CN201261803Y

CN201261803Y - Ferrite hot evaporated film deposition equipment

Info

Publication number: CN201261803Y
Application number: CNU2008203018914U
Authority: CN
Inventors: 永崎高人
Original assignee: Individual
Current assignee: Individual
Priority date: 2008-08-21
Filing date: 2008-08-21
Publication date: 2009-06-24
Anticipated expiration: 2018-08-21

Abstract

A depositing equipment for ferrite evaporated film comprises a cavity body and a movable platform. Two groups of rotatable dodecagonal rollers are installed in the cavity body, tools for the object to be placed are installed on the circumferences of the rollers, a group of movable platforms are arranged on the base of the cavity body, and three rows and nine groups of tungsten boats are arranged on the platforms; therefore, the efficient productivity can be achieved by utilizing the replacement of a movable evaporator source mechanism and combination of the rotation of the rollers; additionally, the cleanliness in the cavity body can be effectively improved by utilizing the discharge effect of a voltage bias device of the equipment so that the filming quality is improved and cost is reduced.

Description

The hot evaporated film depositing device of ferrite

Technical field:

The utility model relates to a kind of hot evaporated film depositing device, the equipment that You Zhike improves the thin film deposition quality and reduces cost under preferable efficient utilization.

Background technology:

Hot evaporation is laboratory and industry member vacuum coating technology commonly used, the evaporation source mode mainly contains thermal evaporation, ion beam sputtering deposition, electricity slurry method supervisor, to originally may convert the gas molecule state to for the metallic element of solid or liquid, under the condition of camber vacuum, the mean free path of molecule is greater than the vertical range of vacuum chamber, therefore molecule is to stamp substrate with vertical direction, the advantage of this plated film is that the thin film deposition form is controlled by evaporation plating parameter, have less error for the analysis aspect, and under the vacuum state more than the moderate, the contaminating impurity degree on surface is less, and the advantage of vacuum evaporation has:

1, plated film is even: vacuum evaporation is in high vacuum system, with evaporation material evaporation, makes it to be condensate in the program on the substrate, because under condition of high vacuum degree (10 ^-3～10 ^-7Torr), the mean free path of gas molecule is about 10～10 ⁵Cm, so after the evaporation material evaporation, almost be that the path with straight ahead is agglomerated on the substrate, this can be avoided forming uneven film because of colliding interruptedly with air molecule.

2, can reduce pollutent: the absorption of any impurity, all can make film growth produce noticeable change, and in high vacuum system, just can reduce the absorption of impurity, avoid air to divide and get involved in the film, and form impure compound.

3, dry process:: general fusing point is low, the material that vapour pressure is higher can directly utilize the method for heating to make it gasification and is condensed on the substrate, needs that desire is plated material and is dissolved in the solvent but not solution immerses method, be the processing procedure of a kind of " wet type ", be difficult to be applicable to the microelectronics part of operating under the vacuum.

The present employed evaporated device 1 of industry, its structure as shown in Figure 1, this system comprises cavity 11, there is substrate 12 cavity 11 inside, mainly be that load-bearing surface sticks together formula power supply inductance FERRITE CORE or other plated body is used, 18 of aluminum oxide well heaters and substrate 12 are connected, can reach on the substrate 12 evaporation is temperature required, at the side device of substrate film thickness gauge 16 can monitor the thickness of thin film deposition, and the variation in thickness of evaporation processing procedure can be recorded in the system, tungsten boat 13 is loaded on the pedestal of cavity 11, be mainly used to carry element to be plated, as: titanium (Ti), silver (Ag), nickel (Ni), tin elements such as (Sn), cavity 11 outsides then are equipped with and are used for controlling cavity 11 temperature controlling devices 17 and electric thermo-couple temperature inductor blocks 19, have also installed the mechanical pump 15 of slightly taking out usefulness and the diffusion pump 14 of condition of high vacuum degree in addition.

Known operating method is slightly to be taken out by mechanical pump 15, treat that cavity 11 reaches and slightly take out (about 0.2Torr) after the required vacuum tightness, then close mechanical pump 15 valves, opening diffusion pump 14 then carries out the high vacuum exhaustion operation and reaches the required vacuum tightness of evaporation operation, after stablizing, cavity 11 promptly utilize 17 pairs of aluminum oxide heating tubes 18 of temperature regulator to heat, substrate 12 temperature are passed back signal in the temperature regulator 17 by electric thermo-couple temperature inductor block 19, when cavity 11 temperature reach by plating element gasification temperature, then in tungsten boat 13, be evaporated on the substrate 12 by the plating element with vertical direction, at last when film thickness gauge 16 detecting plated body surface thickness reach the one-tenth-value thickness 1/10 that sets, according to said procedure switching second or element, after treating that all elements all is deposited on surface stuck power supply inductance FERRITE CORE according to the thickness of setting, system promptly finishes the evaporation operation.

And, the existing employed main raw material of surface stuck power supply inductance FERRITE CORE is formed through the impact briquetting sintering by ferrite powder, along with the miniaturization requirement of electronic component in recent years, the miniaturization of inductance is essential, so it is extremely important that the tack on the PCB substrate just seems, the composition of the electrode terminal of general common surface stuck power supply inductance FERRITE CORE is respectively silver (Ag) from the inside to the outside, nickel (Ni), tin (Sn) layer, its common problem has: the peeling off of coatings, the electrode terminal rack of fusion, problems such as coating cost height, there is the sputtering apparatus of use to improve to this industry, but because problems such as plated film time length and material cost, so it is can't be received that sputter has many problems in exploitation.Because the evaporation production cost is less than sputter, so be emphasis and the direction of developing from now on.

The utility model content:

Technical problem to be solved in the utility model is: at above-mentioned the deficiencies in the prior art, provide a kind of hot evaporated film depositing device of ferrite that can improve the thin film deposition quality and reduce cost under preferable efficient utilization.

Though the evaporation production cost is less than sputter, general evaporation sticking power than sputter next a little less than, so, be the reduction that is difficult to realize manufacturing cost if not under the situation that evaporation characteristic and process parameter are familiar with.Therefore, the utility model will solve the cooperation that foregoing problems depends on following condition:

1, heating condition: surface stuck power supply inductance FERRITE CORE is by the ferrite powder sinter molding, its surface is not the state that presents minute surface, so the adhesion strength of film will weaken thereupon, thin film deposition is done with sputtering way in the surface of FERRITE CORE, its coated surface strong adhesion, the service temperature of this novel evaporation reaches more than 400 ℃, so must see through the condition that Heating temperature obtains the improvement of film adhesion strength that improves.

2, orlop film: first tunic of FERRITE CORE electrode terminal begins can be influenced by silver (Ag), nickel (Ni) storeroom condition of surface the otherness of surface attachment, if silver (Ag), nickel (Ni) do not heat up according to above-mentioned heating condition, the sticking power of coatings will be fragile, so in order to make degree of adhering to strong, descend most rete just to seem extremely important, titanium (Ti), zirconium (Zr) and alloy thereof are to descend the optimal material of rete most.

3, evaporation coating device: the speed of sputter and evaporation film-forming is widely different, the speed of sputter is about 1～10nm/ branch, and the speed of evaporation is about 1～50nm/ second, more than two kinds of methods all need vacuum apparatus, so after considering vacuum exhaust, pressing the incidental time of operation again, whole rate of film build also can differ several times to tens of times, if the equipment cost of evaporation and sputter is when being more or less the same, and the overall efficiency of evaporation is just quite outstanding.

In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: the hot evaporated film depositing device of a kind of ferrite, comprise cavity, evaporation source mechanism, the supervisory control desk unit, the transformer converting unit, compressor, refrigerating water pump, mechanical booster pump, be provided with film thickness gauge in this cavity, but and the thermopair of monitoring substrate temperature, be characterized in: be provided with two groups of rotatable dodecagon cylinders in the described cavity, the top of cylinder is provided with two groups of well heaters, described film thickness gauge is located at the cylinder below, described thermopair is installed in the middle of two well heaters, the rear of this cavity is provided with the variable speed motor of the speed of rotation of two groups of index drums, be provided with the tool of putting plated body this cylinder ring week, the base position of cavity then is provided with one group of packaged type platform, and the tungsten boat of nine groups of three row is set on this platform; This evaporation source mechanism is a packaged type, comprise air pressure type reciprocating actuator, array cooling water channel, reach current controller and electrode, this air pressure type reciprocating actuator sees through linear slide rail control platform motion of translation accurately and location, this current controller and electrode with platform on nine groups of tungsten boats electric connections.

So, be provided with two groups of rotatable cylinders of dodecagon in the cavity, this cylinder ring week puts for plated body, and utilize the displacement of packaged type evaporation source mechanism, and the rotation of collocation cylinder, and can be uniformly to crossed the plated film that carries out each face by plating, and can in same batch, reach two layers of metallic film of evaporation, and utilize bias box to cylinder and plated body biasing, to improve the cleaning effect on surface, increase the quality of hot evaporated film, thereby reach the effectiveness that promotes output, and that this equipment has evaporation speed is fast, the even film layer height, the prices of raw and semifnished materials are cheap, the advantage that rate of utilization height and output capacity are high.This equipment can be widely used in decorating, the surface treatment of tableware, cutter, instrument, mould, semi-conductor and electronic devices and components etc., make a general reference on the surface of various metallic substance, superhard alloy, stupalith and wafer substrate, the processing procedure of growth one deck homogeneity or dissimilar materials film, characteristic such as, anti-weldering attractive in appearance, wear-resisting, heat-resisting, anti-corrosion with its acquisition.

Description of drawings:

Fig. 1 is the synoptic diagram of known hot evaporated device.

Fig. 2 is the synoptic diagram of the hot evaporated device of the utility model.

Fig. 3 is the vertical view of the hot evaporated device of the utility model.

Fig. 4 is the synoptic diagram of the utility model cavity.

Fig. 5 is the utility model packaged type evaporation source structural scheme of mechanism.

Fig. 6 is the cut-away view of the utility model packaged type evaporation source mechanism.

Fig. 7 is the utility model cavity perspective structure figure.

Fig. 8 is the cut-away view (side-view) of the utility model cavity.

Fig. 9 is another perspective structure figure of the utility model cavity.

Figure 10 is a perspective structure figure again of the utility model cavity.

Figure 11 is the synoptic diagram of the utility model dodecagon drum apparatus.

Figure 12 is the start schematic diagram of the utility model dodecagon drum apparatus.

Label declaration:

1 evaporated device, 11 cavitys

12 substrates, 13 tungsten boats

14 diffusion pump, 15 mechanical pumps

16 film thickness gauges, 17 PID temperature regulators

18 aluminum oxide well heaters, 19 electric thermo-couple temperature inductor blocks

2 cavitys, 20 plated bodies

21 dodecagon cylinders, 22 well heaters

23 platforms, 24 tungsten boats

25 variable speed motor, 26 observation windows

27 radial pattern temperature inductors, 28 film thickness gauges

29 thermopairs, 4 supervisory control desk unit

3 packaged type evaporation source mechanisms, 31 air pressure type reciprocating actuators

32 linear slide rails, 33 control platform

34 current controllers, 35 electrodes

36 cooling water channels, 37 cooling water channels

38 cooling water channels, 5 transformer converting units

6 compressors, 7 freezing group pumps

71 main valves, 8 mechanical booster pumps

Embodiment:

Effect for being easier to understand the utility model device and can reach cooperates graphic being described as follows now:

As Fig. 2-shown in Figure 12, the utility model is a kind of high production capacity, the vacuum thermal evaporation film deposition equipment of high-level efficiency and high-cleanness, high, at first see also Fig. 2 and Fig. 3, the utility model is mainly by cavity 2, packaged type evaporation source mechanism 3, supervisory control desk unit 4, transformer converting unit 5, compressor 6, refrigerating water pump 7, mechanical booster pump 8 is formed, the inferior Fig. 4 that sees also, mechanism for the drum-type substrate in the cavity 2, two groups of dodecagon cylinders 21 rotate in cavity 2, the top of cylinder 21 is provided with two groups of well heaters 22, the base position of cavity 2 then is provided with one group of packaged type platform 23, purpose is to switch the evaporation element by mobile target position, be provided with the tungsten boat 24 of nine groups of three row on the platform 23 altogether, can provide three kinds of different evaporation elements in same cavity 2, to carry out the evaporation operation altogether, and then lifting evaporation efficient, see also Fig. 5 again, Fig. 6, it is packaged type evaporation source mechanism 3, comprise air pressure type reciprocating actuator 31, see through linear slide rail 32 motion of translation and the location of control platform 33 accurately, 24 purposes that reach heating through current controller 34 and electrode 35 of nine groups of tungsten boats on the platform, Cooling Control then is to see through

cooling water channel

36,37,38 reach, Fig. 7, Fig. 8 mainly is the internal structure of explanation cavity 2, cavity 2 contains two groups of dodecagon cylinders 21, and see through the speed of rotation of two groups of variable speed motor 25 index drums 21 at cavity 2 rears, be provided with one group of observation window 26 in the outside of cavity 2, purpose is situation and the processing procedure monitoring in the observation evaporation processing procedure, one group of radial pattern temperature inductor 27 then is equipped with in cavity 2 sides, be used for monitoring cavity 2 internal temperatures, Fig. 9, Figure 10, among Figure 11, but the below that two cylinders are 21 is provided with the film thickness gauge 28 of monitoring film thickness, but thermopair 29 monitoring substrate temperature also are housed in the middle of two well heaters, in Figure 12, two cylinders, 21 outsides can install the evaporation tool additional, tool inside then is to place plated body 20, for example: surface stuck power supply inductance FERRITE CORE etc.

Need open mechanical booster pump 8 earlier during operation, cavity 2 inside are slightly taken out, when vacuum tightness reaches set(ting)value, close mechanical booster pump 8, open the main valve 71 of refrigerating water pump 7 simultaneously, and startup refrigerating water pump 7, cavity 2 is advanced to take out, when vacuum tightness reaches set(ting)value, to add in the cavity 2 argon gas simultaneously and with bias box to substrate and plated body biasing, make argon gas formation argon ion and the plated body surface is formed discharge effect, the activated carbon that surface impurity will be frozen in the pump 7 absorbs, to reach the effect of plated body cleaning surfaces, then start well heater 22, after cylinder 21 is heated to the design temperature higher limit, keep this temperature to stop heating after about about 10 minutes, when cylinder 21 temperature are reduced to the design temperature lower value, with big current mode heating tungsten boat 24 starting material are gasified, and average rate rotary drum 21, allow plated body front scolding tin end and side scolding tin end can touch the starting material molecule, starting material molecular motion to plated body front scolding tin end surfaces and side scolding tin end forms the first layer thin film deposition under vacuum state.

When film thickness gauge 28 is tested to the film that is plated and is reached the thickness of setting (can select different thickness on demand), but packaged type evaporation source mechanism 3 auto-programmings of vacuum evaporation plating machine move, make second group of starting material tungsten boat 24 in the packaged type evaporation source mechanism 3 move to the centre of two cylinders 21, when cylinder 21 temperature drop to the evaporation temperature that second group of starting material set, second group of starting material heating and gasifying become the cylinder 21 of molecule and rotary plate traversing mechanism with big electric current, as shown in figure 12, the cylinder 21 of this substrate traversing mechanism cuts into 12 faces altogether, plated body 20 all can be put by each face place, dividing second group of starting material to move on the first layer film under vacuum state deposits, form the second layer metal film, repeat above-mentioned steps and can form the three-layer metal film, open the nitrogen valve at last and pour into nitrogen, to carry out to cavity 2 cooling actions, reduce to about about 120 ℃ when the temperature of cavity 2, can open cavity 2 and take out plated body 20, the deposit metal films processing procedure is finished.

This novel evaporation source material is to use boron nitride (BN) and tungsten boat (Tungsten Boat), wherein, the load that the advantage of boron nitride (BN) can be born big electric current, the advantage of tungsten boat (Tungsten Boat) then is that the stability of material under lower temperature evaporation environment is very high, we can select required evaporation source material according to the different service temperature of each element at this novel appts, this novel appts also considers with argon gas and bias box substrate and plated body to be applied the application of bias voltage in vacuum cavity, make argon gas formation argon ion and the plated body surface is formed discharge effect, the activated carbon that surface impurity will be frozen in the pump absorbs, and then reach the effect of plated body cleaning surfaces, promote the sticking power on surface, at present the employed vacuum evacuating system of industry is to be primary clustering with diffusion pump (Diffusion Pump), the advantage of diffusion pump is that equipment and maintenance cost are low, but diffusion pump has the risk of polluting cavity, because of the lubricating fluid in the diffusion pump easily because of pressure difference and work-ing life, make diffusion pump internals generation gap and cause the lubricating fluid adverse current to pollute cavity, this novel vacuum evacuating system then is based on refrigerating water pump (CRYO Pump), its advantage is the vacuum efficiency height, can significantly promote the quality and the efficient of evaporation, and because refrigerating water pump does not have the risk of lubricating oil adverse current, so cavity does not have contaminated risk, industry is to adopt the revolving design in plane in the mechanism design of edge of substrate at present in addition, though such design can provide good evaporation uniformity coefficient, but because the evaporation direction is perpendicular to base plan, so that evaporation also can't be carried out in the edgewise zone of plated body, cause the revolving design in plane to reduce the area of containing of evaporation greatly, but this is novel at edge of substrate employing traversing mechanism, can solve the dead angle area of traditional evaporation, and adopt " vacuum evaporation technology " to form deposit metal films at plated body scolding tin end surfaces in the part of evaporation source, this thin film deposition can see through vacuum evaporation plating machine interior " evaporation source movable type " and reach " rotary substrate " design, multiple metallic film can be finished in one batch (Batch), and can form thin film deposition in plated body surface multi-angle (face), reduced to reaching multi-angle, many metallic surfaces deposition and change that batch (Batch) is needed to vacuumize and preheating, the cycling time of heating, thereby reach the effectiveness that promotes output, novel to have evaporation speed fast and make, the even film layer height, the prices of raw and semifnished materials are cheap, the advantage that rate of utilization height and output capacity are high.

Claims

The hot evaporated film depositing device of [claim 1] a kind of ferrite, comprise cavity, evaporation source mechanism, the supervisory control desk unit, the transformer converting unit, compressor, refrigerating water pump, mechanical booster pump, be provided with film thickness gauge in this cavity, but and the thermopair of monitoring substrate temperature, it is characterized in that: be provided with two groups of rotatable dodecagon cylinders in the described cavity, the top of cylinder is provided with two groups of well heaters, described film thickness gauge is located at the cylinder below, described thermopair is installed in the middle of two well heaters, the rear of this cavity is provided with the variable speed motor of the speed of rotation of two groups of index drums, be provided with the tool of putting plated body this cylinder ring week, the base position of cavity then is provided with one group of packaged type platform, and the tungsten boat of nine groups of three row is set on this platform; This evaporation source mechanism is a packaged type, comprise air pressure type reciprocating actuator, array cooling water channel, reach current controller and electrode, this air pressure type reciprocating actuator sees through linear slide rail control platform motion of translation accurately and location, this current controller and electrode with platform on nine groups of tungsten boats electric connections.
The hot evaporated film depositing device of [claim 2] ferrite as claimed in claim 1 is characterized in that: the outside of described cavity is provided with one group of observation window.
The hot evaporated film depositing device of [claim 3] ferrite as claimed in claim 1 is characterized in that: described cavity side is provided with one group of radial pattern temperature inductor that can be used to monitor the inside cavity temperature.
The hot evaporated film depositing device of [claim 4] ferrite as claimed in claim 1 is characterized in that: also can establish a pair of substrate and plated body in the described vacuum cavity and apply the bias box that bias voltage reaches the cavity cleaning.