CN201307955Y - Circuit and circuit board used for LED lamps - Google Patents

Circuit and circuit board used for LED lamps Download PDF

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Publication number
CN201307955Y
CN201307955Y CNU2008201754063U CN200820175406U CN201307955Y CN 201307955 Y CN201307955 Y CN 201307955Y CN U2008201754063 U CNU2008201754063 U CN U2008201754063U CN 200820175406 U CN200820175406 U CN 200820175406U CN 201307955 Y CN201307955 Y CN 201307955Y
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China
Prior art keywords
led lamp
circuit board
led lamps
circuit
led
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Expired - Fee Related
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CNU2008201754063U
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Chinese (zh)
Inventor
吴贵煌
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Individual
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Individual
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Priority to CNU2008201754063U priority Critical patent/CN201307955Y/en
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Publication of CN201307955Y publication Critical patent/CN201307955Y/en
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Abstract

The utility model provides a circuit used for LED lamps, which comprises a plurality of LED lamps in series connection, wherein each LED lamp is connected in parallel with a Zener diode. The rated power of the Zener diodes is larger than the load power of the LED lamps, the starting voltage of the Zener diodes is larger than the load voltage of the LED lamps, the positive electrodes of the Zener diodes are connected with the negative electrodes of the LED lamps, and the negative electrodes of the Zener diodes are connected with the positive electrodes of the LED lamps. The utility model further provides a circuit board with the circuit used for LED lamps, which comprises a substrate, an insulating layer, a conductive layer and a surface layer, wherein the insulating layer is superposed on the substrate, the conductive layer is superposed on the insulating layer, and the surface layer is superposed on the conductive layer. The circuit board further comprises a heat-dissipating copper foil layer, wherein the heat-dissipating copper foil layer is overlapped on the surface layer and positioned at the installation site of the LED lamps, and the area of the heat-dissipating copper foil layer is larger than that of the heat-dissipating welded surfaces of the LED lamps. The circuit and the circuit board used for LED lamps have the advantages of simple and feasible operation, low cost, good heat-dissipating property and no risk of open-loop circuit due to the breakage of any one LED lamp.

Description

The circuit and the circuit board that are used for the LED lamp
Technical field
The utility model relates to circuit and the circuit board that is used for the LED lamp.
Background technology
The existing circuit that is used for the LED lamp wherein often has a plurality of LED lamps to be connected in series at present.Its shortcoming clearly when a LED lamp damage in the series loop of LED lamp causes this loop to open a way, will make whole loop quit work.And if it all is connected in parallel, then can make circuit structure very complicated, efficient reduces, and the circuit occupation space can be bigger, the also corresponding raising of production technology and manufacturing cost.
The utility model content
The purpose of this utility model provide a kind of simple and easy to do, cost is lower, can not damage the circuit that is used for the LED lamp that cause this loop open circuit because of LED lamp.
In order to address the above problem, the utility model provides a kind of circuit of the LED of being used for lamp, comprise a plurality of LED lamps that polyphone connects, each LED lamp Zener diode in parallel, the rated power of described Zener diode is greater than the bearing power of LED lamp, the starting resistor of Zener diode is greater than the load voltage value of LED lamp, and the positive pole of Zener diode connects the negative pole of LED lamp, and the negative pole of Zener diode connects the positive pole of LED lamp.
Another purpose of the present utility model provides that a kind of cost is lower, perfect heat-dissipating, can not damage the circuit board that is used for the LED lamp that cause this loop open circuit because of a LED lamp.
In order to address the above problem, the utility model provides a kind of circuit board that is loaded with the circuit of the above-mentioned LED of being used for lamp, comprise substrate, insulating barrier, conductive layer and top layer, insulating barrier is stacking on substrate, conductive layer is stacking on insulating barrier, and the top layer is stacking on conductive layer, it is characterized in that described circuit board also comprises the heat radiation Copper Foil, described heat radiation Copper Foil is stacking on the top layer, and is positioned at the installation site of LED lamp.
As preferably, the area of described heat radiation Copper Foil is greater than the heat radiation solder side area of LED lamp.
As preferably, the distance between the capable and/or row of described circuit board LED lamp is successively decreased to both sides successively by the centre.
As preferably, the shape of the conductive layer of described circuit board is simultaneously corresponding to substrate-type and pin formula LED lamp.
As preferably, the substrate of described circuit board can be ordinary aluminum plate, high conduction heat-dissipating aluminium plate or pottery.
Compared with prior art, the beneficial effects of the utility model are: the circuit that is used for the LED lamp is simple and easy to do, cost is lower, can not cause this loop open circuit because of a LED lamp damages, and whole loop is quit work; The circuit board that is used for the LED lamp can not cause this loop open circuit because of a LED lamp damages, and cost is lower, perfect heat-dissipating.
Description of drawings
Fig. 1 is used for the circuit board schematic diagram of LED lamp for the utility model;
Fig. 2 is the single led zener diode circuit diagram in parallel of the utility model;
Fig. 3 is that circuit board among Fig. 2 is along the cross-sectional schematic of I-I;
Fig. 4 is welded in aluminium base circuit board schematic diagram for the single substrate-type LED of the utility model;
Fig. 5 is welded in aluminium base circuit board schematic diagram for the single pin formula of the utility model LED.
Description of reference numerals
The 1-LED lamp at transversal line to each other apart from the 2-heat resistant varnish
3-Zener diode 4-LED lamp both positive and negative polarity weldering tin touching surface
5-Zener diode and LED lamp parallel circuits 6-LED lamp series circuit
The anodal pin in 7-LED lamp polyphone loop and LED Switching Power Supply positive terminal be pad mutually
8-LED lamp polyphone loop negative pole pin and LED Switching Power Supply negative pole end be pad mutually
Aluminium base circuit board of 9-and lamp housing fixed screw holes 10-heat radiation Copper Foil
The 11-LED lamp is in longitudinal axis distance to each other
The anodal weldering of 12-LED lamp tin touching surface 13-LED lamp heatsink welding tin touching surface
14-LED lamp negative pole weldering tin touching surface 15-zener diode positive pole
16-zener diode negative pole
17-LED lamp pin copper-foil conducting electricity 18-aluminium base
The 19-aluminium base thermal conductance 20-insulating barrier of appearing
The anodal 22-substrate-type of 21-substrate-type LED lamp LED lamp negative pole
The 23-substrate-type LED lamp thermal conductance 24-substrate-type LED lamp of appearing
The anodal 26-pin of 25-pin formula LED lamp formula LED lamp negative pole
The 27-pin formula LED lamp thermal conductance 28-pin formula LED lamp of appearing
Embodiment
Below in conjunction with accompanying drawing the utility model is elaborated.
Fig. 1 to Fig. 5 shows the preferred embodiment that the utility model is used for the circuit board of LED lamp.
As shown in the figure, the utility model preferred embodiment of being used for the circuit board of LED lamp comprises aluminium base 18, insulating barrier 20, conductive layer LED lamp pin copper-foil conducting electricity 17 and the top layer of being made up of LED lamp both positive and negative polarity weldering tin touching surface 12,14 and LED lamp heat conduction weldering tin touching surface 13.Insulating barrier 20 is stacking on aluminium base 18, and conductive layer LED lamp pin copper-foil conducting electricity 17 is stacking on insulating barrier 20, and weldering tin touching surface top layer is stacking on conductive layer LED lamp pin copper-foil conducting electricity 17.Outside insulating barrier 20, also be coated with one deck heat resistant varnish 2.The preferred embodiment that the utility model is used for the circuit board of LED lamp also comprises heat radiation Copper Foil 10, and heat radiation Copper Foil 10 is stacking on weldering tin touching surface top layer, and is positioned at the installation site of LED lamp.
The examples of circuits that is used for the LED lamp that is loaded with on the circuit board is as follows: be furnished with four groups of LED lamps in parallel on the circuit board, every group of 14 LED lamps that comprise that polyphone gets up.Each LED lamp Zener diode 3 in parallel, the rated power of Zener diode 3 is greater than the bearing power of LED lamp, the starting resistor of Zener diode 3 is greater than the load voltage value 0.2VDC~0.5VDC of LED lamp, the positive pole 15 of Zener diode 3 connects the negative pole 22 or 26 of LED lamp, and the negative pole 16 of Zener diode 3 connects the positive pole 21 or 25 of LED lamp.Current direction LED lamp under the normal condition is because the starting resistor of Zener diode 3 is greater than the load voltage value of LED lamp, so this moment, Zener diode did not act on.When a LED lamp damage in the LED lamp polyphone loop 6 caused open circuit, Zener diode 3 reverse starts were accepted electric current and are flow through, and gave this loop other LED lamp supply electric energy, made this loop can not worked in whole loop because a LED lamp damages.Certainly, the LED lamp quantity in the LED lamp group number of arranging on each circuit board and every group can change along with the watt level of mains switch.
4 is the LED lamp both positive and negative polarity weldering tin touching surface of being made up of LED lamp anodal weldering tin touching surface 12 and LED lamp negative pole weldering tin touching surface 14 shown in Fig. 1,5 is Zener diode and LED lamp parallel circuits, 6 is LED lamp series circuit, 7 are the anodal pin in LED lamp polyphone loop and LED Switching Power Supply positive terminal pad mutually, 8 are LED lamp polyphone loop negative pole pin and LED Switching Power Supply negative pole end pad mutually, and 9 is aluminium base circuit board and lamp housing fixed screw holes.
The utility model is used for the area of heat radiation Copper Foil 10 of preferred embodiment of circuit board of LED lamp greater than the area of LED lamp heatsink welding tin touching surface 13.The heat that the LED lamp produces during use by substrate-type LED lamp thermal conductance appear 23 or pin formula LED lamp thermal conductance appear 27 to pass to LED lamp heatsink welding tin touching surface 13, pass to heat radiation Copper Foil 10 again.Because of the thermal conductivity ratio aluminium height of copper, thereby heat can be conducted to aluminium base 18 fast by thermal conductivity points insulating barrier 20, discharge fast by aluminium base thermal conductance 19 heat energy that LED is produced of appearing with the characteristic of aluminium rapid heat dissipation.Simultaneously, because aluminium base 18 is connected with the lamp housing (not shown), aluminium base 18 dispels the heat by lamp housing simultaneously also with the heat transferred lamp housing.
The distance 1,11 that the utility model is used between the LED lamp row and column of preferred embodiment of circuit board of LED lamp is successively decreased to both sides successively by the centre, i.e. P1 〉=P2 〉=P3 and P7 〉=P6 〉=P5 〉=P4.Existing aluminium base design LED lamp spacing each other be not too small (<2.7mm) be exactly to consider that not the heat near more centre position accumulation that the identical LED of the making lamp of LED lamp bank column pitch produced is many more, and living raising of LED lamp temperature influences the LED lamp life-span in the middle of forming, and light decay is fast.For can Homogeneouslly-radiating, the preferred embodiment that the utility model is used for the circuit board of LED lamp widens the spacing at LED lamp center, and the heat that just allows the LED lamp produce evenly conducts to heat radiation place, can not make the long-pending for a long time heat in some positions.
The utility model is used for the shape of conductive layer LED lamp pin copper-foil conducting electricity 17 of preferred embodiment of the circuit board of LED lamp can be simultaneously corresponding to substrate-type and pin formula LED lamp 24 and 28.
The circuit board of the LED of being used for lamp of the present utility model can also make substrate with high conduction heat-dissipating aluminium plate, pottery magnetic or other any materials with good heat transfer heat sinking function.
The above only is part execution mode of the present utility model and preferred embodiment, and all equivalent arrangements of being done according to the utility model claim change, all in protection scope of the present invention.

Claims (6)

1, a kind of circuit that is used for the LED lamp, comprise a plurality of LED lamps that polyphone connects, it is characterized in that each LED lamp Zener diode in parallel, the rated power of described Zener diode is greater than the bearing power of LED lamp, the starting resistor of Zener diode is greater than the load voltage value of LED lamp, the positive pole of Zener diode connects the negative pole of LED lamp, and the negative pole of Zener diode connects the positive pole of LED lamp.
2, a kind of circuit board that is loaded with the circuit of the described LED of the being used for lamp of claim 1, comprise substrate, insulating barrier, conductive layer and top layer, insulating barrier is stacking on substrate, conductive layer is stacking on insulating barrier, the top layer is stacking on conductive layer, it is characterized in that described circuit board also comprises the heat radiation Copper Foil, described heat radiation Copper Foil is stacking on the top layer, and is positioned at the installation site of LED lamp.
3, circuit board according to claim 2 is characterized in that the heat radiation solder side area of the area of described heat radiation Copper Foil greater than the LED lamp.
4, circuit board according to claim 2, it is characterized in that described LED lamp capable and/or row between distance successively decrease successively to both sides by the centre.
5, circuit board according to claim 2, the shape that it is characterized in that described conductive layer is counterpart substrate formula and pin formula LED lamp simultaneously.
6, circuit board according to claim 2 is characterized in that described substrate can be ordinary aluminum plate, high conduction heat-dissipating aluminium plate or pottery.
CNU2008201754063U 2008-10-27 2008-10-27 Circuit and circuit board used for LED lamps Expired - Fee Related CN201307955Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201754063U CN201307955Y (en) 2008-10-27 2008-10-27 Circuit and circuit board used for LED lamps

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201754063U CN201307955Y (en) 2008-10-27 2008-10-27 Circuit and circuit board used for LED lamps

Publications (1)

Publication Number Publication Date
CN201307955Y true CN201307955Y (en) 2009-09-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008201754063U Expired - Fee Related CN201307955Y (en) 2008-10-27 2008-10-27 Circuit and circuit board used for LED lamps

Country Status (1)

Country Link
CN (1) CN201307955Y (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595719A (en) * 2012-01-31 2012-07-18 江苏好的节能光电科技有限公司 Circuit for enhancing anti-lightning surge impact of LED street lamp
CN104916626A (en) * 2015-04-20 2015-09-16 深圳市旭宇光电有限公司 LED packaging method and LED packaging structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595719A (en) * 2012-01-31 2012-07-18 江苏好的节能光电科技有限公司 Circuit for enhancing anti-lightning surge impact of LED street lamp
CN104916626A (en) * 2015-04-20 2015-09-16 深圳市旭宇光电有限公司 LED packaging method and LED packaging structure
CN104916626B (en) * 2015-04-20 2017-07-18 旭宇光电(深圳)股份有限公司 LED encapsulation method and LED encapsulation structure

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090909

Termination date: 20101027