CN201357287Y - Novel picosecond laser processing device - Google Patents
Novel picosecond laser processing device Download PDFInfo
- Publication number
- CN201357287Y CN201357287Y CN 200920036010 CN200920036010U CN201357287Y CN 201357287 Y CN201357287 Y CN 201357287Y CN 200920036010 CN200920036010 CN 200920036010 CN 200920036010 U CN200920036010 U CN 200920036010U CN 201357287 Y CN201357287 Y CN 201357287Y
- Authority
- CN
- China
- Prior art keywords
- processing
- picosecond laser
- speculum
- spraying orifice
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model provides a picosecond laser processing device. The picosecond laser processing device comprises a picosecond laser, a calibration system and a spiral optical processing system; wherein a first reflecting mirror connected with a second reflecting mirror is arranged at the output end of the picosecond laser; an optical shutter is arranged at the output end of the second reflecting mirror; a beam expanding mirror is connected with the output end of the optical shutter; a third reflecting mirror is connected with the output end of the beam expanding mirror; and the third reflecting mirror is connected with the spiral optical processing system through the calibration system. The device is suitable for processing oil atomizer nozzle micropores, and has the advantages that thermal effect produced by processing is small; the edge of each spraying orifice is smooth; the inner wall of the spraying orifice is burr-free; the processing efficiency and the precision are high; the size of the diameter of the spraying orifice is adjustable; the processing efficiency and precise is high; the diameter of the spraying orifice is adjustable, and the minimum diameter of the spraying orifice can be 60 micrometer; the cylindrical shape of the spraying orifice is ensured; the depth-diameter ratio of the spraying orifice can be 1:20; and the machining precision and the quality of the spraying orifice are greatly improved.
Description
Technical field
The utility model relates to a kind of novel picosecond laser processing unit (plant), is used to process the micropore on the atomizer.
Background technology
Fuel injector is contained in cylinder and covers, and effect is that fuel spray is changed into thinner particle, and is injected in the combustion chamber and air forms good flammable mixed steam, thereby improves efficiency of combustion.Fuel injector is made up of the oil injector body on top and the atomizer of bottom, high pressure fuel forms atomizing particle through oil injector body aperture outgoing from the atomizer, granular size is by fuel pressure and hole diameter decision, thereby the quality of aperture has crucial effects to final efficiency of combustion.According to the difference of atomizer kind, the shape of its aperture is also different.Hole diameter is between 0.15～1mm, and generally between 0.15～0.55mm, little hole depth is less than 1mm for the hole diameter on the atomizer commonly used at present, and little hole number is less than 15.
At present, the existing mechanical process technology is beaten miniature aperture on material generally can only process the aperture of aperture greater than 0.25mm, though utilize the hole of high-end mechanical drilling machine about can hole diameter 0.1mm, but its shortcoming is to cost an arm and a leg, the life-span is shorter, be difficult to the processing rigid alloy, shortcoming such as the aperture inwall after the processing is jagged.Spark erosion technique also is commonly used to process aperture.Spark technology can be processed the following micropore of diameter 0.1mm, and its machining accuracy is higher.Shortcoming is that speed is slow, and electrode life is short and more little cost is high more.Laser has been used in the capillary processing field at present.Utilize optical system laser can be focused on luminous point less than 0.01mm, the power density at luminous point place can reach 10
9W/cm
2, add the man-hour material and be melted, vaporize, thereby form aperture.Than machinery and spark machined mode, laser processing technology has significant advantage: its process velocity is fast, and can process thousands of holes each second, and the hole uniformity is better; Cost is lower, no tool loss; Life-span is long, working stability.What present industrial laser brill micropore generally used is that light impulse length is nanosecond (10
-9S) laser instrument.Because light impulse length that nanosecond laser produced is a nanosecond, fuel factor is obvious when interacting with material, and phenomenons such as that bore edges occurs is rough, burn, chipping, fire check cause the machining accuracy reduction.In addition, though normally used vibration mirror scanning type optical system can be processed the micropore about 0.1mm, its shortcoming is that working (machining) efficiency is low, and the small-bore that can process can't process darker aperture deeply than limited.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, and a kind of picosecond laser processing unit (plant) that is used for the atomizer capillary processing is provided, and is intended to effectively improve working (machining) efficiency, increase the spray orifice footpath deeply than, improve spray orifice machining accuracy and quality.
The purpose of this utility model is achieved through the following technical solutions:
Novel picosecond laser processing unit (plant), comprise picosecond laser, calibration system and spiral optics system of processing, characteristics are: the output of described picosecond laser is furnished with first speculum, first speculum is connected second speculum, the output of second speculum is provided with optical gate, the output of optical gate is connected with beam expanding lens, and the output of beam expanding lens is connected the 3rd speculum, and the 3rd speculum is connected with spiral optics system of processing mutually by calibration system.
Further, above-mentioned novel picosecond laser processing unit (plant), the laser of described picosecond laser output is the picosecond green laser, wavelength is 532nm.
Further, above-mentioned novel picosecond laser processing unit (plant), the enlargement ratio of described beam expanding lens be 3～10 times adjustable.
Substantive distinguishing features and obvious improvement that technical solutions of the utility model are outstanding are mainly reflected in:
It is that 532nm, light impulse length are the laser instrument of the picosecond composition processing unit (plant) that combines with spiral optics system of processing that the utility model adopts wavelength, be used to process the atomizer micropore, the fuel factor that processing is produced is little, and the spray orifice edge is smooth, inwall does not have burr, working (machining) efficiency and precision height.The injection diameter adjustable size, I reaches 60um; Shape can guarantee that to cylindrical its footpath is dark in reaching 1: 20.Significantly reduce the fuel factor in the process, improved working (machining) efficiency, improved spray orifice machining accuracy and quality greatly.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: the schematic diagram of the utility model light channel structure;
Fig. 2: the structural representation of the utility model device.
The implication of each Reference numeral sees the following form among the figure:
| Reference numeral | Implication | Reference numeral | Implication | Reference numeral | Implication |
| 1 | Picosecond laser | 2 | |
3 | |
| 4 | |
5 | |
6 | The |
| 7 | |
8 | Spiral optics system of |
9 | Workbench |
The specific embodiment
The utility model designs a kind of laser micropore processor, utilize the picosecond laser micropore of processing on the atomizer that combine with spiral optics system of processing, picosecond laser enters spiral optics system of processing after optical delivery and calibration system, carry out capillary processing after by software control spiral optical system light beam being focused on.
As shown in Figure 1 and Figure 2, novel picosecond laser processing unit (plant), comprise picosecond laser 1, calibration system 7 and spiral optics system of processing 8, the output of picosecond laser 1 is furnished with first speculum 2, the output that first speculum 2 is connected second speculum, 3, the second speculums 3 is provided with optical gate 4, and the output of optical gate 4 is connected with beam expanding lens 5, the output of beam expanding lens 5 is connected has the 3rd speculum 6, the three speculums 6 to be connected mutually with spiral optics system of processing 8 by calibration system 7.
The optical maser wavelength of picosecond laser 1 output is the 532nm green laser, and metallics has higher absorptivity for this band light beam, thereby focal beam spot place energy is fully used, and can reduce the fuel factor that adds man-hour.The pulse width of laser is a picosecond, and its pulse power is 1000 times of nanosecond pulse power, and material is directly gasified and without molten state, can effectively reduce the generation of fuel factor.Thereby make little bore edges smooth, it is residual that inwall does not have burr etc.
The enlargement ratio of beam expanding lens 5 from 3～10 times adjustable, its effect is with the enlarged-diameter of laser beam and collimates, and makes the depth of parallelism of outgoing beam better, helps light beam is focused in follow-up system.The multiplying power of beam expanding lens 5 and the diameter of focal beam spot are inversely proportional to, so adjustable diameter and the energy size that can effectively control focal beam spot of multiplying power.
Light path calibration system 7 is used for the light path calibration of double light path, and its principle is to make laser by being in two apertures separated by a distance on the same axis determining its transmission path, thereby guarantees that light beam enters spiral optics system of processing 8 with optimal path.
Around the axis rotation of self, the spray orifice circularity of having avoided like this causing because of the circularity of light beam own is not good descends the light of spiral optics system of processing 8 outgoing at a high speed.Outgoing beam carries out the high speed trepan along a taper seat to rapidoprint after the light beam line focus, makes the processing footpath of spray orifice dark in reaching 1: 20.In this process, the speed of rotation can be regulated in real time by software control.The trepan diameter of a circle is the diameter of required processing spray orifice, can its size be set by software, and the minimum diameter that can process spray orifice is 60um.With tapered the comparing in hole that common mirror-vibrating laser boring is got out, the light beam of spiral optics system of processing outgoing and the angle of finished surface also can be controlled by software, thereby guarantee that the spray orifice that processes is a cylindrical hole.
Speculum mainly plays the effect of optical path-deflecting, distance between speculum and speculum and speculum and the beam expanding lens does not have specific restriction, the maintenance level consistent or vertical consistent (the light path corner is the right angle among the figure) but try one's best in the center of its position eyeglass when Machine Design is to make things convenient for the adjusting of light path.
During concrete the application, as Fig. 1, by picosecond laser 1 output pulse width is the green 532nm wavelength laser bundle of picosecond, behind first speculum 2, second speculum 3, enter beam expanding lens 5 by optical gate 4, after expanding bundle, enter calibration system 7 by the 3rd speculum 6, make the light velocity through determining that the path enters spiral optics system of processing 8, after the atomizer that spiral optics system of processing 8 focuses on the workbench 9, the material direct gasification of focal spot is divested, thereby process spray orifice.
In sum, select for use 532nm, light impulse length to reach picosecond, power density reaches 10
12W/cm
2Laser, the fuel factor that produces in the time of can effectively reducing the Laser Processing metal.Spiral optics system of processing not only makes the efficient of processing spray orifice be significantly improved, and the working depth of precision, spray orifice shape and the spray orifice of injection diameter also can both obtain well satisfying simultaneously, and its application prospect is very good.
What need understand is: above-mentioned explanation is not to be to restriction of the present utility model, and in the utility model design scope, the interpolation of being carried out, conversion, replacement etc. also should belong to protection domain of the present utility model.
Claims (3)
1. novel picosecond laser processing unit (plant), comprise picosecond laser, calibration system and spiral optics system of processing, it is characterized in that: the output of described picosecond laser is furnished with first speculum, first speculum is connected second speculum, the output of second speculum is provided with optical gate, the output of optical gate is connected with beam expanding lens, and the output of beam expanding lens is connected the 3rd speculum, and the 3rd speculum is connected with spiral optics system of processing mutually by calibration system.
2. novel picosecond laser processing unit (plant) according to claim 1 is characterized in that: the laser of described picosecond laser output is the picosecond green laser, and wavelength is 532nm.
3. novel picosecond laser processing unit (plant) according to claim 1 is characterized in that: the enlargement ratio of described beam expanding lens be 3～10 times adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920036010 CN201357287Y (en) | 2009-03-06 | 2009-03-06 | Novel picosecond laser processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920036010 CN201357287Y (en) | 2009-03-06 | 2009-03-06 | Novel picosecond laser processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201357287Y true CN201357287Y (en) | 2009-12-09 |
Family
ID=41423046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920036010 Expired - Fee Related CN201357287Y (en) | 2009-03-06 | 2009-03-06 | Novel picosecond laser processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201357287Y (en) |
Cited By (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102310264A (en) * | 2010-06-30 | 2012-01-11 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser applied optics system |
| CN102319960A (en) * | 2011-07-27 | 2012-01-18 | 苏州德龙激光有限公司 | Device and method for making metal film group holes by using ultra-short pulse laser |
| CN105598593A (en) * | 2016-02-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing system and method used for hard and brittle material drilling |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9815144B2 (en) | 2014-07-08 | 2017-11-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| US10144093B2 (en) | 2013-12-17 | 2018-12-04 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| CN109158774A (en) * | 2018-09-10 | 2019-01-08 | 西安成立航空制造有限公司 | A kind of spout processing method of fuel nozzle |
| US10173916B2 (en) | 2013-12-17 | 2019-01-08 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
| US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
| US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
| CN109604828A (en) * | 2018-12-26 | 2019-04-12 | 苏州镭扬激光科技有限公司 | A kind of picosecond pulse laser bonding machine |
| US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
| US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
| US10525657B2 (en) | 2015-03-27 | 2020-01-07 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| CN110732840A (en) * | 2019-10-18 | 2020-01-31 | 鹤山市精工制版有限公司 | Plate roller manufacturing process and laser plate roller |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
-
2009
- 2009-03-06 CN CN 200920036010 patent/CN201357287Y/en not_active Expired - Fee Related
Cited By (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102310264B (en) * | 2010-06-30 | 2014-09-10 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser applied optics system |
| CN102310264A (en) * | 2010-06-30 | 2012-01-11 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser applied optics system |
| CN102319960A (en) * | 2011-07-27 | 2012-01-18 | 苏州德龙激光有限公司 | Device and method for making metal film group holes by using ultra-short pulse laser |
| US9850159B2 (en) | 2012-11-20 | 2017-12-26 | Corning Incorporated | High speed laser processing of transparent materials |
| US11028003B2 (en) | 2013-01-15 | 2021-06-08 | Corning Laser Technologies GmbH | Method and device for laser-based machining of flat substrates |
| US11345625B2 (en) | 2013-01-15 | 2022-05-31 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US10421683B2 (en) | 2013-01-15 | 2019-09-24 | Corning Laser Technologies GmbH | Method and device for the laser-based machining of sheet-like substrates |
| US11713271B2 (en) | 2013-03-21 | 2023-08-01 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10280108B2 (en) | 2013-03-21 | 2019-05-07 | Corning Laser Technologies GmbH | Device and method for cutting out contours from planar substrates by means of laser |
| US10183885B2 (en) | 2013-12-17 | 2019-01-22 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US11148225B2 (en) | 2013-12-17 | 2021-10-19 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10611668B2 (en) | 2013-12-17 | 2020-04-07 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US10144093B2 (en) | 2013-12-17 | 2018-12-04 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US10173916B2 (en) | 2013-12-17 | 2019-01-08 | Corning Incorporated | Edge chamfering by mechanically processing laser cut glass |
| US10179748B2 (en) | 2013-12-17 | 2019-01-15 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US10597321B2 (en) | 2013-12-17 | 2020-03-24 | Corning Incorporated | Edge chamfering methods |
| US10233112B2 (en) | 2013-12-17 | 2019-03-19 | Corning Incorporated | Laser processing of slots and holes |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US10392290B2 (en) | 2013-12-17 | 2019-08-27 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US9815144B2 (en) | 2014-07-08 | 2017-11-14 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US11697178B2 (en) | 2014-07-08 | 2023-07-11 | Corning Incorporated | Methods and apparatuses for laser processing materials |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| US11648623B2 (en) | 2014-07-14 | 2023-05-16 | Corning Incorporated | Systems and methods for processing transparent materials using adjustable laser beam focal lines |
| US10526234B2 (en) | 2014-07-14 | 2020-01-07 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| US11014845B2 (en) | 2014-12-04 | 2021-05-25 | Corning Incorporated | Method of laser cutting glass using non-diffracting laser beams |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| US10252931B2 (en) | 2015-01-12 | 2019-04-09 | Corning Incorporated | Laser cutting of thermally tempered substrates |
| US11773004B2 (en) | 2015-03-24 | 2023-10-03 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| US10525657B2 (en) | 2015-03-27 | 2020-01-07 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| CN105598593A (en) * | 2016-02-29 | 2016-05-25 | 深圳英诺激光科技有限公司 | Laser processing system and method used for hard and brittle material drilling |
| CN105598593B (en) * | 2016-02-29 | 2018-05-22 | 英诺激光科技股份有限公司 | For the laser-processing system and method for hard brittle material drilling |
| US11111170B2 (en) | 2016-05-06 | 2021-09-07 | Corning Incorporated | Laser cutting and removal of contoured shapes from transparent substrates |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US10377658B2 (en) | 2016-07-29 | 2019-08-13 | Corning Incorporated | Apparatuses and methods for laser processing |
| US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
| US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US11130701B2 (en) | 2016-09-30 | 2021-09-28 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11972993B2 (en) | 2017-05-25 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| CN109158774A (en) * | 2018-09-10 | 2019-01-08 | 西安成立航空制造有限公司 | A kind of spout processing method of fuel nozzle |
| CN109604828A (en) * | 2018-12-26 | 2019-04-12 | 苏州镭扬激光科技有限公司 | A kind of picosecond pulse laser bonding machine |
| CN110732840A (en) * | 2019-10-18 | 2020-01-31 | 鹤山市精工制版有限公司 | Plate roller manufacturing process and laser plate roller |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201357287Y (en) | Novel picosecond laser processing device | |
| CN101502914A (en) | Picosecond laser machining apparatus for processing nozzle micropore | |
| CN201405164Y (en) | Novel double optical path green ray millipore processing unit | |
| CN101569962A (en) | Double light path green light micropore processing device | |
| CN1972040B (en) | Method of cutting stainless steel by using fiber laser | |
| US9284939B2 (en) | Laser-induced spark ignition for an internal combustion engine | |
| CN108247201B (en) | A kind of high pressure water beam generating device and the Water Jet Guided Laser system with the device | |
| CN106363306A (en) | Machining method and system for oil nozzle spray hole | |
| US9377003B2 (en) | Laser-induced spark ignition for an internal combustion engine | |
| CN105891916B (en) | A kind of aspherical mirror based on axicon lens Yu focus lamp characteristic | |
| US20130104827A1 (en) | Laser-induced spark ignition for an internal combustion engine | |
| CN106312302B (en) | A kind of self-focusing laser processing device | |
| CN106346141A (en) | Metal cutting device based on composite laser beams | |
| CN107262943A (en) | Ultrafast laser processes the devices and methods therefor of superfine back taper hole | |
| CN207071749U (en) | Ultrafast laser processes the device of superfine back taper hole | |
| CN108115274A (en) | A kind of laser-processing system and method | |
| CN201574192U (en) | Light, powder and gas coaxial conveying device for laser cladding formation | |
| CN110125532A (en) | A kind of method, system and its equipment of water guiding laser processing workpiece | |
| CN206105148U (en) | Self -focusing laser beam machining device | |
| CN113634874A (en) | High-power water-conducting laser water optical coupling device with multi-focus lens | |
| CN103394809A (en) | Automobile oil sprayer minuteness oil spraying hole femtosecond laser efficient and precise machining device and method | |
| CN201373947Y (en) | Ultraviolet laser beam shaping device | |
| US6600132B2 (en) | Method and apparatus to generate orifice disk entry geometry | |
| CN110091073A (en) | Multiple beam coupled laser system of processing and method | |
| CN115365649A (en) | Water jet assisted laser-induced plasma processing method and device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee before: Suzhou Delphi Laser Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20160306 |