CN102394034A - High-density LED (light emitting diode) full-color dot matrix module and making method thereof - Google Patents
High-density LED (light emitting diode) full-color dot matrix module and making method thereof Download PDFInfo
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- CN102394034A CN102394034A CN2011103784820A CN201110378482A CN102394034A CN 102394034 A CN102394034 A CN 102394034A CN 2011103784820 A CN2011103784820 A CN 2011103784820A CN 201110378482 A CN201110378482 A CN 201110378482A CN 102394034 A CN102394034 A CN 102394034A
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Abstract
The invention discloses a high-density LED (light emitting diode) full-color dot matrix module and a making method thereof. The LED full-color dot matrix module comprises a multilayer printed wiring board and a plurality of LED chips arranged on the multilayer printed wiring board, wherein the periphery of the LED chips is provided with a plastic reflection outer frame for reflecting light rays; the inside of the plastic reflection outer frame is filled with epoxy resin for diffusing light rays; and the back surface of the multilayer printed wiring board is welded with a pin header which is used for introducing a current to lighten the LED chips. The current is introduced by using the pin header welded on the back surface so as to prevent the pins from occupying the wiring space on the front surface, so that the whole space on the front surface can be used for crystal solidification of the LED chips and wiring of the weld line zone, thereby implementing high-density wiring.
Description
Technical field
The present invention relates to LED and show product and processing technology, relate in particular to full-color lattice module of a kind of high density LED and method for making.
Background technology
LED display has experienced from monochromatic, double-colored graphic display screen, to image display panel, and up till now the development course of full color display again.The pixel LED full color display is the plane formula display screen that utilizes LED lattice module or pixel cell to form.It has luminosity factor height, long service life, configuration flexibly, rich color and to advantages such as the indoor and outdoor surroundings adaptive faculty are strong, be able to widespread use on market.Range of application spreads all over various aspects such as traffic, advertisement, telecommunications, indoor stage and meeting room background.
Existing LED lattice module is combined by several LED full color pixel; Be electrically connected each other between each LED full color pixel; But be limited to factors such as encapsulation condition and the design of LED full color pixel, existing LED lattice module exists that volume is big, pixel is low and defective such as white balance difference.
Also there is defective in the production technology of tradition LED lattice module:
As shown in Figure 1, adopt pin (PIN) 1 to combine with double-deck PCB (Printed Circuit Board printed wiring board) 2 through the mode of pressing, its technology requires high to the coupling of material.The too small meeting of PIN1 is loosening, and the head of PIN1 too greatly then PCB2 via hole is extruded and breaks, and all can produce poor flow, causes functional inefficacy.And PIN1 is softer, is prone to produce looper, distortion etc. unusually, influences follow-up use.In addition, need to set the PIN hole during PCB2 wiring, cause pel spacing further to reduce in certain location.
As shown in Figure 2, there is following defective in the processing technology of the LED lattice module of prior art:
External pin utilization extruding is towards the riveting mode; Reach with PCB hole inner metal layer and combine, realize importing the function of electric current, and adopt this mode; External pin must regularity be arranged; So must take the wiring space of positive and negative two face portion, cause realizing pel spacing 4mm and above PCB layout demand, can't realize more highdensity wiring.
Summary of the invention
For solving the defective that prior art exists; The present invention provides a kind of wiring density height, volume is little and be electrically connected the full-color lattice module of reliable high density LED; Comprise multilayer printed wiring board and establish a plurality of light-emitting diode chip for backlight unit above that; Said light-emitting diode chip for backlight unit periphery is provided with the plastic cement reflection housing that is used for reflection ray, and the epoxy resin that is used to spread light is filled in the inside of said plastic cement reflection housing, wherein; Weldering row pin is pasted at the back side of said multilayer printed wiring board, is used for electric current is imported to light said light-emitting diode chip for backlight unit.
According to embodiment, also can adopt following optimized technical scheme:
Said multilayer printed wiring board is a printed wiring board more than four layers.
Said subsides weldering row pin adopts the soldering mode, print solder paste layer before pad place, the back side subsides weldering row pin of said multilayer printed wiring board.
Said plastic cement reflection housing is processed with black or grey colorant.
The display pixel hole, front of said plastic cement reflection housing is square.
The present invention also provides a kind of high density LED the working method of full-color lattice module, and it comprises the steps:
A. will arrange pin and paste the back side that is placed on multilayer printed wiring board;
B. welding row pin is to said multilayer printed wiring board;
C. mount the front of light-emitting diode chip for backlight unit to said multilayer printed wiring board;
D. solid brilliant and bonding wire;
E., said plastic cement reflection housing and sealing are installed.
According to embodiment, working method of the present invention also can adopt following optimized technical scheme:
Before the said steps A also to pad place, the back side print solder paste layer of said multilayer printed wiring board.
The soldering mode is adopted in welding among the said step B, and said step C also carries out cleaning surfaces to the facial area and the wire welding area of said multilayer printed wiring board before, adopts epoxy resin as adhesive material in the said step e.
Plastic cement reflection housing in the said step e is processed with black or grey colorant.
The display pixel hole, front of the plastic cement reflection housing in the said step e is square.
The invention has the beneficial effects as follows:
Use the back side to paste weldering row pin electric current is imported, thereby avoid pin to take the front wiring space, make positive space of planes can all be used for the solid crystalline substance and the wire welding area wiring demand of light-emitting diode chip for backlight unit, and then realized high-density wiring.In addition, use the printed wiring board of multilayer (4 layers and more than), further expanded wiring space, make wiring route wideer, and help the LED heat radiation.
The display pixel hole, front of plastic cement reflection housing by traditional circle change be designed to square, solid brilliant, the bonding wire craft of more convenient binding site array module, its space utilization is better, is beneficial to the realization of high-density wiring.Simultaneously, the surface pixels point can maximize, the light-emitting zone spacing of display pixel littler (light-emitting zone is not littler), and the complementary fusion of pixel is better, can improve display effect.
The conventional point array module uses the white plastic material, and the present invention uses black or grey colorant, can promote the display screen picture contrast; When being applied to indoor stage or meeting room background; Can not produce the phenomenon of side or positive whiting,, can not see tangible white point phenomenon yet even when not lighting.
Description of drawings
Fig. 1 is the structural representation of the full-color lattice module of LED of prior art.
Fig. 2 is that the external pin utilization is pushed towards the riveting mode, reaches with PCB hole inner metal layer to combine, and realizes the product structure synoptic diagram (the part parts that only show product) of the processing mode of importing electric current.
Fig. 3 is the structural representation of the full-color lattice module of high density LED of one embodiment of the invention.
Fig. 4 is that the full-color lattice module of the high density LED of one embodiment of the invention adopts the back to paste the product structure synoptic diagram (the part parts that only show product) that weldering row pin mode realizes importing the processing mode of electric current.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the present invention is done further detailed explanation.
Principle of the present invention is: through pasting weldering formula row pin foreign current is imported; Realize lighting of each regional light-emitting diode chip for backlight unit through multilayer printed wiring board; The reflection of each chip light emitting through plastic cement reflection and resin, spread after; Luminous equal can fully the diffusion and fusion of red, green, blue three color chips in each pixel finally realized the full-color demonstration application of perfect high definition.
As shown in Figure 3; It is the structural representation of the full-color lattice module of high density LED of one embodiment of the invention; It comprises four layers of printed wiring board 2 and establishes a plurality of light-emitting diode chip for backlight unit 3 above that; Said light-emitting diode chip for backlight unit 3 peripheries are provided with the plastic cement reflection housing 4 that is used for reflection ray, and the epoxy resin 5 that is used to spread light is filled in the inside of said plastic cement reflection housing 4, wherein; Weldering row pin 1 is pasted at the back side of said multilayer printed wiring board 2, is used for electric current is imported to light said light-emitting diode chip for backlight unit 3.Pad place, the back side print solder paste layer 6 of said multilayer printed wiring board 2.Said subsides weldering row pin 1 realizes that through reflow machine molten soldering connects.
Said plastic cement reflection housing 4 usefulness black or grey colorant are processed.The conventional point array module uses the white plastic material, uses black or grey colorant in the present embodiment, can promote the display screen picture contrast; When being applied to indoor stage or meeting room background; Can not produce the phenomenon of side or positive whiting,, can not see tangible white point phenomenon yet even when not lighting.
In the present embodiment, the display pixel hole, front of said plastic cement reflection housing 4 is square, and pixel aperture is designed to square advantage and is: can consolidate brilliant, bonding wire craft by the binding site array module; Its space utilization is better; Be beneficial to the realization of high density technology, the surface pixels point can maximize the light-emitting zone spacing of display pixel littler (light-emitting zone is not littler) simultaneously; The complementary fusion of pixel is better, can improve display effect.
One skilled in the art will appreciate that said multilayer printed wiring board 2 also can be four layers or surpass four layers, and, more wiring space can be arranged with the increase of the number of plies.
As shown in Figure 4, the full-color lattice module of the high density LED of one embodiment of the invention adopts the back to paste the product structure synoptic diagram (the part parts that only show product) that weldering row pin mode realizes importing the processing mode of electric current.Its processing technology is following:
The first step: use unit clamp, row's pin 1 pad place brushes one deck tin cream 6 with multilayer printed wiring board 2 back sides, will paste weldering formula row pin 1 accurate the subsides and be placed on correspondence position, adopts the soldering mode to accomplish the welding of row's pin 1 through reflow machine.
Second step: subsides are welded printed wiring board 2 surfaces of row behind the pin 1 clean, mainly carry out the cleaning of front crystal bonding area, wire welding area.
The 3rd step: use automatically solid brilliant machine, bonding equipment, completion light-emitting diode chip for backlight unit 3 mounts, the bonding wire operation.
The 4th step: before the sealing, use application specific probe formula anchor clamps to accomplish test.
The 5th step: said plastic cement reflection housing 4 is installed and is accomplished the module sealing, specifically: the glue → encapsulating of taping → preheating → join → vacuumize → cage plate → go into roasting.Wherein, adopt epoxy resin as adhesive material, said plastic cement reflection housing 4 usefulness black or grey colorant are processed, and its display pixel hole, front is square.
The 6th step: tear tape, use anchor clamps to accomplish finished product test.
Adopt back of the present invention to paste the processing technology of weldering guide pin, make pin not take the front wiring space, positive space of planes can all be used for solid crystalline substance, the wire welding area wiring demand of light-emitting diode chip for backlight unit, thereby can realize the possibility of high-density wiring.Processing technology of the present invention; Can realize the production of the full-color lattice module of spacing 3mm, and the Wiring technique of prior art, because of external pin must regularity be arranged; Need take the wiring space on positive and negative two sides, so can only realize pel spacing 4mm and above PCB layout demand.In addition, external pin of the present invention adopts the soldering mode to connect, and makes electric conductivity more reliable, and dashing the riveter skill and in punching course, can causing PCB hole inner metal layer to destroy of prior art causes poor flow.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, make some substituting or obvious modification under the prerequisite of the present invention design not breaking away from, and performance or purposes are identical, all should be regarded as belonging to protection scope of the present invention.
Claims (10)
1. full-color lattice module of high density LED; Comprise multilayer printed wiring board and establish a plurality of light-emitting diode chip for backlight unit above that; Said light-emitting diode chip for backlight unit periphery is provided with the plastic cement reflection housing that is used for reflection ray; The epoxy resin that is used to spread light is filled in the inside of said plastic cement reflection housing, it is characterized in that: weldering row pin is pasted at the back side of said multilayer printed wiring board, is used for electric current is imported to light said light-emitting diode chip for backlight unit.
2. the full-color lattice module of high density LED as claimed in claim 1 is characterized in that: said multilayer printed wiring board is a printed wiring board more than four layers.
3. the full-color lattice module of high density LED as claimed in claim 1 is characterized in that: pad place, the back side print solder paste layer of said multilayer printed wiring board, said subsides weldering row pin is placed in corresponding pad place and adopts the soldering mode to connect.
4. like the full-color lattice module of arbitrary described high density LED among the claim 1-3, it is characterized in that: said plastic cement reflection housing is processed with black or grey colorant.
5. the full-color lattice module of high density LED as claimed in claim 4 is characterized in that: the display pixel hole, front of said plastic cement reflection housing is square.
6. the working method of the full-color lattice module of high density LED is characterized in that comprising the steps:
A. will arrange pin and paste the back side that is placed on multilayer printed wiring board;
B. welding row pin is to said multilayer printed wiring board;
C. mount the front of light-emitting diode chip for backlight unit to said multilayer printed wiring board;
D. solid brilliant and bonding wire;
E., said plastic cement reflection housing and sealing are installed.
7. the working method of the full-color lattice module of high density LED as claimed in claim 6 is characterized in that: before the said steps A also to pad place, the back side print solder paste of said multilayer printed wiring board.
8. the working method of the full-color lattice module of high density LED as claimed in claim 6; It is characterized in that: the soldering mode is adopted in the welding among the said step B; Said step C also carries out cleaning surfaces to the facial area and the wire welding area of said multilayer printed wiring board before, adopts epoxy resin as adhesive material in the said step e.
9. the working method of the full-color lattice module of high density LED as claimed in claim 6 is characterized in that: the plastic cement reflection housing in the said step e is processed with black or grey colorant.
10. the working method of the full-color lattice module of high density LED as claimed in claim 9 is characterized in that: the display pixel hole, front of the plastic cement reflection housing in the said step e is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103784820A CN102394034A (en) | 2011-11-24 | 2011-11-24 | High-density LED (light emitting diode) full-color dot matrix module and making method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011103784820A CN102394034A (en) | 2011-11-24 | 2011-11-24 | High-density LED (light emitting diode) full-color dot matrix module and making method thereof |
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| CN102394034A true CN102394034A (en) | 2012-03-28 |
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| CN2011103784820A Pending CN102394034A (en) | 2011-11-24 | 2011-11-24 | High-density LED (light emitting diode) full-color dot matrix module and making method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
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| CN201134207Y (en) * | 2007-11-14 | 2008-10-15 | 刘振亮 | Full colored display module in house |
| CN201251064Y (en) * | 2008-09-02 | 2009-06-03 | 葛庆国 | Novel LED ceiling lamp |
| CN202050595U (en) * | 2011-05-09 | 2011-11-23 | 山东翔里光电科技有限公司 | High-pixel heat-dissipation-type light-emitting diode (LED) circuit board |
| CN202352251U (en) * | 2011-11-24 | 2012-07-25 | 深圳市丽晶光电科技股份有限公司 | High-density light emitting diode (LED) full-color lattice module |
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2011
- 2011-11-24 CN CN2011103784820A patent/CN102394034A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201134207Y (en) * | 2007-11-14 | 2008-10-15 | 刘振亮 | Full colored display module in house |
| CN201251064Y (en) * | 2008-09-02 | 2009-06-03 | 葛庆国 | Novel LED ceiling lamp |
| CN202050595U (en) * | 2011-05-09 | 2011-11-23 | 山东翔里光电科技有限公司 | High-pixel heat-dissipation-type light-emitting diode (LED) circuit board |
| CN202352251U (en) * | 2011-11-24 | 2012-07-25 | 深圳市丽晶光电科技股份有限公司 | High-density light emitting diode (LED) full-color lattice module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN105810115B (en) * | 2016-05-30 | 2019-08-20 | 深圳市奥蕾达科技有限公司 | All-colour LED luminescent panel |
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