CN201134207Y

CN201134207Y - Full colored display module in house

Info

Publication number: CN201134207Y
Application number: CNU2007203119003U
Authority: CN
Inventors: 刘振亮
Original assignee: Individual
Current assignee: Individual
Priority date: 2007-11-14
Filing date: 2007-12-18
Publication date: 2008-10-15
Anticipated expiration: 2017-12-18

Abstract

The utility model relates to a display module structure of LED display screen, in particular to an indoor full-color display module, wherein a PCB baseboard is provided with a plurality of luminescence wafers in a matrix, the luminescence wafers are welded on the PCB baseboard via a wafer fixing technology, the mask is fit with the PCB baseboard, the PCB baseboard after fixing wafer and welding wire is embedded in the mask and compressed with the mask, each nearby four luminescence wafers on the PCB baseboard have two reds, one blue and a green which are distributed diagonally, the pins of each luminescence wafer are leaded out from the back of the PCB baseboard, the pins of each red luminescence wafer are independent in the view of circuit. The utility model utilizes digital circuit technology to combine red luminescence wafers with nearby red and green luminescence wafers into a new composite pixel, thereby significantly improving the image resolution of the display screen to improving the quality of the display screen.

Description

A kind of indoor full-color demonstration module

One, technical field:

The utility model relates to a kind of demonstration modular structure of forming indoor display screen: a kind of indoor full-color demonstration module.

Two, background technology:

The existing used demonstration module of indoor LED full color display of forming, its technology is module surface plane structure, each pixel internal illumination wafer adopts the red green indigo plant that adds that adds to dispose, this traditional pixel constituted mode all is restricted in lifting image resolution ratio and the color spot interference of elimination dark space.Adopt the existing indoor full color display that shows that module is formed, be difficult to realize reaching the purpose that promotes its image resolution ratio and display screen quality by further technological means.

Three, utility model content:

Technical problem to be solved in the utility model:

At the prior art deficiency, propose a kind of follow-on indoor all-colour LED and show module, can improve the quality and the display effect of indoor full-color LED display screen to a certain extent.

The technical scheme that the utility model adopted:

A kind of indoor full-color demonstration module, contain face shield and PCB substrate, on the PCB substrate, be provided with the luminescent wafer that distributes by certain matrix array, described face shield and PCB substrate are complementary, described luminescent wafer adopts the solid brilliant technology of chip directly to be welded on the PCB substrate, PCB substrate setting-in behind solid brilliant bonding wire is pressed on face shield in face shield, every four adjacent luminescent wafers are two red on the PCB substrate, one indigo plant, one green configuration, two emitting red light wafers and green, the blue-light-emitting wafer is the diagonal angle respectively and distributes, each luminescent wafer pin is drawn from the PCB substrate back, and wherein each emitting red light wafer pin is independent separately on circuit.

Described indoor full-color demonstration module, each luminescent wafer is provided with ellipse or the paraboloidal condensing body to outer process on the corresponding PCB substrate in face shield surface.

Described indoor full-color demonstration module, each ellipse of OFP surface or paraboloidal condensing body surface and plane junction thereof are the pitted skin structure, when oval condensing body was adopted on the OFP surface, the transverse axis length of oval condensing body was greater than the length of its Z-axis.

Described indoor full-color demonstration module, each luminescent wafer is provided with light hole on the corresponding PCB substrate in face shield surface, and described light hole is the cone-shaped cavity of inner face aperture less than the aperture, outer face, is filled with transparent or semitransparent curing glue in the light hole.

Solidifying glue shaping rear surface in the described light hole, to be shaped as ball crown, oval spherical or square, solidifies the glue profiled surface or be the plane, solidifies in the glue or adding color dispersing agent or blue pigment.

Aforesaid indoor full-color demonstration module, the OFP surface is pitted skin or grid striated structure.

Described indoor full-color demonstration module, face shield adopt dark brown or the moulding of blue clear plastic integral molded plastic, and the part of PCB substrate surface except that fixedly luminescent wafer position and lead solder-joint is provided with black coating.

Described indoor full-color demonstration module, face shield and PCB substrate are by reference column and locating support connection, and locating support is arranged on the face shield inside surface, and is corresponding with pilot hole on the driving PCB substrate.

The indoor full-color demonstration module of the utility model, when design LED screen circuit, the green emitting wafer G, the blue-light-emitting wafer B that utilize digital circuit technique to make emitting red light wafer R1, R2 can be adjacent respectively are combined as new composite pixel, the picture element density of its display image is former one red, green when adding three luminescent wafers configurations of a basket four times, and image resolution ratio obtains big lifting.

Useful good effect of the present utility model:

1, the display screen of the indoor full-color demonstration module composition of the utility model, image resolution ratio can be highly improved, and has further improved the display screen quality.The utility model each matrix dot position on the PCB substrate is provided with a luminescent wafer, every four adjacent luminescent wafers adopt two emitting red light wafers and an indigo plant, the one green arrangement that is the diagonal angle distribution is respectively formed pixel, during design LED screen circuit, make emitting red light wafer R1 by digital circuit technique, the green emitting wafer G that R2 can be adjacent respectively, blue-light-emitting wafer B is combined as new composite pixel, the picture element density of its display image is that tradition one is red, one green when adding the configuration of three luminescent wafers of a basket four times, image resolution ratio is improved significantly.

2, the whole colored transparent of the indoor full-color demonstration module face shield of the utility model, the module surface quality gets a promotion, and can guarantee the display screen quality; Oval condensing body in module surface and junction pitted skin structure in addition, and the whole blackings of part except that fixedly luminescent wafer position and lead solder-joint on the PCB substrate, guaranteeing that luminous point brightness has guaranteed dark space black as far as possible simultaneously, can significantly improve display screen contrast.

3, the indoor full-color demonstration module of the utility model directly is provided with luminescent wafer composition display screen luminous point on the PCB substrate, is nested into transparent optically focused face shield then, and simple in structure, with low cost, display effect is good.

4, the arrangement of many one times of blue relatively, the green emitting wafer of the emitting red light wafer on the indoor full-color demonstration module PCB substrate of the utility model, can guarantee to achieve composite pixel, and then reach the effect that image resolution ratio improves four times by external circuit.

Four, description of drawings:

Fig. 1: one of indoor full-color demonstration module one-piece construction synoptic diagram of the utility model

Fig. 2: structural representation is partly cutd open in indoor full-color demonstration module shown in Figure 1 side-looking

Fig. 3: luminescent wafer arrangenent diagram on the indoor full-color demonstration module internal pcb board of the utility model

Fig. 4: two of the indoor full-color demonstration module one-piece construction synoptic diagram of the utility model

Fig. 5: structural representation is partly cutd open in indoor full-color demonstration module shown in Figure 4 side-looking

Five, embodiment:

Embodiment one: referring to Fig. 1～Fig. 3, the indoor full-color demonstration module of the utility model contains face shield 1 and PCB substrate 5, is provided with the luminescent wafer 4 that distributes by certain matrix array on PCB substrate 5, and the pin 3 of each luminescent wafer is drawn from PCB substrate 5 back sides.Face shield 1 adopts dark brown or the moulding of blue clear plastic integral molded plastic, face shield 1 and PCB substrate 5 mate mutually, PCB substrate 5 setting-ins are in face shield 1, each luminescent wafer 4 is provided with the oval condensing body 2 to outer process on the corresponding PCB substrate 5 of face shield 1 outside surface, and the transverse axis length of oval condensing body is greater than the length of its Z-axis.The shape of condensing body 2 also can adopt paraboloidal projection or truncated-spherical body projection.

Referring to Fig. 2, Fig. 3, the indoor full-color demonstration module of the utility model each matrix dot position on PCB substrate 5 is provided with a luminescent wafer 4, every four adjacent luminescent wafers adopt two emitting red light wafers and an indigo plant, a green arrangement, two emitting red light wafers and green, blue-light-emitting wafer are the diagonal angle respectively and distribute and form pixel, two its pins of emitting red light wafer on circuit separately independently.When design LED screen circuit, the green emitting wafer G, the blue-light-emitting wafer B that utilize digital circuit technique to make emitting red light wafer R1, R2 can be adjacent respectively are combined as new composite pixel, when the picture element density of its display image is former one red, green and three luminescent wafers configurations of a basket four times, image resolution ratio obtains big lifting.

With respect to the length of the direct integrated oval condensing body 2 transverse axis length in each luminescent wafer position greater than Z-axis, light emits internally and makes it to gather into level angle greater than the vertical angle cone-shaped beam on face shield 1 surface.The part whole blackings of PCB substrate 5 surfaces except that fixedly luminescent wafer and lead solder-joint, transparent face mask 1 each condensing body 2 of surface and plane junction thereof adopt the pitted skin structure, after face shield, the PCB substrate in combination, watching the whole look of demonstration module from the face shield front is aterrimus, no luminous point white color spot, the white color spot disturbs in the time of effectively avoiding low-luminosity picture, promotes picture contrast.

The utility model shows module, and its pel array can be other array way that 2*2,4*4,8*8,16*16 or row, column number do not wait, and present embodiment shows that module pixel arrangement mode is the 4*4 matrix array.

Embodiment two: referring to Fig. 3～Fig. 5, label is identical with embodiment one among Fig. 4, Fig. 5, represents same meaning, no longer repeats.The indoor full-color demonstration module of present embodiment, luminescent wafer layout, connected mode are with embodiment one on the PCB substrate, it is with embodiment one difference: each luminescent wafer 4 is provided with light hole 6 on the face shield 1 surperficial corresponding PCB substrate 5, light hole 6 is the cone-shaped cavity of inner face aperture less than the aperture, outer face, be filled with transparent or semitransparent curing glue 8 in the light hole 6, the light transmission colloid that luminescent wafer 4 sends emits.In the process, use different rubber moulding forming plastic cement spares, and by adjusting glue proportioning and total rubber, can make and form surface configuration after glue is shaped in the light hole is crown, the oval spherical or square structure of ball, or be the surface plane structure, by in glue, adding color dispersing agent or other blue pigments, the module aberration when not luminous after the shaping is reduced as far as possible, the visual angle is bigger when luminous.

Face shield 1 adopts the moulding of black non transparent plastic cement integral molded plastic, outside surface adopts pitted skin or striated structure, pilot hole in face shield 1 inside surface four angles on the corresponding driving PCB substrate is provided with locating support 7, and locating support is arranged on the face shield inside surface, and is corresponding with pilot hole on the driving PCB substrate.Face shield 1 passes through reference column 9 connections with PCB substrate 5, and pcb board is pressed on the glue shell behind solid brilliant bonding wire.Locating support 7 assurance modules are accurately located when being welded to connect with the driving PCB substrate.Because the whole blackings of the part of PCB substrate 5 surfaces except that luminescent wafer and lead solder-joint, dark brown or blue face shield appear as all black, and be opaque, and the surface is pitted skin or striated structure, can reduce reflective.

Claims

1, a kind of indoor full-color demonstration module, contain face shield and PCB substrate, on the PCB substrate, be provided with the luminescent wafer that distributes by certain matrix array, described face shield and PCB substrate are complementary, it is characterized in that: described luminescent wafer adopts the solid brilliant technology of chip directly to be welded on the PCB substrate, PCB substrate setting-in behind solid brilliant bonding wire is pressed on face shield in face shield, every four adjacent luminescent wafers are two red on the PCB substrate, one indigo plant, one green configuration, two emitting red light wafers and green, the blue-light-emitting wafer is the diagonal angle respectively and distributes, each luminescent wafer pin is drawn from the PCB substrate back, and wherein each emitting red light wafer pin is independent separately on circuit.

2, indoor full-color demonstration module according to claim 1 is characterized in that: each luminescent wafer is provided with ellipse or the paraboloidal condensing body to outer process on the corresponding PCB substrate in described face shield surface.

3, indoor full-color demonstration module according to claim 2, it is characterized in that: OFP each ellipse of surface or paraboloidal condensing body surface and plane junction thereof are the pitted skin structure, when oval condensing body was adopted on OFP surface, the transverse axis length of oval condensing body was greater than the length of its Z-axis.

4, indoor full-color demonstration module according to claim 1, it is characterized in that: each luminescent wafer is provided with light hole on the corresponding PCB substrate in described face shield surface, described light hole is the cone-shaped cavity of inner face aperture less than the aperture, outer face, is filled with transparent or semitransparent curing glue in the light hole.

5, indoor full-color demonstration module according to claim 4, it is characterized in that: it is crown, oval spherical or square that the interior curing of light hole glue shaping rear surface is shaped as ball, solidify the glue profiled surface or be the plane, solidify in the glue or adding color dispersing agent or blue pigment.

6, according to claim 4 or 5 described indoor full-color demonstration modules, it is characterized in that: described OFP surface is pitted skin or grid striated structure.

7, according to each described indoor full-color demonstration module of claim 1～5, it is characterized in that: described face shield adopts the moulding of black non transparent plastic cement integral molded plastic, and the part of PCB substrate surface except that fixedly luminescent wafer position and lead solder-joint is provided with black coating.

8, indoor full-color demonstration module according to claim 7, it is characterized in that: face shield and PCB substrate are by reference column and locating support connection, and locating support is arranged on the face shield inside surface, and be corresponding with pilot hole on the driving PCB substrate.