CN201323195Y - Triode - Google Patents
Triode Download PDFInfo
- Publication number
- CN201323195Y CN201323195Y CN 200820213029 CN200820213029U CN201323195Y CN 201323195 Y CN201323195 Y CN 201323195Y CN 200820213029 CN200820213029 CN 200820213029 CN 200820213029 U CN200820213029 U CN 200820213029U CN 201323195 Y CN201323195 Y CN 201323195Y
- Authority
- CN
- China
- Prior art keywords
- triode
- pin
- framework
- chip
- length
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model relates to a triode, which comprises a chip, a frame, a bonding wire and a molding compound, wherein the bonding wire is welded between the chip and the frame so as to electrically connect the chip and the frame; and the molding compound wraps the chip and the bonding wire so as to protect the chip. The length of the pin of the triode is from 5mm to 8mm. By shortening the length of the pin, the materials are saved, and thereby, the material cost is lowered; the weight of the triode is lowered, so that the transportation cost of single product is reduced.
Description
[technical field]
The utility model relates to the electronic component technology field, relates in particular to a kind of triode.
[background technology]
The triode volume is little, in light weight, little power consumption, the life-span is long, reliability is high, has been widely used in fields such as broadcasting, TV, communication, radar, computer, self-con-tained unit, electronic instrument, household electrical appliance, plays effects such as amplification, vibration, switch.
Along with development of semiconductor, the encapsulation technology of triode advances equally fast.In order to reduce cost, process aspect is carrying out constantly innovation, as dwindling of semiconductor chip characteristic size, introduces a large amount of new material, new technology and new device structure.
Usually, the framework of triode is made by metal material, plays a part conduction and heat radiation.Framework occupies certain proportion in the cost of triode, in the triode that some conduction and heat dispersion are had relatively high expectations, framework is made by materials such as fine copper, causes the cost of triode higher.
[utility model content]
In view of this, be necessary cost problem of higher, a kind of triode cheaply is provided at traditional triode.
For solving the problems of the technologies described above, following technical scheme has been proposed:
A kind of triode comprises chip, framework, is welded between described chip and the framework with the bonding wire that is electrically connected described chip and framework, is wrapped in described chip and bonding wire is outer to protect the plastic packaging material of described chip, and the pin length of described triode is 5-8mm.
Preferably, the pin length of described triode is 7.5mm.
Preferably, the free-ended width of the pin of described triode dwindles gradually.
Preferably, the free-ended minimum widith of the pin of described triode is 0.36mm.
Preferably, the pin length of making the framework of described triode is 10.46mm.
Preferably, the width of end muscle of making the framework of described triode is 3.6mm.
Preferably, the middle muscle of the framework of described triode and end muscle are disposable excision.
Preferably, the length of making the framework of described triode is 22.06mm.
Above-mentioned triode realizes that by shortening the length of triode pin economical with materials to reduce Material Cost, has reduced the weight of product simultaneously, and the freight of single product is reduced.
[description of drawings]
Fig. 1 is the framework schematic diagram of triode;
Fig. 2 is the frame size schematic diagram of traditional triode;
Fig. 3 is the frame size schematic diagram of the triode of present embodiment;
Fig. 4 is the structural representation of triode;
Fig. 5 is the finished figure of traditional triode;
Fig. 6 is the finished figure of the triode of present embodiment.
[embodiment]
The triode of encapsulation after finishing mainly comprise chip, framework, connection chip and framework bonding wire, to be wrapped in described chip and bonding wire outer with the plastic packaging material of protecting chip and bonding wire etc.In the following embodiments, according to the production and the serviceability requirement of triode, under situation about it not being exerted an influence, by shortening the length of triode pin, realize that economical with materials to reduce Material Cost, has reduced the weight of product simultaneously, the freight of single product is reduced.
The framework 100 of triode comprises body 110, pin 120, middle muscle 130 and end muscle 140 as shown in Figure 1.Pin 120 comprises emitter pin 122, collector electrode pin 124 and base stage pin 126.Wherein, collector electrode pin 124 directly links to each other with body 110, and emitter pin 122 and base stage pin 126 lay respectively at the both sides of collector electrode pin 124.Middle muscle 130 connects emitter pin 122, collector electrode pin 124 and base stage pin 126 at the end near body 110; End muscle 140 connects emitter pin 122, collector electrode pin 124 and base stage pin 126 at the other end, and end muscle 140 can link together the framework 100 of a plurality of triodes.
Be illustrated in figure 2 as the frame size schematic diagram of traditional triode, be illustrated in figure 3 as the size schematic diagram of framework 100 of the triode of present embodiment.Comparison diagram 3 and Fig. 2 as can be seen, the lengths of frame that the lengths of frame of present embodiment is more traditional has reduced 7.3mm.Specifically, the lengths of frame of traditional triode is kept to the 22.06mm of present embodiment from 29.36mm.
In theory, the length of framework 100 is short more, just more can economical with materials.Yet as shown in Figure 4, frame body also connects chip 200 and framework 100 with bonding wire 300 owing to need to place chip 200, so the length of body 110 can not change easily.In the present embodiment, the length of body 110 is 8mm, comes economical with materials by the length that changes pin 120.As shown in Figures 2 and 3, the length of the frame pin 120 of present embodiment is reduced to 10.46mm from traditional 18.16mm.
In addition, the width of end muscle 140 improves 3.6mm by 3.2mm, and purpose is the intensity for reinforced frame 100, prevents in course of processing middle frame distortion (in the present embodiment, every end muscle 140 connects 25 frameworks 100).Because the width of end muscle 140 increases, the intensity enhancing of framework 100 in the process of processing triode 10, can adopt the method for muscle 130 in the disposable excision, end muscle 140, with respect to the method for muscle 130 in traditional separately excision, can improve the efficient of production with end muscle 140.
Further, in order to make the user be inserted in the process of circuit board through-hole convenient at pin 120 with triode 10, the free-ended width of pin is dwindled (as Fig. 3 and shown in Figure 6) gradually, and the free end that is about to pin 120 changes spur into, is beneficial to and inserts in the less circuit board through-hole.In the present embodiment, the free-ended minimum widith of pin is 0.36mm.
As Fig. 5 and shown in Figure 6, be respectively the finished product schematic diagram of the triode of traditional triode and present embodiment.The pin length of the triode cost of present embodiment (utilize plastic package die that chip 200, bonding wire 300 and part frame 100 are used plastic packaging material, as epoxy resin, the length of the frame pin that exposes after sealing) shorten to 7.5mm from traditional 15mm.The pin length of triode can be controlled at according to the needs of actual product in the scope of 5-8mm in other embodiments, tolerance is controlled at ± scope of 0.05mm in.
The framework 100 of triode 10 reduces to 22.06mm by 29.36mm in the above-mentioned execution mode, has saved and has made the used copper material 24.86% of framework.After frame pin shortens, reduced the energy in the encapsulation process process, material consumption, as reduced consumption of heat energy in bonding die, the bonding technology has reduced the use amount of protective gas nitrogen, hydrogen, and the use amount of the tin in the electroplating technology or the like.Improved user's service efficiency: existing triode is the power device in the fields such as electricity-saving lamp, electric ballast, charger for mobile phone, and its standard short leg length is 15mm, in actual use, do not need such length, when using, triode is inserted in wicking welding on the wiring board, after the heat shank that grows is cut, not only waste copper material but also wasted tin, part producer cuts a part of long leg earlier in order to save tin, again the plug-in unit wicking, trim, increased one procedure.Because pin shortens, both reduced the weight of raw material and finished product, reduced cost of transportation, improved conevying efficiency.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (8)
1, a kind of triode; comprise chip, framework, be welded between described chip and the framework, be wrapped in described chip and bonding wire is outer to protect the plastic packaging material of described chip with the bonding wire that is electrically connected described chip and framework; it is characterized in that the pin length of described triode is 5-8mm.
2, triode according to claim 1 is characterized in that, the pin length of described triode is 7.5mm.
3, triode according to claim 1 is characterized in that, the free-ended width of the pin of described triode dwindles gradually.
4, triode according to claim 3 is characterized in that, the free-ended minimum widith of the pin of described triode is 0.36mm.
5, triode according to claim 1 is characterized in that, the pin length of making the framework of described triode is 10.46mm.
6, triode according to claim 1 is characterized in that, the width of end muscle of making the framework of described triode is 3.6mm.
7, triode according to claim 6 is characterized in that, the middle muscle of the framework of described triode and end muscle are disposable excision.
8, triode according to claim 1 is characterized in that, the length of making the framework of described triode is 22.06mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200820213029 CN201323195Y (en) | 2008-10-29 | 2008-10-29 | Triode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200820213029 CN201323195Y (en) | 2008-10-29 | 2008-10-29 | Triode |
Publications (1)
Publication Number | Publication Date |
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CN201323195Y true CN201323195Y (en) | 2009-10-07 |
Family
ID=41160570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200820213029 Expired - Lifetime CN201323195Y (en) | 2008-10-29 | 2008-10-29 | Triode |
Country Status (1)
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CN (1) | CN201323195Y (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102543932A (en) * | 2012-02-06 | 2012-07-04 | 深圳市晶导电子有限公司 | Packaging structure of semiconductor device |
CN106001328A (en) * | 2016-06-24 | 2016-10-12 | 鲁班嫡系机器人 | Electronic assembly, cutting device of electronic assembly and equipment |
CN108155154A (en) * | 2017-11-29 | 2018-06-12 | 苏州诺纳可电子科技有限公司 | A kind of triode |
CN108172614A (en) * | 2017-11-29 | 2018-06-15 | 苏州诺纳可电子科技有限公司 | A kind of electronic triode |
US11735509B2 (en) * | 2019-03-22 | 2023-08-22 | Mitsubishi Electric Corporation | Power semiconductor device and manufacturing method thereof |
-
2008
- 2008-10-29 CN CN 200820213029 patent/CN201323195Y/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102543932A (en) * | 2012-02-06 | 2012-07-04 | 深圳市晶导电子有限公司 | Packaging structure of semiconductor device |
CN106001328A (en) * | 2016-06-24 | 2016-10-12 | 鲁班嫡系机器人 | Electronic assembly, cutting device of electronic assembly and equipment |
CN106001328B (en) * | 2016-06-24 | 2019-05-31 | 鲁班嫡系机器人 | A kind of electronic building brick and its cutter device, equipment |
CN108155154A (en) * | 2017-11-29 | 2018-06-12 | 苏州诺纳可电子科技有限公司 | A kind of triode |
CN108172614A (en) * | 2017-11-29 | 2018-06-15 | 苏州诺纳可电子科技有限公司 | A kind of electronic triode |
US11735509B2 (en) * | 2019-03-22 | 2023-08-22 | Mitsubishi Electric Corporation | Power semiconductor device and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20091007 |