in the production process of the PCB is achieved, and a full-automatic flow production mode is achieved.
While the preferred embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application. It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A full-automatic selective wave soldering device, comprising: the device comprises a conveying guide rail, a soldering flux spraying mechanism, a double-layer preheating mechanism, a selective welding mechanism and a controller; wherein the content of the first and second substances,
the conveying guide rail comprises a board inlet guide rail and a board outlet guide rail, wherein the guide rail between the board inlet guide rail and the board outlet guide rail is provided with a spraying fixing position, a preheating fixing position and a welding fixing position, a sliding tray sliding along the board inlet guide rail and the board outlet guide rail is arranged, and a printed circuit board to be welded is placed on the sliding tray;
scaling powder spraying mechanism is located spraying fixed position department, and be in slide tray below includes: a vertical double-shaft moving table and a soldering flux sprayer; a movable platen is arranged on the vertical double rails of the vertical double-shaft movable table; the scaling powder sprayer is positioned on the movable platen and driven by the movable platen to perform biaxial movement, and a spray head of the scaling powder sprayer faces the printed circuit board;
double-deck preheating machine constructs, is located preheat fixed position, include: an upper preheater and a lower preheater; the upper preheater is positioned above the printed circuit board and preheats the printed circuit board; the lower preheater is positioned below the printed circuit board and used for preheating the lower part of the printed circuit board;
the selective welding mechanism, located at the weld fixture location, and below the sliding tray, includes: the welding tin furnace is positioned on a movable platen of the vertical three-axis movable table, and a welding nozzle faces the printed circuit board; further comprising: the positioning camera is connected with the controller and shoots and transmits the shot to the controller by aiming at the welding surface of the printed circuit board; the high-bottom probe is positioned at the wave crest correction position of the selective welding mechanism and detects the wave crest height when the welding tin furnace moves to the correction position;
the controller is connected with the transportation guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism; and controlling a motor to drive the conveying guide rail, the scaling powder spraying mechanism, the double-layer preheating mechanism and the selective welding mechanism to move according to a control instruction.
2. The fully automatic selective wave soldering apparatus according to claim 1, further comprising: the clamping plate mechanism is positioned above the spraying fixing position, the preheating fixing position and the welding fixing position, is provided with an up-and-down moving track and is connected with the controller; and the controller is controlled to move and is matched with the sliding tray, the printed circuit board is clamped and fixed, and the controller moves upwards to release the clamping of the printed circuit board.
3. The fully automated selective wave soldering apparatus of claim 1, wherein the vertical dual axis moving stage comprises: the driving guide rail, the driven guide rail and the movable bedplate; wherein the content of the first and second substances,
the active guide rail comprises: the main guide rail body, the main ball screw and the main ball fixing block; the main ball screw is fixed on the blocking plate at one end of the main guide rail body through the main ball fixing block and extends along the guide rail direction of the main guide rail body;
the driven guide rail includes: the auxiliary guide rail body, the auxiliary ball screw, the auxiliary ball fixing block and the main screw rod slide block; the auxiliary ball screw is fixed on the stop plate at one end of the auxiliary guide rail body through the auxiliary ball fixing block and extends along the guide rail direction of the auxiliary guide rail body; the main screw rod slide block is arranged on the auxiliary guide rail body, extends in a direction perpendicular to the guide rail direction of the auxiliary guide rail body, and is matched with the main ball screw rod to drive the driven guide rail to move back and forth in the direction of the main ball screw rod;
the movable bedplate is provided with a slave screw rod slide block, extends along the guide rail direction of the slave guide rail body, and is matched with the slave ball screw rod to drive the movable bedplate to move back and forth in the slave ball screw rod direction.
4. The fully automatic selective wave soldering apparatus according to claim 3, wherein a dust guard is further provided on the moving platen, the dust guard having a length and width greater than the width of the driving and driven rails.
5. The fully automated selective wave soldering apparatus of claim 1, wherein the vertical three axis mobile station comprises: the device comprises a vertical guide rail, a horizontal driving guide rail, a horizontal driven guide rail and a movable bedplate; wherein the content of the first and second substances,
the vertical guide rail, the perpendicular to horizontal initiative guide rail and the vertical placing of horizontal driven guide rail include: the vertical rail body, the vertical ball screw and the vertical ball fixing block; the vertical ball screw is fixed on the blocking plate at one end of the vertical rail body through the vertical ball fixing block and extends along the direction of the guide rail of the vertical rail body;
the horizontal active guide rail comprises: the main guide rail body, the main ball screw, the main ball fixing block and the vertical screw rod sliding block are arranged on the main guide rail body; the main ball screw is fixed on the blocking plate at one end of the main guide rail body through the main ball fixing block and extends along the guide rail direction of the main guide rail body; the vertical screw rod sliding block is arranged on the main guide rail body, extends in a direction perpendicular to the guide rail direction of the main guide rail body, and is matched with the vertical ball screw rod to drive the driving guide rail to move back and forth in the direction of the vertical ball screw rod;
the horizontally driven guide rail comprises: the auxiliary guide rail body, the auxiliary ball screw, the auxiliary ball fixing block and the main screw rod slide block; the auxiliary ball screw is fixed on the stop plate at one end of the auxiliary guide rail body through the auxiliary ball fixing block and extends along the guide rail direction of the auxiliary guide rail body; the main screw rod slide block is arranged on the auxiliary guide rail body, extends in a direction perpendicular to the guide rail direction of the auxiliary guide rail body, and is matched with the main ball screw rod to drive the driven guide rail to move back and forth in the direction of the main ball screw rod;
the movable bedplate is provided with a slave screw rod slide block, extends along the guide rail direction of the slave guide rail body, and is matched with the slave ball screw rod to drive the movable bedplate to move back and forth in the slave ball screw rod direction.
6. The full-automatic selective wave soldering device according to claim 1, wherein in the double-layer preheating mechanism, the lower preheater is a far infrared spot lamp and is located below the printed circuit board; go up the pre-heater, for hot-blast accuse temperature goes up the pre-heater, include: the wind control device comprises a wind control shell, a fan and a position adjusting track; the wind control shell is a wind cover positioned above the printed circuit board; the fan is positioned in the fan cover and used for extracting hot air upwards; the position adjusting track is connected with and drives the wind control shell to move.
7. The fully automatic selective wave soldering device according to claim 6, wherein the outside of the housing of the wind-controlled enclosure is surrounded by a thermal insulation layer, and a heat dissipation air suction hood is arranged above the wind-controlled enclosure.
8. The fully automatic selective wave soldering apparatus according to claim 1, further comprising: a rail adjuster, comprising: the guide rail adjusting motor, the guide rail width adjusting screw rod and the guide rail height adjusting screw rod are arranged on the guide rail; the guide rail width adjusting screw is positioned between the two guide rail strips of the conveying guide rail, and is driven by the guide rail adjusting motor to move by matching with screw rod sliding blocks on the two guide rail strips so as to adjust the width between the two guide rail strips; the guide rail height adjusting lead screw is perpendicular to the conveying guide rail, and the guide rail adjusting motor drives the guide rail adjusting lead screw to be matched with a lead screw sliding block on the conveying guide rail to move and adjust the height of the conveying guide rail.
9. The fully automatic selective wave soldering apparatus according to claim 1, wherein clamping plates are provided on both sides of the transport rail to clamp the printed circuit board on both sides; and the spraying blocking plate, the preheating blocking plate and the welding blocking plate are respectively arranged at the spraying fixing position, the preheating fixing position and the welding fixing position, when the printed circuit board is respectively in the spraying stage, the preheating stage or the welding stage, the printed circuit board is movably blocked in front of the printed circuit board, and when the spraying stage, the preheating stage or the welding stage is completed, the printed circuit board is movably unblocked.
10. The fully automatic selective wave soldering apparatus of claim 1, wherein the transport rail comprises: two opposite guide rail strips, a motor and a guide rail belt; the inner side of the guide rail strip is provided with a guide rail belt groove which is sunken inwards; the guide rail belt is a roller and/or a chain, is arranged in the guide rail belt groove and is positioned below the sliding tray, and the sliding tray is driven to move by the motor.
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| CN202022139199.XU CN212577735U (en) | 2020-09-26 | 2020-09-26 | Full-automatic selective wave soldering device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117415532A (en) * | 2023-12-18 | 2024-01-19 | 深圳市宽动态科技有限公司 | Welding device and welding method for camera module and circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117415532A (en) * | 2023-12-18 | 2024-01-19 | 深圳市宽动态科技有限公司 | Welding device and welding method for camera module and circuit board |
| CN117415532B (en) * | 2023-12-18 | 2024-02-20 | 深圳市宽动态科技有限公司 | Welding device and welding method for camera module and circuit board |
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