CN201117656Y - Luminous diode packaging structure - Google Patents
Luminous diode packaging structure Download PDFInfo
- Publication number
- CN201117656Y CN201117656Y CNU2007201137401U CN200720113740U CN201117656Y CN 201117656 Y CN201117656 Y CN 201117656Y CN U2007201137401 U CNU2007201137401 U CN U2007201137401U CN 200720113740 U CN200720113740 U CN 200720113740U CN 201117656 Y CN201117656 Y CN 201117656Y
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- CN
- China
- Prior art keywords
- contact
- led chip
- emitting diode
- negative pole
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A novel packaging structure of light emitting diode is provided, in particular to a fixing and electrode extraction structure. The prior technology has the disadvantages of bad heat dissipation performance and large luminous decay. Including an installation board and a LED chip arranged on the installation board, the utility model is characterized in that the installation board is provided with an installation groove the both ends of which are respectively provided with an anode contact sheet and a cathode contact sheet. The LED chip is arranged in the installation groove and clipped between the anode contact sheet and the cathode contact sheet. The installation board is also provided with a circuit switching block. The anode and the cathode contacts respectively have electric connection with the anode contact point and the cathode contact point of the circuit switching block. The middle heat conduction links of the LED lighting equipment are reduced. Consequently, the heat dissipation performance is improved and the service life is prolonged. The structure is credible and the packaging is convenient.
Description
[technical field]
The utility model relates to a kind of encapsulating structure of light-emitting diode, especially a kind of fixing and electrode deriving structure of led chip.
[background technology]
Existing LED encapsulating structure all is that the commercially available preliminary encapsulated LED chip piece of finishing is connected on the mounting panel, and positive and negative polarities are caused on the transit line piece of installing on the version by the conducting wire, version will be installed again link to each other with radiator.Because commercially available led chip piece all has pedestal, the caloric requirement that LED produced during work just can reach heat sink radiates through chip block body and mounting panel successively, more intermediate transfer link can influence the heat dispersion of LED lighting apparatus, causes the LED light decay bigger, influences useful life.
[utility model content]
In order to overcome the above-mentioned defective that exists in the prior art, the utility model provides a kind of novel light-emitting diode encapsulating structure, reaches the purpose that improves LED lighting apparatus heat dispersion, increases the service life by optimizing structure, reduce the intermediate thermal conductivity link.
For this reason, the utility model is by the following technical solutions: the novel light-emitting diode encapsulating structure, comprise mounting panel and the led chip of being located on the mounting panel, it is characterized in that described mounting panel is provided with mounting groove, the two ends of mounting groove are respectively equipped with anodal contact and negative pole contact, led chip is located in the mounting groove and is folded between anodal contact and the negative pole contact, also be provided with the transit line piece on the described installation version, described anodal contact and negative pole contact are electrically connected with the positive contact and the negative contacts of transit line piece respectively.During use, version will be installed to be connected on the radiator, the utility model is directly installed led chip on mounting panel, deducted chip block body of the prior art, the heat that produces during LED work only need just can arrive radiator through the transmission of mounting panel, and heat conduction is quick, effectively improved the heat dispersion of LED lighting apparatus, reduced light decay, prolonged useful life, suitably chosen the material that version is installed and more can further improve heat conductivility.The utility model just can be realized chip gripper being electrically connected between anodal contact and negative pole contact in encapsulation process, and contact is reliable, and is easy to operate.
As the further of technique scheme improved and replenish, the utility model is taked following technical measures:
Described led chip has a plurality of, and these a plurality of led chips are folded between anodal contact and the negative pole contact after being connected into chip alignment.The quantity of led chip can be selected as required, and to reach required brightness, each led chip both positive and negative polarity is end to end, and the negative or positive electrode of outermost two led chips then joins with anodal contact and negative pole contact.
The cross section of described mounting groove is trapezoidal, outwards launches gradually on the cell wall on its both sides, bottom surface is oblique.Led chip is convenient to install, is reliably located to dovetail groove, after the oblique cell wall processing, can also play light harvesting, reflective effect.
Described led chip is rounded, and anodal contact and negative pole contact are and the corresponding arc ring shape of led chip.Arc ring shape contact can be stuck in led chip between them firmly, guarantees to be electrically connected reliable.
Have connecting through hole on the described mounting panel, be convenient to be spirally connected, mode such as pin joint will install version and link to each other with radiator.
Beneficial effect: the utility model has reduced the intermediate thermal conductivity link of LED lighting apparatus, thereby has improved heat dispersion by directly led chip being connected on the mounting panel, has prolonged useful life, reliable in structure, and encapsulation is convenient.
[description of drawings]
Fig. 1 is a structural representation of the present utility model.
Fig. 2 is the schematic cross-section of the utility model mounting groove.
[embodiment]
Novel light-emitting diode encapsulating structure as shown in Figure 1, mounting panel 1 can be made with the metal material of good heat conductivity, offer mounting groove 3 on it, mounting groove 3 is built-in with some led chips 2, the two ends of mounting groove 3 are respectively equipped with anodal contact 4 and negative pole contact 5, and led chip 2 just is stuck between anodal contact 4 and the negative pole contact 5.Contact is arc ring shape, and is corresponding with led chip.
The cross section of mounting groove is trapezoidal (Fig. 2), can play the effect of reflective surface after its two cell walls polishing.
Anodal contact 4 and negative pole contact 5 are connected to the positive contact and the negative contacts of transit line piece 7 respectively by electrical interconnection 6, are convenient to link to each other in external circuit, and electrical interconnection 6 can directly be printed on the mounting panel 1.
Mounting panel 1 also has some connecting through holes 8.
During use, mounting panel 1 is linked to each other with radiator, transit line piece 7 links to each other with external circuit and gets final product.
Claims (5)
1, novel light-emitting diode encapsulating structure, comprise mounting panel and the led chip of being located on the mounting panel, it is characterized in that: described mounting panel is provided with mounting groove, the two ends of mounting groove are respectively equipped with anodal contact and negative pole contact, led chip is located in the mounting groove and is folded between anodal contact and the negative pole contact, also be provided with the transit line piece on the described installation version, described anodal contact and negative pole contact are electrically connected with the positive contact and the negative contacts of transit line piece respectively.
2, novel light-emitting diode encapsulating structure according to claim 1, it is characterized in that: described led chip has a plurality of, and these a plurality of led chips are folded between anodal contact and the negative pole contact after being connected into chip alignment.
3, novel light-emitting diode encapsulating structure according to claim 1 and 2, it is characterized in that: the cross section of described mounting groove is trapezoidal, outwards launches gradually on the cell wall on its both sides, bottom surface is oblique.
4, novel light-emitting diode encapsulating structure according to claim 3, it is characterized in that: described led chip is rounded, and anodal contact and negative pole contact are and the corresponding arc ring shape of led chip.
5, novel light-emitting diode encapsulating structure according to claim 3 is characterized in that: have connecting through hole on the described mounting panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201137401U CN201117656Y (en) | 2007-08-24 | 2007-08-24 | Luminous diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201137401U CN201117656Y (en) | 2007-08-24 | 2007-08-24 | Luminous diode packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201117656Y true CN201117656Y (en) | 2008-09-17 |
Family
ID=39992239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201137401U Expired - Fee Related CN201117656Y (en) | 2007-08-24 | 2007-08-24 | Luminous diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201117656Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101656251B (en) * | 2009-06-22 | 2012-01-25 | 李建营 | Method for lowering light attenuation of light emitting diode |
-
2007
- 2007-08-24 CN CNU2007201137401U patent/CN201117656Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101656251B (en) * | 2009-06-22 | 2012-01-25 | 李建营 | Method for lowering light attenuation of light emitting diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080917 Termination date: 20110824 |