CN201436705U - 插座连接器组合 - Google Patents

插座连接器组合 Download PDF

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CN201436705U
CN201436705U CN200920007813.8U CN200920007813U CN201436705U CN 201436705 U CN201436705 U CN 201436705U CN 200920007813 U CN200920007813 U CN 200920007813U CN 201436705 U CN201436705 U CN 201436705U
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radiating tube
bearing part
socket connector
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达瑞尔·威尔兹
戴维德·G·豪威尔
亚伯特·特休恩
司明伦
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Foxconn Kunshan Computer Connector Co Ltd
Hon Hai Precision Industry Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

一种插座连接器组合，用于电性连接芯片模块与电路板，其包括框体、绝缘本体、盖板、散热管承载件、两散热管、背板以及若干紧固件。绝缘本体收容于框体内。芯片模块收容在绝缘本体中，散热管承载件安装在芯片模块上方，其上组设有散热管。盖板组设于散热管承载件上。紧固件用于将框体、盖板与背板一起固定在电路板上。散热管承载件的中部设有一凸柱，盖板上设有用于收容凸柱的圆孔。此种结构设计可实现散热管承载件的灵活定位，且散热管承载件可绕圆孔旋转。

Description

插座连接器组合
【技术领域】
本实用新型涉及一种插座连接器组合，用于电性连接CPU芯片模块与印刷电路板。
【技术背景】
2006年3月7日公告的美国专利第7008239号所揭示了与本实用新型相关的插座连接器组合。该插座电连接器组合包括绝缘本体、若干导电端子、四个螺母、四个螺钉、盖体以及散热管。绝缘本体上设有用于收容导电端子的若干插槽以及设于插槽周围的侧壁，用于定位电子组件，如芯片模块。螺钉从电路板底端穿过并与电路板上方的螺母配合以将绝缘本体安装在电路板上。盖体安装在螺母与绝缘本体之间。通过螺母头部下压盖体，使盖体下压芯片模块的顶面，以将芯片模块定位在绝缘本体中。散热管组装在盖体的顶面上，并与一散热装置连接。但是，由于组装在散热管上方的盖体是紧固安装在绝缘本体上，当盖体组装在绝缘本体上时，散热管的延伸方向也确定了。因此电路板上为上述与散热管连接的散热装置所提供的位置区域也就被限制了。
因此，确有必要提供一种改进的插座连接器组合，以克服上述插座连接器组合存在的缺陷。
【实用新型内容】
本实用新型的目的是提供一种可灵活定位散热管的插座连接器组合。
本实用新型的插座连接器组合是通过以下技术方案实现的：一种插座连接器组合，用于电性连接芯片模块与电路板，其包括绝缘本体、散热管承载件以及组设在散热管承载件上方的盖板，绝缘本体上设有用于收容芯片模块的收容空间，散热管承载件上组设有至少一个散热管，其特征在于：所述盖板与散热管承载件其中之一设有凸柱，另一个设有可转动收容该凸柱的圆孔，用于灵活定位上述组设有散热管的散热管承载件。
本实用新型的插座连接器组合也可通过以下技术方案实现的：一种插座连接器组合，用于电性连接芯片模块与电路板，其包括绝缘本体、安装在绝缘本体上方的盖板、组设在盖板下方的散热管承载件以及组设在散热管承载件上的至少一根散热管，绝缘本体上设有收容芯片模块的收容空间，其特征在于：所述散热管承载件枢接在盖板上。
与现有技术相比，本实用新型具有以下优点：插座连接器组合通过凸柱与圆孔的配合，以实现组设有散热管的散热管承载件的灵活定位。
【附图说明】
图1是本实用新型的插座连接器组合与芯片模块及电路板的立体组装图。
图2是图1所示的插座连接器组合的另一视角的立体组装图。
图3是图1所示的插座连接器组合中盖板自插座连接器组合上分离的立体分解图。
图4是图1所示的插座连接器组合的的立体分解图。
【具体实施方式】
请参阅图1至图4所示，本实用新型优选实施例的插座连接器组合3，用于电性连接芯片模块1与电路板2。
插座连接器组合3包括绝缘本体30、金属铁片形成的框体31、盖板32、散热管承载件33、两个散热管34、背板35以及若干紧固件。绝缘本体30收容于框体31内。芯片模块1收容于绝缘本体30中。散热管承载件33以及散热管34组设在芯片模块1的上方。盖板32设于散热管承载件33的上方。紧固件包括位于上方的螺母36以及位于下方的螺钉37。通过螺母36与螺钉37的配合，将框体31、盖板32以及背板35一起固定在电路板2上。
绝缘本体30上收容有若干导电端子(未图示)并设有用于收容芯片模块2的收容空间301。框体31由金属薄片冲压而成且大体呈矩形，框体31具有一底板311以及四侧壁312。底板311包括一框口313以及设于框口313四角落的四片体314。每一片体314与两相邻侧壁312的底边相连。框口313用于收容绝缘本体30。框体31进一步包括由片体314向上并向内延伸入框口313内的弹性指315。弹性指315可扣压在绝缘本体30上，用于将绝缘本体30固定在框口313内。每一片体314上设有安装孔316。
盖板32组设在散热管承载件33上并覆盖绝缘本体30。盖板32呈片状结构，其四角落对应安装孔316设有固定孔320。盖板32的中部还设有一圆孔321。散热管承载件33呈金属块状结构，其上设有用于容纳散热管34的两收容槽331。散热管承载件33的中部设有可与盖板32的圆孔321配合的凸柱332。电路板2上设有与安装孔316相配合的四个组装孔20。
背板35呈矩形片状构造，且组装在电路板2的下方，其上设有与框体31的安装孔316相配合的四个通孔351。
组装时，首先框体31组设在电路板2上。此时，框体31的安装孔316与电路板2的组装孔20对齐。接着将绝缘本体30组设在框体31上。此时，绝缘本体30收容于框体31的框口313中。然后将芯片模块2组设在缘本体30的收容空间301中。紧接着将组装有散热管34的散热管承载件33安装在芯片模块2的上方。再接着通过散热管承载件33的凸柱332收容在盖板32的圆孔321中，将盖板32组装于散热管承载件33上，固定孔320与安装孔316对齐。最后将背板35放置在电路板2的下方，然后将螺钉37依次穿过背板35的通孔351、电路板2的组装孔20、框体31的安装孔316以及盖板32的固定孔320，并与电路板2上方的螺母36配合，将插座连接器组合3安装在电路板2上。
本实用新型的插座连接器组合3具有以下优点：插座连接器组合3通过散热管承载件33的凸柱332收容于盖板32的圆孔321中，以将散热管承载件33枢接于盖板32上。由此，即使插座连接器组合3安装在电路板2上，设有散热管34的散热管承载件33仍可绕圆孔321旋转，实现灵活定位。由于散热管34位于两相邻螺钉37之间(请参阅图3所示)，因此两螺钉37可阻止散热管承载件33过度旋转，从而将散热管承载件33定位。由此，操作者可有更多选择来布局散热管34位置。
以上所述仅为本实用新型的一种实施方式，不是全部或唯一的实施方式，本领域普通技术人员通过阅读本实用新型说明书而对本实用新型技术方案采取的任何等效的变化，均为本实用新型的权利要求所涵盖。

Claims (10)

1.一种插座连接器组合，用于电性连接芯片模块与电路板，其包括绝缘本体、散热管承载件以及组设在散热管承载件上方的盖板，绝缘本体上设有用于收容芯片模块的收容空间，散热管承载件上组设有至少一个散热管，其特征在于：所述盖板与散热管承载件其中之一设有凸柱，另一个设有可转动收容该凸柱的圆孔，用于灵活定位上述组设有散热管的散热管承载件。
2.如权利要求1所述的插座连接器组合，其特征在于：所述凸柱设于散热管承载件的中部，所述圆孔设于盖板的中部，所述散热管承载件可绕圆孔旋转。
3.如权利要求2所述的插座连接器组合，其特征在于：所述插座连接器组合进一步包括框体，所述框体设有框口以及朝框口内侧延伸设置的若干弹性指，所述弹性指用于将绝缘本体固定在框体的框口内。
4.如权利要求3所述的插座连接器组合，其特征在于：所述插座连接器还包括安装在电路板下方的背板以及若干紧固件，所述紧固件用于将背板、框体及盖体一起组装在电路板上。
5.如权利要求4所述的插座连接器组合，其特征在于：所述紧固件包括螺钉以及与螺钉相配合的螺母。
6.如权利要求5所述的插座连接器组合，其特征在于：所述散热管承载件设有至少一个用于容纳散热管的收容槽。
7.如权利要求2所述的插座连接器组合，其特征在于：所述插座连接器组合还包括用于将盖板固定在电路板上的若干紧固件，所述散热管位于两相邻紧固件之间，两相邻紧固件可阻止散热管承载件过度旋转而定位散热管承载件。
8.一种插座连接器组合，用于电性连接芯片模块与电路板，其包括绝缘本体、安装在绝缘本体上方的盖板、组设在盖板下方的散热管承载件以及组设在散热管承载件上的至少一根散热管，绝缘本体上设有收容芯片模块的收容空间，其特征在于：所述散热管承载件枢接在盖板上。
9.如权利要求8所述的插座连接器组合，其特征在于：所述散热管承载件中部设有凸柱，所述盖板中部设有圆孔，可与凸柱配合以使散热管承载件可绕圆孔旋转。
10.如权利要求9所述的插座连接器组合，其特征在于：其进一步包括若干紧固件，用于将盖板安装在电路板上，所述散热管位于两相邻紧固件之间，两相邻紧固件可阻止散热管承载件过度旋转。
CN200920007813.8U 2008-06-09 2009-02-25 插座连接器组合 Expired - Fee Related CN201436705U (zh)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102361119A (zh) * 2011-09-19 2012-02-22 广东通宇通讯股份有限公司 一种宽频合路器
CN103688351A (zh) * 2011-06-30 2014-03-26 苹果公司 紧凑型散热模组
US9379037B2 (en) 2014-03-14 2016-06-28 Apple Inc. Thermal module accounting for increased board/die size in a portable computer
CN109361085A (zh) * 2018-10-10 2019-02-19 郑州云海信息技术有限公司 一种cpu插座安装器及其安装方法

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM349081U (en) * 2008-06-10 2009-01-11 Hon Hai Prec Ind Co Ltd Electrical connector assembly
TWM361659U (en) * 2009-01-13 2009-07-21 Hon Hai Prec Ind Co Ltd Electrical connector assembly and clip thereof
US8303332B2 (en) 2011-01-14 2012-11-06 Hon Hai Precision Ind. Co., Ltd Socket connector assembly with flexible orientation heat pipe
US8437138B2 (en) * 2011-02-25 2013-05-07 Hon Hai Precision Industry Co., Ltd. Lower profile heat dissipating system embedded with springs
US8593813B2 (en) 2011-03-22 2013-11-26 Hon Hai Precision Industry Co., Ltd. Low profile heat dissipating system with freely-oriented heat pipe
US9223138B2 (en) 2011-12-23 2015-12-29 Microsoft Technology Licensing, Llc Pixel opacity for augmented reality
US9606586B2 (en) * 2012-01-23 2017-03-28 Microsoft Technology Licensing, Llc Heat transfer device
US8934235B2 (en) 2012-01-23 2015-01-13 Microsoft Corporation Heat transfer device with phase change material
US9726887B2 (en) 2012-02-15 2017-08-08 Microsoft Technology Licensing, Llc Imaging structure color conversion
US9297996B2 (en) 2012-02-15 2016-03-29 Microsoft Technology Licensing, Llc Laser illumination scanning
US9779643B2 (en) 2012-02-15 2017-10-03 Microsoft Technology Licensing, Llc Imaging structure emitter configurations
US9578318B2 (en) 2012-03-14 2017-02-21 Microsoft Technology Licensing, Llc Imaging structure emitter calibration
US11068049B2 (en) 2012-03-23 2021-07-20 Microsoft Technology Licensing, Llc Light guide display and field of view
US10191515B2 (en) 2012-03-28 2019-01-29 Microsoft Technology Licensing, Llc Mobile device light guide display
US9558590B2 (en) 2012-03-28 2017-01-31 Microsoft Technology Licensing, Llc Augmented reality light guide display
US9717981B2 (en) 2012-04-05 2017-08-01 Microsoft Technology Licensing, Llc Augmented reality and physical games
US10502876B2 (en) 2012-05-22 2019-12-10 Microsoft Technology Licensing, Llc Waveguide optics focus elements
US8989535B2 (en) 2012-06-04 2015-03-24 Microsoft Technology Licensing, Llc Multiple waveguide imaging structure
US9311909B2 (en) 2012-09-28 2016-04-12 Microsoft Technology Licensing, Llc Sensed sound level based fan speed adjustment
US10192358B2 (en) 2012-12-20 2019-01-29 Microsoft Technology Licensing, Llc Auto-stereoscopic augmented reality display
US9514970B2 (en) 2013-01-24 2016-12-06 Kla-Tencor Corporation Methods of attaching a module on wafer substrate
US9304235B2 (en) 2014-07-30 2016-04-05 Microsoft Technology Licensing, Llc Microfabrication
US10254942B2 (en) 2014-07-31 2019-04-09 Microsoft Technology Licensing, Llc Adaptive sizing and positioning of application windows
US10592080B2 (en) 2014-07-31 2020-03-17 Microsoft Technology Licensing, Llc Assisted presentation of application windows
US10678412B2 (en) 2014-07-31 2020-06-09 Microsoft Technology Licensing, Llc Dynamic joint dividers for application windows
US9429692B1 (en) 2015-02-09 2016-08-30 Microsoft Technology Licensing, Llc Optical components
US10018844B2 (en) 2015-02-09 2018-07-10 Microsoft Technology Licensing, Llc Wearable image display system
US9827209B2 (en) 2015-02-09 2017-11-28 Microsoft Technology Licensing, Llc Display system
US10317677B2 (en) 2015-02-09 2019-06-11 Microsoft Technology Licensing, Llc Display system
US9423360B1 (en) 2015-02-09 2016-08-23 Microsoft Technology Licensing, Llc Optical components
US9372347B1 (en) 2015-02-09 2016-06-21 Microsoft Technology Licensing, Llc Display system
US11086216B2 (en) 2015-02-09 2021-08-10 Microsoft Technology Licensing, Llc Generating electronic components
US9513480B2 (en) 2015-02-09 2016-12-06 Microsoft Technology Licensing, Llc Waveguide
US9535253B2 (en) 2015-02-09 2017-01-03 Microsoft Technology Licensing, Llc Display system
CN105704940B (zh) * 2016-04-21 2018-10-19 浪潮电子信息产业股份有限公司 一种控制管理pcba dip生产不良治具的方法
US10772190B2 (en) * 2017-09-29 2020-09-08 Apple Inc. Heat-removal assemblies with opposing springs

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6473305B1 (en) * 2000-10-26 2002-10-29 Intel Corporation Fastening system and method of retaining temperature control devices used on semiconductor dies
TW510532U (en) * 2001-07-25 2002-11-11 Wen-Chen Wei Flexible heat tube structure
US20030102108A1 (en) * 2001-11-30 2003-06-05 Sarraf David B. Cooling system for electronics with improved thermal interface
TW537437U (en) * 2002-06-28 2003-06-11 Shuttle Inc CPU heat dissipating fastener
US6712129B1 (en) * 2002-10-29 2004-03-30 Taiwan Trigem Information Co., Ltd. Heat dissipation device comprised of multiple heat sinks
US7008239B1 (en) 2004-11-12 2006-03-07 Ted Ju Socket mounted on printed circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103688351A (zh) * 2011-06-30 2014-03-26 苹果公司 紧凑型散热模组
CN103688351B (zh) * 2011-06-30 2018-02-09 苹果公司 紧凑型散热模组
CN102361119A (zh) * 2011-09-19 2012-02-22 广东通宇通讯股份有限公司 一种宽频合路器
CN102361119B (zh) * 2011-09-19 2014-06-04 广东通宇通讯股份有限公司 一种宽频合路器
US9379037B2 (en) 2014-03-14 2016-06-28 Apple Inc. Thermal module accounting for increased board/die size in a portable computer
CN109361085A (zh) * 2018-10-10 2019-02-19 郑州云海信息技术有限公司 一种cpu插座安装器及其安装方法

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