CN201038159Y

CN201038159Y - Light emitting diode module substrate with heat-conductive efficiency

Info

Publication number: CN201038159Y
Application number: CN 200720001884
Authority: CN
Inventors: 林志昌; 余明祥; 林宜芳; 王芸芸; 朱延专; 王英夫
Original assignee: Radiant Opto Electronics Corp
Current assignee: Radiant Opto Electronics Corp
Priority date: 2007-01-19
Filing date: 2007-01-19
Publication date: 2008-03-19
Anticipated expiration: 2017-01-19

Abstract

The utility model relates to a LED module base plate with heat conduction efficacy. The utility model is characterized in that the bottom base of the LED arranged on the module base plate is provided with a plurality of heat conduction holes which are filled with heat conductors; a heat conduction component is arranged on the module base plate evading an electric conductive copper foil; by the fast heat conduction of the heat conductor and the heat conduction component, the heat produced by the LED is directly educed, causing the LED to avoid reducing the illumination power or damages caused by over-high temperature.

Description

The light-emitting diode (LED) module substrate of tool heat conduction efficiency

Technical field

The utility model relates to a kind of module substrate, relates to the light-emitting diode (LED) module substrate of tool heat conduction efficiency especially.

Background technology

By the used module substrate of general light-emitting diode, be generally printed circuit board (PCB), be called for short PCB (print circuit board), and known printed circuit board (PCB) 1, as shown in Figure 1, be that the electronic circuit that desire is used is printed on the substrate 11, this substrate 11 is made with glass fibre or thermoplastic resin mostly, during making, substrate 11 is covered with the very thin Copper Foil of one deck in advance, usually earlier the appearance of printing-ink according to line map is patterned on the Copper Foil, then via etching unnecessary copper flush away, the Copper Foil that stays after the etching on substrate 11 is galvanic circle 12, this galvanic circle 12 is used for replacing lead, this lead promptly is a circuitry needed, in order to connect light-emitting diode 2, and the light-emitting diode 2 that is arranged on printed circuit board (PCB) 1 substrate 11 makes it luminous with electric current, wherein, light-emitting diode 2 is if belong to high power person or the light-emitting diode that presents with the array form, can need bigger electric current to improve luminous efficiency, therefore light-emitting diode 2 can be accompanied by the problem that amount of localized heat excessively raises along with the electric current raising, the inferior Fig. 2 that sees also, the printed circuit board (PCB) 1 that the known module substrate is used is not considered heat dissipation problem, also there is not the heat abstractor of setting, only be that the pin 21 of light-emitting diode 2 mode with welding is welded on the galvanic circle 12, when light-emitting diode 2 because of the energising adstante febre, the work of its heat radiation only depends on a little benefit of galvanic circle 12 itself, because the non-constant of thermal conductivity of general printed circuit board (PCB) 1, and, dry joint takes place in the mode of welding sometimes, the skew ... etc. phenomenon, and cause the heat conduction between light-emittingdiode and the copper-foil conducting electricity bad, make light-emitting diode 2 that anxiety because of overheated detract luminous power or damage is arranged, if single LED heat radiating is bad, other light-emitting diode that can influence most probably on the full wafer module substrate is brought into play due usefulness.

In order to improve above-mentioned shortcoming, existing dealer develops China's patent of checking and approving through an ancient unit of weight office, notification number is " High Power LED adds heat abstractor " of " 549590 ", see also Fig. 3, group is provided with printed circuit board (PCB) 4 on this heat abstractor 3, and group is provided with a plurality of High Power LEDs 5 on this printed circuit board (PCB) 4, wherein, this heat abstractor 3 has body 31, this body 31 offers recessed groove 32, and convex with contact site 33 in the bottom of this recessed groove 32, and be respectively equipped with chute 34 in the position of the contiguous contact site 33 of this recessed groove 32 2 walls, be extended with a plurality of radiating fins 35 in these body 31 root edges again, during its assembling, by chute 34 printed circuit board (PCB) 4 two sideslips are located in the heat abstractor 3, reach and be convenient to assembling, the effect of dismounting, still, add mode is for it beyond these heat abstractor 3 palpuses, not only cost height, and the shortcoming that easily causes printed circuit board (PCB) to maximize.

By as can be known above-mentioned, the known printed circuit board (PCB) 1 that module substrate is used, on substrate 11, only be provided with galvanic circle 12, there is easy localized heat degree of spending to raise because of light-emitting diode 2, and cause light-emitting diode 2 that anxiety because of overheated detract luminous power even damage is arranged, and if add heat abstractor 3, cost height not only, and the shortcoming that easily causes printed circuit board (PCB) 4 to maximize, historical facts or anecdotes has the necessity that is improved.

The utility model content

Main purpose of the present utility model, be to provide a kind of light-emitting diode (LED) module substrate of tool heat conduction efficiency, the position bottom base that it is characterized in that being arranged on the light-emitting diode of module substrate is provided with a plurality of thermal holes, this thermal hole is filled with heat carrier, and avoid the galvanic circle in module substrate and locate to be provided with heat conduction member, quick conductive by heat carrier and heat conduction member, the heat energy that light-emitting diode produces is directly guided out, light-emitting diode is reached avoid the facts because of overheated takes place to detract luminous power or damage.

Description of drawings

Fig. 1 is the stereogram of known printed circuit board (PCB).

Fig. 2 is the cutaway view of known printed circuit board (PCB).

Fig. 3 is the end view that another known printed circuit board (PCB) combines with radiator.

Fig. 4 is the stereogram of the utility model printed circuit board (PCB).

Fig. 5 is the cutaway view of the utility model printed circuit board (PCB).

Fig. 6 is the cutaway view of another embodiment of the utility model.

Embodiment

For the effect that can be easier to understand structure of the present utility model and can reach, accompanying drawings is as follows now:

At first see also Fig. 4, module substrate of the present utility model consists predominantly of printed circuit board (PCB) 6 and light-emitting diode 7, this printed circuit board (PCB) 6 is that the electronic circuit that desire is used is printed on the substrate 61, this substrate 61 is covered with the very thin Copper Foil of one deck in advance, usually earlier printing-ink is patterned on the Copper Foil according to line map, then via etching unnecessary copper flush away, the Copper Foil that stays after the etching on substrate 61 promptly is galvanic circle 62, this galvanic circle 62 is used for replacing lead, this lead promptly is a circuitry needed, in order to connect light-emitting diode 7, wherein, avoid 62 places, galvanic circle in the upper strata of substrate 61 and be provided with larger area heat conduction member 63, and lower floor also is provided with larger area heat conduction member 63, and substrate 61 is corresponding to the position of light-emitting diode 7, be provided with a plurality of thermal holes 611, the inferior Fig. 5 that sees also, the perisporium of this thermal hole 611 also is provided with heat conduction member 631, be the state that links to each other up and down by the heat conduction member 631 of thermal hole 611 perisporiums for heat conduction member 63, in thermal hole 611, be filled with heat carrier 64 in addition, this heat carrier 64 and heat conduction member 63,631 is made by the high metal material of conductive coefficient, and the utility model is example with copper.

The utility model is when implementing, because the galvanic circle 62 on the printed circuit board (PCB) 6 of module substrate, the heat conduction member 631 of heat conduction member 63 and thermal hole 611 perisporiums all is to be located in advance on the substrate 61, and heat carrier 64 also can be when making printed circuit board (PCB) 6, be filled in advance in the substrate 61 and thermal hole 611 of printed circuit board (PCB) 6 corresponding to light-emitting diode 7, therefore, module substrate of the present utility model, only need light-emitting diode 7 is located at corresponding on the thermal hole 611 of substrate 61, and the pin 71 of light-emitting diode 7 mode with welding is welded on the galvanic circle 62, as long as electric current passes through, can make light-emitting diode 7 luminous, and no matter light-emitting diode 7 is general power or belongs to the high power person, or the light-emitting diode that presents with the array form, it is because of the temperature that produced passed through of electric current, and some can conduct heat to the heat radiation of substrate 61 bottoms corresponding to the heat carrier 64 in the light-emitting diode 7 bottom thermal holes 611 by substrate 61; Another part then can conduct to heat the upper and lower heat conduction member 63 of substrate 61 by heat carrier 64 via the heat conduction member 631 of thermal hole 611 perisporiums, heat conduction member 63 by high surface area, than the good heat conduction efficiency of tool, make the heat energy that light-emitting diode 7 produced obtain effectively outwards guiding, avoid light-emitting diode 7 because of the detract facts of luminous power or damage of excessive heat build-up.

See also Fig. 6 again, be another embodiment of the present utility model, module substrate of the present utility model, also a plurality of thermal holes 611 can be made as single hole thermal hole 612, the perisporium of this thermal hole 612 also is provided with heat conduction member 631, be upper and lower continuous state for heat conduction member 63 by the heat conduction member 631 of thermal hole 612 perisporiums, in thermal hole 612, be filled with heat carrier 64 in addition.And when implementing, equally only need light-emitting diode 7 is located at corresponding on the thermal hole 612 of substrate 61, and the pin 71 of light-emitting diode 7 mode with welding is welded on the galvanic circle 62, as long as electric current passes through, can make light-emitting diode 7 luminous, and this moment light-emitting diode 7 because of the temperature that produced passed through of electric current, some can conduct heat to the heat radiation of substrate 61 bottoms corresponding to the heat carrier 64 in the light-emitting diode 7 bottom thermal holes 612 by substrate 61; A part of then can heat be conducted to the upper and lower heat conduction member 63 of substrate 61 via the heat conduction member 631 of thermal hole 612 perisporiums by heat carrier 64, make light-emitting diode 7 reach the effect of rapid heat conduction.

In sum, the light-emitting diode (LED) module substrate of tool heat conduction efficiency of the present utility model, be on the printed circuit board (PCB) of module substrate, avoid galvanic circle place establish with heat conduction member and with the corresponding thermal hole of light-emitting diode, and in thermal hole, fill heat carrier, by heat carrier with light-emitting diode because of the heat energy that produced of energising, be guided out rapidly, to avoid light-emitting diode because of the detract situation of luminous power or damage of excessive heat build-up, thereby influence other light-emitting diode on the full wafer module substrate, not only simply and not need add radiator, can effectively save cost, reach the effect of heat radiation really.

Claims

1. the light-emitting diode (LED) module substrate of a tool heat conduction efficiency, it is characterized in that, position with respect to light-emitting diode on the printed circuit board (PCB) of module substrate is provided with a plurality of thermal holes, this thermal hole is filled with heat carrier, thermal conductivity by heat carrier, the heat energy that light-emitting diode produces is directly guided out, light-emitting diode (LED) module can be dispelled the heat rapidly.

2. the light-emitting diode (LED) module substrate of tool heat conduction efficiency as claimed in claim 1 is characterized in that this thermal hole can be single hole.

3. the light-emitting diode (LED) module substrate of tool heat conduction efficiency as claimed in claim 1 is characterized in that, this heat carrier is that the metal material of high thermal conductivity coefficient is made.

4. the light-emitting diode (LED) module substrate of tool heat conduction efficiency as claimed in claim 3 is characterized in that, the metal material of this high thermal conductivity coefficient is a copper.

5. the light-emitting diode (LED) module substrate of a tool heat conduction efficiency, it is characterized in that, avoid the place, galvanic circle on the printed circuit board (PCB) of module substrate and be provided with heat conduction member, thermal conductivity by heat conduction member, make light-emitting diode heat conduction rapidly, avoid light-emitting diode that the situation of impairment luminous power or damage takes place because of dispelling the heat.

6. the light-emitting diode (LED) module substrate of tool heat conduction efficiency as claimed in claim 5 is characterized in that, this heat conduction member is that the metal material of high thermal conductivity coefficient is made.

7. the light-emitting diode (LED) module substrate of tool heat conduction efficiency as claimed in claim 6 is characterized in that the metal material of this high thermal conductivity coefficient is a copper.