CN201181694Y - Transfer case used for containing silicon slice - Google Patents

Transfer case used for containing silicon slice Download PDF

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Publication number
CN201181694Y
CN201181694Y CNU2008200311922U CN200820031192U CN201181694Y CN 201181694 Y CN201181694 Y CN 201181694Y CN U2008200311922 U CNU2008200311922 U CN U2008200311922U CN 200820031192 U CN200820031192 U CN 200820031192U CN 201181694 Y CN201181694 Y CN 201181694Y
Authority
CN
China
Prior art keywords
silicon chip
silicon chips
utility
protective layer
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008200311922U
Other languages
Chinese (zh)
Inventor
都宏伟
陈平
张文斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China National Building Materials Group Corporation Jetion Solar (China) Co., Ltd.
Original Assignee
JIANGYIN JETION SCIENCE AND TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGYIN JETION SCIENCE AND TECHNOLOGY Co Ltd filed Critical JIANGYIN JETION SCIENCE AND TECHNOLOGY Co Ltd
Priority to CNU2008200311922U priority Critical patent/CN201181694Y/en
Application granted granted Critical
Publication of CN201181694Y publication Critical patent/CN201181694Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model belongs to an auxiliary device used for producing silicon chips, in particular to a container used for holding silicon chips. According to the technical scheme provided by the utility model, the container used for holding the silicon chips includes the bottom surface and the side surface of a container body. The utility model is characterized in that the bottom surface in the container body and the surrounding side surface near the bottom surface are provided with soft protection layers. A parting strip used for parting the space surrounded by the soft protection layers is arranged in the space. A distance h is arranged between the upper end surfaces of the soft protection layers and the upper end surface of the side surface of the container box. The container used for holding silicon chips can avoid the silicon chips from being broken during the transportation process.

Description

The Turnover Box that is used for the splendid attire silicon chip
Technical field
The utility model belongs to a kind of auxiliary equipment that silicon chip is used of producing, specifically a kind of Turnover Box that is used for the splendid attire silicon chip.
Background technology
In the manufacture process of crystal silicon solar cell sheet, need use the half-finished frock of a kind of turnover.In traditional frock, usually directly a collection of silicon chip being generally 300 levels overlays in the plastic box, because silicon chip is highly brittle, therefore the problem of following two aspects can appear in this location mode: on the one hand, hand need be inserted a collection of bottom when picking and placeing silicon chip, silicon chip could be taken away, this can cause nethermost one or more pieces silicon chip fragmentations most probably; On the other hand, because not protection around the folded silicon chip, plastic box can produce inevitably in transportation and rock, and causes between two batches of silicon chips to run foul of each other, and causes fragment.According to statistics, the fragment rate that causes owing to above-mentioned two kinds of reasons is up to 0.5%, and in 1,600,000 of monthly outputs, the fragment that causes thus is: 1,600,000 * 0.5%=8000 sheets, by 50 yuan of every silicon chips, every month, direct economic loss was: ten thousand yuan of RMB of 50 yuan of * 8000=40.
Summary of the invention
The purpose of this utility model is to design a kind of Turnover Box that is used for the splendid attire silicon chip, in order to avoid fragment appears in silicon chip in transportation.
According to the technical scheme that the utility model provides, the described Turnover Box that is used for the splendid attire silicon chip comprises the bottom surface and the side of casing, it is characterized in that: the peripheral side of bottom surface in casing and close bottom surface is provided with soft protective layer.
In the space that soft protective layer surrounds, be provided for spaced apart parting bead.Between the upper surface of the upper surface of soft protective layer and casing side, spacing h is arranged.
Compared with prior art, advantage of the present utility model is handled easily on the one hand, on the other hand, significantly reduced the fragment that the original structure frock causes, the economic benefit aspect, by present two production lines, every month thus the structure frock just will save 400,000 yuan of costs, annual 4800000 yuan, under the situation of silicon materials growing tension, avoid the waste of valuable silicon materials, had remarkable social benefit.
Description of drawings
Fig. 1 is the structure chart of utility model.
Embodiment
As shown in the figure: the described Turnover Box that is used for the splendid attire silicon chip comprises the bottom surface 7 and side 3 of casing, it is characterized in that: the bottom surface 7 in casing and the peripheral side 3 of close bottom surface 7 are provided with soft protective layer 5.In the space 4 that soft protective layer 5 surrounds, be provided for space 4 separated parting beads 6 so that dwindle the space, are convenient to store classifiedly.Between the upper surface of the upper surface of soft protective layer 5 and casing side 3, spacing h is arranged, so that operation.
Improve the back Turnover Box, silicon chip 1 is in batch placed vertically to stack by every original silicon wafer horizontal, change every silicon chip 1 vertical placement level into to stack, and soft protective layer 5 is all arranged on every side, and soft protective layer 5 is also arranged at the bottom, when picking and placeing silicon chip 1 on the one hand, just will not reach the bottom of silicon chip 1 in batch by hand, avoid causing fragment, only needs with the hands directly pinch a collection of silicon chip 1, mention to get final product; On the other hand, in transmittance process, because silicon chip 1 all has soft protective layer 5 all around, also avoid 1 fragment that runs foul of each other and cause of many batches of silicon chips, fragment rate drops to zero substantially.

Claims (3)

1, the Turnover Box that is used for the splendid attire silicon chip, bottom surface (7) that comprises casing and side (3) is characterized in that: the bottom surface in casing (7) and soft protective layer (5) is set near the peripheral side (3) of bottom surface (7).
2, the Turnover Box that is used for the splendid attire silicon chip as claimed in claim 1 is characterized in that: be provided for the separated parting bead in space (4) (6) in the space (4) that soft protective layer (5) surrounds.
3, the Turnover Box that is used for the splendid attire silicon chip as claimed in claim 1 is characterized in that: between the upper surface of the upper surface of soft protective layer (5) and casing side (3) spacing (h) is arranged.
CNU2008200311922U 2008-01-29 2008-01-29 Transfer case used for containing silicon slice Expired - Fee Related CN201181694Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200311922U CN201181694Y (en) 2008-01-29 2008-01-29 Transfer case used for containing silicon slice

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200311922U CN201181694Y (en) 2008-01-29 2008-01-29 Transfer case used for containing silicon slice

Publications (1)

Publication Number Publication Date
CN201181694Y true CN201181694Y (en) 2009-01-14

Family

ID=40251190

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200311922U Expired - Fee Related CN201181694Y (en) 2008-01-29 2008-01-29 Transfer case used for containing silicon slice

Country Status (1)

Country Link
CN (1) CN201181694Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101875363A (en) * 2010-03-19 2010-11-03 常州亿晶光电科技有限公司 Lifting type transit loader of battery lamination parts
CN102244140A (en) * 2011-06-20 2011-11-16 浚鑫科技股份有限公司 Diffusion turnover box
CN102553874A (en) * 2012-02-23 2012-07-11 高佳太阳能股份有限公司 Transfer box for cleaning of silicon wafers
CN103523384A (en) * 2013-10-29 2014-01-22 高佳太阳能股份有限公司 Transport packaging box for silicon wafers
CN105438645A (en) * 2015-11-24 2016-03-30 无锡普瑞腾传动机械有限公司 Improved silicon wafer transportation packaging box
CN108622515A (en) * 2018-05-17 2018-10-09 江苏高照新能源发展有限公司 A kind of novel transfer water tank

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101875363A (en) * 2010-03-19 2010-11-03 常州亿晶光电科技有限公司 Lifting type transit loader of battery lamination parts
CN102244140A (en) * 2011-06-20 2011-11-16 浚鑫科技股份有限公司 Diffusion turnover box
CN102553874A (en) * 2012-02-23 2012-07-11 高佳太阳能股份有限公司 Transfer box for cleaning of silicon wafers
CN103523384A (en) * 2013-10-29 2014-01-22 高佳太阳能股份有限公司 Transport packaging box for silicon wafers
CN105438645A (en) * 2015-11-24 2016-03-30 无锡普瑞腾传动机械有限公司 Improved silicon wafer transportation packaging box
CN108622515A (en) * 2018-05-17 2018-10-09 江苏高照新能源发展有限公司 A kind of novel transfer water tank

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: JETION SOLAR (CHINA) CO., LTD.

Free format text: FORMER NAME: JIANGYIN JETION SCIENCE AND TECHNOLOGY CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 214443 No. 1011, Cheng Cheng Road, Jiangyin, Jiangsu

Patentee after: Jetion Solar(China) Co., Ltd.

Address before: 214443 No. 1011, Cheng Cheng Road, Jiangyin, Jiangsu

Patentee before: Jiangyin Jetion Science and Technology Co., Ltd.

C56 Change in the name or address of the patentee

Owner name: CNBM JETION SOLAR (CHINA) TECHNOLOGY CO., LTD.

Free format text: FORMER NAME: JETION TECHNOLOGY CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 214443 No. 1011, Cheng Cheng Road, Jiangyin, Jiangsu

Patentee after: China National Building Materials Group Corporation Jetion Solar (China) Co., Ltd.

Address before: 214443 No. 1011, Cheng Cheng Road, Jiangyin, Jiangsu

Patentee before: Jetion Solar(China) Co., Ltd.

CP01 Change in the name or title of a patent holder
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090114

Termination date: 20160129

EXPY Termination of patent right or utility model