CN201220270Y - Temperature constancy apparatus for casting cooling water of gold bonding wire - Google Patents
Temperature constancy apparatus for casting cooling water of gold bonding wire Download PDFInfo
- Publication number
- CN201220270Y CN201220270Y CNU2008201085717U CN200820108571U CN201220270Y CN 201220270 Y CN201220270 Y CN 201220270Y CN U2008201085717 U CNU2008201085717 U CN U2008201085717U CN 200820108571 U CN200820108571 U CN 200820108571U CN 201220270 Y CN201220270 Y CN 201220270Y
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- Prior art keywords
- water
- temperature
- cooling water
- equipment
- water tank
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a cooling water constant temperature control device for production and fusion casting for gold bonding wires. A transition water tank is arranged behind refrigeration equipment, causing the water temperature of the cooling water in the transition water tank to be mild, and then the cooling water is pumped to the refrigeration equipment by a transition water pump, so that the water temperature at the inlet of the refrigeration equipment does not generate step change and to be constant, therefore, the products produced through the refrigeration equipment is free form the influence of the sudden change of the water temperature, and the uniformity of the performance of the gold bonding wire product is ensured. The utility model is designed and used for the production and fusion casting equipment for the gold bonding wires, can ensure that the water temperature is maintained in certain temperature, the method meets the requirement of maintaining the constant temperature for the cooling water by adopting the simple structure, maintains the control precision within 1 DEG C, and the utility model has very high practicability and also can be applied to the equipment of the cooling water devices with restrict water temperature control requirements.
Description
Technical field
The utility model device relates to the constant device of a kind of cooling water temperature, refers to a kind of constant device of bonding gold wire production founding cooling water temperature that is applied to especially.
Background technology
Along with development extensive, super large-scale integration, more and more higher to the requirement of encapsulating material, bonding gold wire particularly, line directly requires more and more thinner, and every performance indications such as machinery, chemistry, electricity also need satisfy the encapsulation requirement.And semiconductor devices not only requires high-performance, requirement low cost simultaneously.For reducing high cost, make the spun gold diameter more and more thinner as the fine spun gold of one of its material.The spun gold miniaturization not only can reduce required spun gold expense, and is applicable to high-density packages.
Wherein one of bonding gold wire production critical process is golden excellent vacuum continuous casting, its technology at first is to guarantee the uniformity of ingot casting crystalline structure, and the control of the water temperature of the quality of crystalline structure and uniformity and crystallization cooling water is in close relations, thereby the cooling water water temperature that in the cast process, keeps entering crystallizer cooling copper sheathing to keep constant be to guarantee to produce the requisite measure of carrying out and improves yield rate, lifting properties of product smoothly, it requires temperature deviation to be no more than 1 ℃.Yet, general cooling water circulating device is at first directly to circulate, and the recirculated water of equipment reaches uniform temperature, and compressor start begins refrigeration, and the water of refrigeration directly enters into equipment and causes the water temperature step, and the water temperature that this dual mode all can not guarantee to enter once more cooling device is constant all the time.Be illustrated in figure 1 as the cold water device schematic diagram that existing bonding gold wire is produced, the recirculated water of equipment enters refrigerator water tank 1, when water temperature reaches uniform temperature, compressor start in the refrigeration unit 2 begins refrigeration, and the water of refrigeration directly enters into and needs cooling device 5, and water temperature has dropped to 23 ℃ with regard to very fast from 28 ℃ like this, causes the water temperature step, the water inlet that can not guarantee equipment keeps constant temperature, and the processing characteristics of para-linkage spun gold causes certain influence.Thereby adopt traditional water cooling equipment to be difficult to reach this requirement, particularly the water temperature after the refrigeration machine refrigeration is the fluctuation variation, it will inevitably influence the uniformity of ingot casting crystalline structure, thereby the defective of traditional cold water device existence: the water inlet that can not guarantee equipment keeps constant temperature, and the processing characteristics of para-linkage spun gold causes certain influence.
The utility model content
In view of this, the utility model is improved above-mentioned shortcoming, and its main purpose is to guarantee to make the water temperature at equipment importation place not produce step and keep water temperature constant.
The object of the present invention is achieved like this: the constant device of a kind of bonding gold wire production founding cooling water temperature, it comprises: a refrigeration machine water tank, a refrigeration machine unit, a circulating pump and a transition water tank, form a cooling recirculation system with the equipment that is cooled, this refrigeration machine unit is connected with the water inlet pipe of the equipment of being cooled by this transition water tank.By in the transition water tank and chilled water, water temperature obtains relaxing, and no longer produces step, and the water after constant then is by transition water pump supply arrangement cooling use.
The requirement of inflow temperature value is to realize by the set temperature value that changes compressor cooling.
The beneficial effect of device of the present utility model is, utilize the water of refrigeration water tank to enter compressor by circulating pump, set the cryogenic temperature of compressor, when water temperature reaches setting value, start refrigeration, the water of refrigeration, enter the transition water tank, make the water temperature of chilled water in the transition water tank, obtain relaxing, enter into equipment by the transition water pump again, thereby reach main purpose: make the water temperature at equipment importation place not produce step and keep water temperature constant, thereby guarantee that the product that device fabrication goes out is not subjected to the influence of water temperature sudden change, thereby guarantee the uniformity of bonding gold wire properties of product.
The utility model device has simple and reasonable, temperature constant and adjustable, it is innovation to the traditional water cooling system, this method adopts simple structure to realize keeping the requirement of cooling water constant temperature, come true for equipment needed thereby provides the constant temperature water-cooled, make the optimization of bonding gold wire properties of product that reliable condition is provided.
Description of drawings
Fig. 1 is the cold water device schematic diagram that existing bonding gold wire is produced;
Fig. 2 is the cold water device schematic diagram that the bonding gold wire of the utility model one specific embodiment is produced.
The specific embodiment
Also in conjunction with the accompanying drawings utility model is further described especially exemplified by specific embodiment below:
Design philosophy of the present utility model is, the water that comes out from compressor is in refrigeration and does not freeze two states, water temperature descends rapidly when compressor cooling, the water of supplying with the transition water tank will produce step, drop to 23 ℃ from 28 ℃, at this moment water enters into the transition water tank, utilize in the transition water tank in and chilled water, make water temperature stability at 26 ℃, the water of constant temperature is used by transition water pump supply arrangement again.The water that realization equipment uses is in temperature constant state always.
The utility model one specific embodiment comprises: refrigeration machine water tank 1, refrigeration machine unit 2, a circulating pump 11 and a transition water tank 3, equipment constitutes a cooling recirculation system with being cooled, it is the cold water device schematic diagram of the bonding gold wire production of the utility model one specific embodiment as shown in Figure 2, and this refrigeration unit 2 can comprise in the present embodiment: vortex compressor, stainless steel plate type evaporimeter, copper pipe aluminum fin condenser, filter, three anti-aluminum hull blower fans, expansion valve, magnetic valve; It is the water tank of 340L that refrigeration machine water tank 1 adopts nominal volume; It is the water tank of 1000L that this transition water tank 3 can adopt nominal volume; The power of this transition water pump 4 is 1.5KW; Also can comprise an emergent petrol pump 6 and an equalizing main valve 8.
These refrigeration machine water tank 1 one ends are connected with the return pipe of the equipment of being cooled 5, the other end is connected with refrigeration machine unit 2 by these 11 pumps that circulate, refrigeration machine unit 2 outputs are connected with an end of this transition water tank 3, and the other end of transition water tank 3 is connected with the water inlet pipe of the equipment of being cooled 5;
This transition water tank 3 and be cooled and be provided with a transition water pump between the equipment 5;
All can and there be a flow divider 7,10 at these cooled equipment 5 two ends and this transition water pump 4 two ends; Should be connected to this circulating pump 11 by emergent petrol pump 6; Be connected with the equalizing main valve between this refrigeration machine water tank 1 and this transition water tank 3.Can adopt pipe fitting to connect between each parts, these pipe fittings can adopt the PPR hot melt to connect, diameter of phi 40mm, and control valve can be used the stainless steel stop valve.
When the utility model is used, at first with water on the water tank, the water of refrigerator water tank 1 enters into refrigerator unit 2 (power-off condition is down by emergency bilge pump 6) by water pump 11, when the water that enters refrigeration unit 2 reaches uniform temperature, compressor cooling, the chilled water of refrigeration flows into transition water tank 3, by in the transition water tank and chilled water, water temperature obtains relaxing, and no longer produces step, and the water after constant then is by the 5 cooling uses of transition water pump 4 supply arrangements.This device also can be equipped with emergent petrol pump 6, can cool off by Emergency water supply under situation about having a power failure, to avoid burning out equipment.Should start two water pumps (water circulating pump 11 and transition water pump 4) simultaneously, to keep same discharge.Under the different situation of the water yield, can be by regulating flow divider 7,10, utilize two water pipes between the water tank to automatically adjust, to guarantee the water level of two water tanks, reach flow and hydraulic pressure requirement (hydraulic pressure:＞0.2MPa), and make the water yield in the transition water tank 3 keep constant, this device has installed a balanced valve 8 additional, and is constant with the water yield of guaranteeing two water tanks.For the easy to operate electrical system of controlling automatically of using, temperature automatically controlled.
The variations in temperature of original chilled water unit in bonding gold wire production conticaster: after inflow temperature reaches 28 ℃, compressor start (design temperature: 23 ℃), temperature quickly falls to 23 ℃, temperature slowly rises then, be raised to 28 ℃ in 8 minutes, compressor is restarted, and water temperature will arrive 23 ℃ rapidly again, nearly 3 conversion of whole casting process; The water temperature of water outlet simultaneously changes with the water inlet water temperature, and its scope is between 31 ℃～26 ℃.
In the present embodiment, after inflow temperature reaches 28 ℃, the compressor starts refrigeration, chilled water enters into transition water tank 3, chilled water is neutralized, to relax the chilled water water temperature, the water temperature in the transition water tank 3 slowly descends, after inflow temperature is lower than 26 ℃, compressor stops refrigeration, backwater directly enters into transition water tank 3, and the water temperature in the transition water tank 3 slowly rises, and water temperature is in 25 ℃ of slowly fluctuations of constant temperature point, then by transition water pump 4, supply equipment uses, and adopt the back variations in temperature of the constant device of the utility model bonding gold wire production founding cooling water temperature to be: water temperature is highly stable, to guarantee that the water inlet water temperature is constant in a certain fixed value in casting process.
In this specific embodiment, the requirement of inflow temperature value is to realize by the set temperature value that changes compressor cooling.
The utility model is to produce the smelting-casting equipment design at bonding gold wire to use, can make water temperature constant in uniform temperature, control accuracy is about in 1 ℃, the simple structure that adopts this device has realized keeping the requirement of cooling water constant temperature, have very high practicality, also can be applied to be strict with in the coolant controlled chilled water unit equipment.
Claims (8)
1, the constant device of a kind of bonding gold wire production founding cooling water temperature, it comprises: refrigeration machine water tank, refrigeration machine unit and circulating pump, form cooling recirculation system with the equipment that is cooled, it is characterized in that: this refrigeration machine unit is connected with the water inlet pipe of the equipment of being cooled by the transition water tank.
2, the constant device of a kind of bonding gold wire production founding cooling water temperature according to claim 1, it is characterized in that: this refrigeration machine water tank one end is connected with the return pipe of the equipment of being cooled, the other end is connected with the refrigeration machine unit by this circulating pump, refrigeration machine unit output is connected with an end of this transition water tank, and the other end of transition water tank is connected with the water inlet pipe of the equipment of being cooled.
3, the constant device of a kind of bonding gold wire production founding cooling water temperature according to claim 2 is characterized in that: the described transition water tank and the string that is cooled between the equipment have a transition water pump.
4, the constant device of a kind of bonding gold wire production founding cooling water temperature according to claim 1 is characterized in that: describedly cross the water pump two ends and a flow divider is arranged.
5, the constant device of a kind of bonding gold wire production founding cooling water temperature according to claim 1, it is characterized in that: this cooling recirculation system also comprises an emergent petrol pump.
6, the constant device of a kind of bonding gold wire production founding cooling water temperature according to claim 1 is characterized in that: be connected with the equalizing main valve between described refrigeration machine water tank and the described transition water tank.
7, according to the constant device of the described a kind of bonding gold wire production founding cooling water temperature of above-mentioned arbitrary claim, it is characterized in that: a described equipment two ends and flow divider is arranged of being cooled.
8, the constant device of a kind of bonding gold wire production founding cooling water temperature according to claim 7 is characterized in that: it also comprises the temperature electrical system of control automatically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201085717U CN201220270Y (en) | 2008-06-17 | 2008-06-17 | Temperature constancy apparatus for casting cooling water of gold bonding wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201085717U CN201220270Y (en) | 2008-06-17 | 2008-06-17 | Temperature constancy apparatus for casting cooling water of gold bonding wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201220270Y true CN201220270Y (en) | 2009-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008201085717U Expired - Fee Related CN201220270Y (en) | 2008-06-17 | 2008-06-17 | Temperature constancy apparatus for casting cooling water of gold bonding wire |
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| Country | Link |
|---|---|
| CN (1) | CN201220270Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102424909A (en) * | 2011-12-02 | 2012-04-25 | 无锡透平叶片有限公司 | Cooling equipment for use in machining of GH4169 turbine disk forgings |
| CN103073070A (en) * | 2013-01-29 | 2013-05-01 | 中冶赛迪工程技术股份有限公司 | Constant-speed cooling method of freezing crystallizer |
-
2008
- 2008-06-17 CN CNU2008201085717U patent/CN201220270Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102424909A (en) * | 2011-12-02 | 2012-04-25 | 无锡透平叶片有限公司 | Cooling equipment for use in machining of GH4169 turbine disk forgings |
| CN102424909B (en) * | 2011-12-02 | 2013-05-15 | 无锡透平叶片有限公司 | Cooling equipment for use in machining of GH4169 turbine disk forgings |
| CN103073070A (en) * | 2013-01-29 | 2013-05-01 | 中冶赛迪工程技术股份有限公司 | Constant-speed cooling method of freezing crystallizer |
| CN103073070B (en) * | 2013-01-29 | 2014-12-10 | 中冶赛迪工程技术股份有限公司 | Constant-speed cooling method of freezing crystallizer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090415 Termination date: 20160617 |