CN201463558U - Low thermal conduction and energy saving kiln wall - Google Patents
Low thermal conduction and energy saving kiln wall Download PDFInfo
- Publication number
- CN201463558U CN201463558U CN2009200878222U CN200920087822U CN201463558U CN 201463558 U CN201463558 U CN 201463558U CN 2009200878222 U CN2009200878222 U CN 2009200878222U CN 200920087822 U CN200920087822 U CN 200920087822U CN 201463558 U CN201463558 U CN 201463558U
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- wall
- kiln
- layer
- internal layer
- saving
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Abstract
The utility model relates to a low thermal conduction and energy saving kiln wall, which comprises an internal layer wall (1), an external layer wall (2) and a hollow layer (3) which is arranged between the internal layer wall (1) and the external layer wall (2). Compared with the prior art, the low thermal conduction and energy saving kiln wall employs heat transfer theory, adopts a multi-layer composite structure, and skillfully uses the hollow layer (an air layer)to reduce thermal conductivity of the kiln wall, thereby achieving the purpose of saving energy.
Description
Technical field
The utility model relates to kiln, particularly the body of wall of kiln.
Background technology
Kiln generally is made up of the kiln top that body of wall and body of wall support, and the body of wall of kiln is generally solid wall at present, and solid wall has higher thermal conductivity, makes that the thermal loss of kiln is bigger, is unfavorable for saving energy in kiln.
Summary of the invention
Technical problem to be solved in the utility model is: a kind of low heat conductivity energy-saving kiln body of wall is provided.
The utility model solves the problems of the technologies described above the technical scheme that is adopted:
Low heat conductivity energy-saving kiln body of wall, it comprises internal layer body of wall, outer body of wall, is provided with voided layer between internal layer body of wall and the outer body of wall.
In the such scheme, the thickness of voided layer accounts for the 1/6-1/4 of whole kiln thickness of wall body.
In the such scheme, voided layer is arranged in the zone of kiln body of wall operating temperature between 200-600 ℃.
In the such scheme, outer body of wall is 1 with internal layer thickness of wall body ratio: 4-6.
In the such scheme, outer body of wall is provided with through hole, and voided layer is communicated with outward with kiln by through hole.
Compared with prior art, the utlity model has following advantage:
1, according to heat transfer theory, the kiln body of wall adopts multi-layer compound structure, the ingenious thermal conductivity of utilizing voided layer (air layer) to reduce the kiln body of wall, thus reach purpose of energy saving.
2, the thickness of voided layer accounts for the 1/6-1/4 of whole kiln thickness of wall body, under the situation that does not reduce the kiln strength of wall body, reduces the thermal conductivity of kiln body of wall.
If 3, voided layer is arranged on kiln body of wall operating temperature greater than in 600 ℃ the zone, the internal layer body of wall can conduct a large amount of heats by the outer body of wall of radiation direction, and energy-saving effect is poor; And if voided layer is arranged on kiln body of wall operating temperature less than in 200 ℃ the zone, can't effectively reduce the thermal conductivity of kiln body of wall again.Therefore, voided layer is arranged in the zone of kiln body of wall operating temperature between 200-600 ℃ best.
In like manner, if outer body of wall is thick, the internal layer body of wall is thinner, the internal layer body of wall can conduct a large amount of heats by the outer body of wall of radiation direction, and energy-saving effect is poor; And if outer body of wall is thin, the internal layer body of wall is thicker, can't effectively reduce the thermal conductivity of kiln body of wall again.Therefore, outer body of wall is 1 with internal layer thickness of wall body ratio: 4-6 the best.
4, outer body of wall is provided with through hole, and voided layer is communicated with outward with kiln by through hole, when making air in the voided layer expand with heat and contract with cold, can not impact body of wall.Certainly, voided layer also can be by the micro gap external communications of internal layer body of wall or outer body of wall.
Description of drawings
Fig. 1 is the structural representation with kiln of the utility model low heat conductivity energy-saving kiln body of wall
The specific embodiment
As shown in Figure 1, it is the kiln with the utility model low heat conductivity energy-saving kiln body of wall, and this kiln design firing temperature is between 1280-1600 ℃, and this kiln is made up of the kiln top 4 that body of wall 5 and body of wall support.
The utility model low heat conductivity energy-saving kiln body of wall embodiment, its thickness is 410mm, comprise internal layer body of wall 1, outer body of wall 2, the gross thickness of internal layer body of wall 1 is 280mm, the thickness of outer body of wall 2 is 60mm, be provided with voided layer 3 between internal layer body of wall 1 and the outer body of wall 2, the thickness of voided layer 3 accounts for the 1/6-1/4 of whole kiln thickness of wall body, and the thickness of the voided layer 3 of present embodiment is 70mm.
Voided layer 3 is arranged in the zone of kiln body of wall operating temperature between 200-600 ℃, and outer body of wall 2 is 1 with internal layer body of wall 1 thickness ratio: 4-6.
Outer body of wall 2 is provided with through hole 201, and voided layer 3 is communicated with outward with kiln by through hole 201.
Internal layer body of wall 1 is made up of internal layer body of wall internal layer 101 and internal layer wall external layer 102, the thickness of internal layer body of wall internal layer 101 is 50mm, be the mullite flame-proof tapetum fibrosum, the thickness of internal layer wall external layer 102 is 230mm, be built into by poly-light ball high-alumina brick, outer body of wall 2 is HT high aluminum silicate tapetum fibrosum and metal shell.
Kiln with the utility model low heat conductivity energy-saving kiln body of wall, outer body of wall 2 hull-skin temperatures can be lower than 50 ℃, and the hot effect of kiln can be more than 39%.
Certainly, also can be provided with voided layer 3 in the kiln of the kiln top 4.
Claims (5)
1. low heat conductivity energy-saving kiln body of wall, it is characterized in that: it comprises internal layer body of wall (1), outer body of wall (2), is provided with voided layer (3) between internal layer body of wall (1) and the outer body of wall (2).
2. low heat conductivity energy-saving kiln body of wall as claimed in claim 1 is characterized in that: the thickness of voided layer (3) accounts for the 1/6-1/4 of whole kiln thickness of wall body.
3. low heat conductivity energy-saving kiln body of wall as claimed in claim 1 or 2 is characterized in that: voided layer (3) is arranged in the zone of kiln body of wall operating temperature between 200-600 ℃.
4. low heat conductivity energy-saving kiln body of wall as claimed in claim 1 or 2 is characterized in that: outer body of wall (2) is 1 with internal layer body of wall (1) thickness ratio: 4-6.
5. low heat conductivity energy-saving kiln body of wall as claimed in claim 1 or 2 is characterized in that: outer body of wall (2) is provided with through hole (201), and voided layer (3) is communicated with outward with kiln by through hole (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200878222U CN201463558U (en) | 2009-08-04 | 2009-08-04 | Low thermal conduction and energy saving kiln wall |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200878222U CN201463558U (en) | 2009-08-04 | 2009-08-04 | Low thermal conduction and energy saving kiln wall |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201463558U true CN201463558U (en) | 2010-05-12 |
Family
ID=42390909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200878222U Expired - Fee Related CN201463558U (en) | 2009-08-04 | 2009-08-04 | Low thermal conduction and energy saving kiln wall |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201463558U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103836957A (en) * | 2012-11-26 | 2014-06-04 | 江苏华东炉业有限公司 | Furnace body with heat preservation layer |
-
2009
- 2009-08-04 CN CN2009200878222U patent/CN201463558U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103836957A (en) * | 2012-11-26 | 2014-06-04 | 江苏华东炉业有限公司 | Furnace body with heat preservation layer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100512 Termination date: 20120804 |