CN201303206Y - Wafer type protection component provided with air chamber with electrode micro gap - Google Patents

Abstract

The utility model relates to a wafer type protection component provided with the gas chamber with an electrode micro gap. In the technical proposal, a substrate is provided with a pair of discharge electrodes which extend in opposite directions and form a micro gap; a wall part is arranged at a preset distance from the micro gap; the top part of the wall part is connected with a cover part crossing the micro gap; the wall part and the cover part are integrated in the preset environmental gas to form an gas chamber and an outer protection layer is formed on the gas chamber; and then a terminal electrode which is connected with the connection guide part is formed on the substrate. The utility model can be used as the component for over-voltage protection. When the appropriate potential difference is formed between two connection guide parts, the gas through the gas chamber becomes free to inhibit the ESD voltage through the protection component.

Description

Chip type protection component with air chamber of containing the electrode microgap

[technical field]

The utility model is about a kind of chip type protection component, especially a kind of chip type protection component with air chamber of containing the electrode microgap.

[background technology]

For avoiding uncontrollable electric voltage exception or static discharge (Electro-Static Discharge, be called for short ESD) injury electronic product, and in response to the trend of miniaturization of electronic products, the chip type protection component has been widely used in each electronic product; As Fig. 1; I253881 number " little bubble-discharge protection component of chip type and manufacture method thereof " described ceramic substrate 11 of TaiWan, China patent, first resilient coating 17, first resilient coating, 17 tops that forms 14 of termination electrodes 14, termination electrode on it in regular turn is higher than 10% conductor material and the electrode layer that is connected with termination electrode 14, and second resilient coating 18 to contain palladium (Pd) or platinum (Pt) amount.Subsequently at central part, from top to bottom cut off second resilient coating 18, electrode layer until a gap 16 of going deep into first resilient coating 17 with diamond cutter or laser beam, this moment, electrode layer was cut into two sparking electrodes 12 about diagram, and inserted easily to be heated in gap 16 and become the volatile material of gas.

Subsequently as shown in Figure 2, on the primary structure zone beyond protection component 1 two end electrodes, make external protection 15; To substrate 11 whole heating, make volatile material become gas, and between sparking electrode, form an air chamber 134 that is full of the gas of above-mentioned volatility material, and air chamber 134 outsides are that external protection 15 coats again; Electroplate connection electrode 14 De Soldering tin interface layer at ceramic substrate 11 end faces at last.

Common protection component 1 is because of being to see through cutting modes such as diamond cutter or laser beam to form gaps, the spacing of sparking electrode thereby can't reduce (between about 10～30 μ m).Because spacing is higher, not only need treat the high slightly ability of electrostatic potential conducting discharge, leave over suitable risk for the guarantee of remaining circuit element; On the other hand, because of external protection 15 is to form through high temperature sintering, makes the equipment of protection component 1 and the manufactured materials thereby the need of element itself and can tolerate high temperature, manufacturing cost can't reduce, manufacturing process thereby complicated.Especially, be filled in the volatile material gasification in the gap after, be full of in air chamber 134, volatile material can not produce chemical action with electrode, increases to material selection again to bother.

Therefore; provide a kind of electronic product that makes when being subjected to abnormal voltage or static discharge; can protect the chip type protection component of electronic product really; not only be useful in and produce more closely spaced gold-tinted micro-photographing process between sparking electrode; really ensure electronic product; and make that the blanketing gas that is all expection in the air chamber, the utility model are a best solution in fact.

[utility model content]

Therefore, main purpose of the present utility model is to provide a kind of manufacturing process need not be with high temperature with material gasification in the microgap and make the external protection sintering, thus the chip type protection component that is easy to make with air chamber of containing the electrode microgap.

Another purpose of the present utility model is to provide in a kind of microgap and can selects environment such as vacuum, air or inert gas, guarantees the non-damageable chip type protection component with air chamber of containing the electrode microgap of electrode.

A purpose more of the present utility model is to provide environment in a kind of effective control microgap, prolongs the product chip type protection component with air chamber of containing the electrode microgap in useful life.

Another purpose of the present utility model is to provide a kind of and opens the beginning discharge voltage and can drive discharge with lower, so that the chip type protection component of the air chamber that having of good electrostatic protection contain the electrode microgap to be provided.

So the chip type protection component with air chamber of containing the electrode microgap of the present utility model, comprising: a slice has the substrate of two non-conductor opposite sides; Many groups are arranged in parallel with each other, and form respectively a pair ofly to have the junction that extends to substrate one ora terminalis separately, and extended to the sparking electrode of the discharge part of a microgap of each interval in opposite directions by described junction on one of these sides; And one group form one group of surrounding wall that is full of a kind of air chamber of specific environment gas with wrapped these microgaps that cover of the common gas-tight ring of substrate, comprise one group respectively with microgap interval one preset distance, be formed at the high portion of the frame on the sparking electrode; And at least one covering part that is arranged in the high portion of frame, crosses over described microgap.

The utlity model has the chip type protection component of the air chamber of containing the electrode microgap, because the process of moulding air chamber, be under selected gaseous environment, to finish, and the blanketing gas of expection is wrapped into hollow gas chamber, guarantee that electrode environmental condition of living in meets expection, is effectively carried out predetermined discharging condition on the one hand; Guarantee the be not bullied side effects such as impurity of indoor gas of electrode on the other hand, effectively prolong component life; Especially manufacturing process need not hot environment, significantly reduces and makes degree of difficulty and cost, lifting product yield; More can select high-precision electrode manufacturing method, and promote product sensitivity of the present utility model, can discharge under lower start voltage, more effective protection remaining circuit is avoided electrostatic hazard.

[description of drawings]

Fig. 1 be common protection component in the manufacture process schematic diagram, illustrate and in electrode gap, insert volatile material;

Fig. 2 is common protection component generalized section;

Fig. 3, the 4th in the utility model first embodiment manufacture process, forms on substrate that the sparking electrode with microgap is overlooked, cross-sectional schematic;

Fig. 5, the 6th in the foregoing description manufacture process, forms the overlooking of the high portion of frame, the cross-sectional schematic of two stands on sparking electrode;

Fig. 7, the 8th in the foregoing description manufacture process, is provided with the overlooking of the covering part of crossing over this microgap, cross-sectional schematic in the high portion of frame;

Fig. 9, the 10th, in the foregoing description manufacture process, the high portion of frame, covering part is treated and form the overlooking of the air chamber contain the electrode microgap, cross-sectional schematic;

Figure 11 is the foregoing description, the schematic top plan view when element has been coated with external protection;

Figure 12 is that the part that the foregoing description has a chip type protection component of the air chamber of containing the electrode microgap is analysed and observe schematic perspective view;

Figure 13 is that the foregoing description is finished the chip type protection component horizontal section schematic diagram with air chamber of containing the electrode microgap;

Figure 14 is the supporting structure schematic diagram of the utility model second embodiment;

Figure 15 be the utility model the 3rd embodiment around the support schematic diagram;

Figure 16 is the support schematic diagram of the utility model the 4th embodiment.

[main element symbol description]

1... common protection component 2... chip type protection component

11,21,21 ', 21 ' " ... substrate

12,22,22 ', 22 ', 22 ' " ... sparking electrode

23 ... surrounding wall 14,24... termination electrode

15,25... external protection 16... gap

17... the first resilient coating 18..., second resilient coating

71～75... hatching 134,234,234 " ... air chamber

221... junction 223... discharge part

224,224 ", 224 ' " ... microgap 231,231 ", 231 ' " ... the high portion of frame

232... covering part 235,235 ', 235 " ... support

[execution mode]

About aforementioned and other technology contents, characteristics and effect of the present utility model, in the detailed description of the preferred embodiment of following conjunction with figs., can clearly present.

The Fig. 4 that please refer to Fig. 3 and illustrate according to Fig. 3 hatching 71, the chip type protection component 2 of the utility model first embodiment comprises a slice substrate 21, and for avoiding interference element running itself, substrate 21 is non-conductor at end face and both sides, bottom surface at least.In the present embodiment, though be to be example with a slice alumina substrate 21, ripe in this operator when knowing by inference easily, adopt ceramic substrate herein even outerly all can implement for the substrates such as sheet metal of insulating surface.Being formed with manyly to sparking electrode 22 independent of each other on the substrate 21, is to be example with four pairs in the present embodiment.For ease of explanation, definition sparking electrode 22 extends to substrate 21 relative ora terminalis respectively and partly is junction 221, and is discharge part 223 by the part that junction 221 extends in opposite directions.

Utilize gold-tinted micro-photographing process and metal electrode electroforming processing procedure, each is to 223 of the discharge parts of sparking electrode 22, respectively gap microgap 224 of 0.5-10 μ m only at interval.And in the present embodiment, discharge part 223 tips are arc, can avoid the most advanced and sophisticated ruined disappearance of discharge part 223 point discharge guiding discharges.Because the start voltage of the width of microgap 224 decision discharge, so narrower when microgap 224, protection component more can discharge under lower electrostatic potential at once, guarantees to adopt the circuit of this element not to be subjected to high-tension electrostatic impact.On the contrary, above-mentioned common technology is inserted the high volatile volatile material because of need in microgap, thus narrow when microgap, can't guarantee that then material fills up microgap really, thereby can't use more accurate manufacture.

The Fig. 6 that please refer to Fig. 5 and illustrate according to Fig. 5 hatching 72, in the present embodiment, be on the discharge part 223 of four pairs of electrodes 22, microgap 224 both sides along four pairs of electrodes 22, but the dry film photoresistance of one low temperature burnt together of impression is as support 235 respectively, for purposes of illustration, being referred to as described support is one high 231.See the Fig. 8 that please refer to Fig. 7 and illustrate subsequently according to Fig. 7 hatching 73, a slice more is set in the high portion 231 of frame crosses over the dry film photoresistance of microgap 224 as covering part 232, and include the microgap 224 of four groups of electrode pairs jointly with substrate 21, thereby form the blank of an air chamber by the high portion 231 of frame, covering part 232.

At this moment, guarantee that the gaseous environment of operating is a vacuum, then also be the gaseous environment of the nearly vacuum of utmost point low pressure in the air chamber, because the covering part 232 in this example is all adopted identical low temperature burnt together material with the high portion 231 of frame, only need be heated to about over one hundred degree for example Celsius, and, effectively avoid covering part 232 to hang downwards and invade microgap 224 by the support of the high portion 231 of frame, and be the near vacuum gaseous environment of utmost point low pressure in the maintenance microgap, thereby the electrical characteristic of guaranteeing sparking electrode 22 meets expection.

Certainly, can understand easily as those of ordinary skills, even if the foregoing description is to be example with utmost point environment under low pressure, but by announcement of the present utility model, only need above-mentioned steps is remained on a predetermined gas environment, no matter be vacuum, be full of dry air or inert gas, and with reference to Fig. 9 and according to Figure 10 of Fig. 9 hatching 74 signal, heated substrate 21 in this environment, make previously described high 231 and covering part 232 be melt into one jointly, form surrounding wall 23, and on the bonding to substrates 21, can guarantee residing air chamber 234 environment of sparking electrode 22 discharge ends, make discharge end not have contaminated or oxidated risk, not only be easy to make, more can keep the electrode electrical characteristic, yields is promoted, effectively prolong useful life.

What be worth emphasizing is; for ease of a large amount of manufacturings; up to this step; the substrate 21 that is formed with above-mentioned structure all still can belong to a sheet of without the substrate that cuts; and with the object of full wafer substrate as lots processed, thereby once in Production Example on the single plate base as the protection component more than hundred even thousand.

With reference to Figure 11, Figure 12 and Figure 13, behind the formation air chamber 234, will cover an external protection 25 on air chamber 234, so that further protection to be provided.And at substrate 21 ora terminalis places, utilize nickel-chromium/nickel-copper alloy (Ni-Cr/Ni-Cu alloy) or metalloid inner layer material as termination electrode 24, the element side is covered, and with nickel/tin (Ni/Sn) or other similar materials, more be coated on termination electrode 24 outermost and as the soldering interface layer.

Certainly, as be familiar with this operator and can understand easily, aforementioned high the aspect that may not have only last embodiment, shown in second preferred embodiment of Figure 14 the utility model, the discharge part place that support 235 ' also can be formed on each electrode 22 ' of corresponding substrate 21 ' constitutes the high portion of frame jointly, is subject to processing subsequently and lays out surrounding wall with the covering part one common peripheral.

Shown in Figure 15 the utility model the 3rd embodiment, the high portion 231 of frame " then can comprise and paired sparking electrode 22 " the corresponding a plurality of straight-flanked rings of number are around support 235 "; and in the present embodiment; support 235 " for around each microgap 224 " have a tackness photoresist; covering part is directly pressurized and each support 235 then " stick together, and utilize a particular light (for example ultraviolet ray), make the high portion 231 of frame " and the previously described air chamber of covering part fusion formation.In addition, above-mentioned photoresistance can be the macromolecular material of epoxy resin (Epoxy), poly-imines (Polyimide), acryl (Acrylic) or silica gel classes such as (Silicon).

Moreover; shown in Figure 16 the utility model the 4th embodiment; the formation of sparking electrode; also necessity adopts above-mentioned structure by side walls collapse; the technology that I281842 number " manufacture method of tool protruding end electrode multicircuit element wafer " the invention case of TaiWan, China that also can adopt the applicant to have disclosed; even if with sparking electrode 22 ' " junction be formed at substrate 21 ' " the sidewall overhang; still can use the high portion 231 ' of frame smoothly as previous embodiment " structure; in sparking electrode 22 ' " between form contain microgap 224 ' " air chamber, thereby make the excellent protection element.

According to the chip type protection component that the utility model is implemented with air chamber of containing the electrode microgap, the manufacturing process degree of difficulty is reduced, effectively reduce cost and promote yields; And, make that the gaseous environment between paired sparking electrode is stable, and avoid in the air chamber gas to comprise impurity or lack enough electric stability when producing the chemical reaction guiding discharge with electrode by under the specific gas environment, forming the air chamber contain the electrode microgap.So, more positively ensure types of applications electronic product of the present utility model.

The above person of thought, it only is preferred embodiment of the present utility model, when not limiting the scope that the utility model is implemented with this, be allly to change and modify, all still belong in the scope that the utility model patent contains according to the utility model claim and utility model simple equivalent that description is done.

Claims (8)

1. chip type protection component with air chamber of containing the electrode microgap comprises:

A slice has the substrate of two non-conductor opposite sides;

Many groups are arranged in parallel with each other, and form respectively a pair ofly to have the junction that extends to this substrate one ora terminalis separately, and extended to the sparking electrode of the discharge part of a microgap of each interval in opposite directions by these junctions on one of these sides; And

One group forms one group of surrounding wall that is full of a kind of air chamber of specific environment gas with wrapped these microgaps that cover of the common gas-tight ring of this substrate, comprises

One group respectively with this microgap at interval a preset distance, be formed at these to the high portion of the frame on the sparking electrode; And

At least one is arranged on these high covering part that goes up, crosses over these microgaps.

2. protection component as claimed in claim 1 is characterized in that, wherein this high portion of group frame be twice be arranged at respectively cross over each these sparking electrode parallel to each other to one of support.

3. protection component as claimed in claim 1 is characterized in that, wherein this high portion of group frame is a plurality of supports that are formed at respectively on this sparking electrode respectively.

4. protection component as claimed in claim 1 is characterized in that, wherein this high portion of group frame be a plurality of corresponding respectively around these microgaps and cross over respectively this to corresponding sparking electrode around support.

5. as claim 1,2,3 or 4 described protection components, it is characterized in that wherein this high and this covering part all are the dry film photoresistance that is subjected to the thermal softening combination.

6. protection component as claimed in claim 5 is characterized in that, more comprises the external protection that is covered on this surrounding wall.

7. as claim 1,2,3 or 4 described protection components, it is characterized in that wherein this high and the equal cording of this covering part have the photo-hardening material of tackness.

8. protection component as claimed in claim 7 is characterized in that, more comprises the external protection that is covered on this surrounding wall.

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