CN201116311Y - Wafer bump manufacturing hanger - Google Patents
Wafer bump manufacturing hanger Download PDFInfo
- Publication number
- CN201116311Y CN201116311Y CNU2007201024136U CN200720102413U CN201116311Y CN 201116311 Y CN201116311 Y CN 201116311Y CN U2007201024136 U CNU2007201024136 U CN U2007201024136U CN 200720102413 U CN200720102413 U CN 200720102413U CN 201116311 Y CN201116311 Y CN 201116311Y
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- wafer
- conductive plate
- main board
- current conducting
- main body
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Abstract
The utility model provides a hanging tool for manufacturing a wafer bump, which is arranged on a conducting jig at the side of a plating bath and used for the growth and the manufacture of the wafer bump. The hanging tool of the utility model solves the problems that in the prior wafer hanging tool the structure is complex, the cost is high, and the different sizes of wafers are inconvenient for replacement. The hanging tool of the utility model comprises a main body plate (10), current conducting plates (12) are fixed and arranged on the main body plate (10) and a handle (14), the main body plate (10) is provided with a circular current conducting disc (8), the current conducting plates (12) are fixed and connected with the current conducting disc (8), a thread sleeve (9) is embedded and sleeved on the main body plate (10) around the current conducting disc, a flange (2) fixes the wafers on the current conducting disc (8) of the main body plate (10) through a tightening plastic bolt and a thread sleeve (9), a sealing ring (3) is arranged between the outer ring of the flange (2) and the main body plate (10), and a sealing ring (4) is arranged between the inner ring of the flange (2) and the current conducting disc (8). The hanging tool is suitable for manufacturing the wafer bump.
Description
Technical field
The present invention relates to the fixing utensil of electroplating element in a kind of plating tank, be particularly related to a kind of hanger of employed fixedly wafer when wafer is electroplated, this hanger is used for the growth and the manufacturing of wafer convex point, and this processing procedure is a critical process of wafer level packaging (WLP) process.Hanger is installed in to be electroplated on the trough rim conductive fixture, and whole conducting process does not have lead to connect, and its structure can make the plating salient point can grow quickly and evenly on wafer.
Background technology
Crystal element being carried out in the encapsulation technology, the tool novelty of Wafer-Level Packaging Technology, caught people's attention most, is that encapsulation technology obtains the revolutionary sign of breaking through.Wafer level packaging mainly adopts film redistribution technology, salient point to form two big basic technologies.The former is used for the welding region along the chip circumferential distribution is converted to the salient point welding zone that distributes by the planar array form on chip surface.The latter then is used for making salient point on the salient point welding zone, forms welded ball array.In the salient point forming process, the wafer hanger plays conduction, fixing, connection and sealing function.At present, galvanized R﹠D institution of domestic research wafer and enterprise are few in number, and the hanger of having developed exists many problems mostly, mainly there is complex structure, the cost height can not be suitable for the wafer of different size easily, and the growth precision of wafer convex point is the high-technology problem not.
Summary of the invention
The invention solves existing wafer hanging tool structure complexity, cost height, the different size wafer is changed inconvenient technical problem.
The present invention overcomes the above problems by following scheme:
The present invention includes hanger main board 10, handle 14 that is provided with in the upper fixed of main board 10 and the fixed block 13 above the handle, on described main board 10 and handle 14, be set with conducting plates 12, middle part at the front panel of hanger main board 10 is set with a circular conductive plate 8, conducting plates 12 is fixedlyed connected with conductive plate 8, on the main board 10 around the conductive plate, be nested with metal rib-loop cover 9, flange 2 is fixed on wafer on the conductive plate 8 on the hanger main board 10 by fastening plastic screw 1 and metal rib-loop cover 9, between the outer ring of flange 2 and main board 10, be provided with sealing-ring 3, between the inner ring of flange and conductive plate 8, be provided with sealing-ring 4.
Can be provided with the wafer plane positioning step on the described conductive plate 8.Can be provided with electroconductive elastic sheet 6 on the described conductive plate 8, an end of this electroconductive elastic sheet 6 is fixed on the conductive plate 8 by screw 5, and the other end elastic compression is on wafer.
This hanger provides good conditions and environment for the generation of wafer convex point, and simple in structure, cost is low, can make corresponding hanger size at the different standards wafer size and change, and easy to install, salient point growing height difference can remain on below the 5 μ m.
Description of drawings
Fig. 1 is a deployed configuration synoptic diagram of the present invention
Fig. 2 is a schematic appearance of the present invention
Embodiment
The present invention will be described below in conjunction with accompanying drawing:
Wafer is positioned on the plane, concave station rank of conductive plate 8, and conductive plate 8 is fixing with hanger main board 10 by screw 7, and metal rib-loop cover 9 is nested in the hanger main board 10.Electroconductive elastic sheet 6 acts on wafer peripheral by the snap-in force of screw 5.Sealing-ring 3 effective seal positions are placed on the wafer ragged edge, sealing-ring 4 effective seal positions are placed on the outer of electroconductive elastic sheet 6, tongued and grooved flanges 2 on sealing-ring 3 and sealing-ring 4, can reach good sealing effectiveness thereby make wafer need not galvanized ground by fastening plastic screw 1 and metal threaded cover 9 pressuring actions.Stainless steel conducting strip 12 is connected with conductive plate 8 by two screws, is internal thread on the conductive plate.Handle 14 is fixing with hanger main board 10 by screw 15, makes stainless steel conducting strip 12 realize smooth effect by screw 11.Handle contiguous block 13 is realized being connected with handle 14 by two screws.In galvanized process, the top of handle contiguous block 13 and stainless steel conducting strip 12 links together direct and special-purpose conductive fixture.In electroplating process, electric current arrives conductive plate 8 then along conductive fixture to stainless steel conducting strip 12, again will be directly to wafer UBM layer all round by electroconductive elastic sheet 6 electric currents.Whole conducting process does not have lead and connects, thereby has guaranteed the cathodic current of wafer convex point growth.
Claims (3)
1, a kind of wafer convex point producing hanging fixture, comprise hanger main board (10), the handle (14) that is provided with in the upper fixed of main board (10) and the fixed block (13) of handle top, it is characterized in that, on described main board (10) and handle (14), be set with conducting plates (12), middle part at the front panel of hanger main board (10) is set with a circular conductive plate (8), conducting plates (12) is fixedlyed connected with conductive plate (8), on the main board (10) around the conductive plate, be nested with metal rib-loop cover (9), flange (2) is fixed on wafer on the conductive plate (8) on the hanger main board (10) by fastening plastic screw (1) and metal rib-loop cover (9), between the outer ring of flange (2) and main board (10), be provided with sealing-ring (3), between the inner ring of flange (2) and conductive plate (8), be provided with sealing-ring (4).
2, a kind of wafer convex point producing hanging fixture according to claim 1 is characterized in that, described conductive plate (8) is provided with the wafer plane positioning step.
3, a kind of wafer convex point producing hanging fixture according to claim 1 and 2, it is characterized in that, described conductive plate (8) is provided with electroconductive elastic sheet (6), and an end of this electroconductive elastic sheet (6) is fixed on the conductive plate (8) by screw (5), and the other end elastic compression is on wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201024136U CN201116311Y (en) | 2007-08-29 | 2007-08-29 | Wafer bump manufacturing hanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201024136U CN201116311Y (en) | 2007-08-29 | 2007-08-29 | Wafer bump manufacturing hanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201116311Y true CN201116311Y (en) | 2008-09-17 |
Family
ID=39990885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201024136U Expired - Lifetime CN201116311Y (en) | 2007-08-29 | 2007-08-29 | Wafer bump manufacturing hanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201116311Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| CN106711103A (en) * | 2016-11-11 | 2017-05-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Conducting strip for electroplating semiconductor wafer and electric contact sealing structure |
| TWI666344B (en) * | 2018-08-22 | 2019-07-21 | 台灣創智成功科技有限公司 | Conductive ring, power supply device based on same, and electroplating fixture based on power supply device |
| CN112458509A (en) * | 2020-11-16 | 2021-03-09 | 苏州太阳井新能源有限公司 | Clamp for electroplating photovoltaic cell |
-
2007
- 2007-08-29 CN CNU2007201024136U patent/CN201116311Y/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103469271A (en) * | 2013-09-11 | 2013-12-25 | 深圳市创智成功科技有限公司 | Hanging tool for wafer electroplating |
| CN103469271B (en) * | 2013-09-11 | 2016-02-17 | 深圳市创智成功科技有限公司 | The hanger of wafer plating |
| CN106555220A (en) * | 2016-11-11 | 2017-04-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| CN106711103A (en) * | 2016-11-11 | 2017-05-24 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Conducting strip for electroplating semiconductor wafer and electric contact sealing structure |
| CN106555220B (en) * | 2016-11-11 | 2018-05-18 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Semiconductor wafer electroplating clamp and clamping method |
| CN106711103B (en) * | 2016-11-11 | 2019-02-05 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Conducting strip for electroplating semiconductor wafer and electric contact sealing structure |
| TWI666344B (en) * | 2018-08-22 | 2019-07-21 | 台灣創智成功科技有限公司 | Conductive ring, power supply device based on same, and electroplating fixture based on power supply device |
| CN112458509A (en) * | 2020-11-16 | 2021-03-09 | 苏州太阳井新能源有限公司 | Clamp for electroplating photovoltaic cell |
| CN112458509B (en) * | 2020-11-16 | 2021-11-05 | 苏州太阳井新能源有限公司 | Clamp for electroplating photovoltaic cell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANXI ZHONGDIAN KEXIN ENERGY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHINA ELECTRONIC TECHNOLOGY GROUP CORPORATION NO.2 RESEARCH INSTITUTE Effective date: 20100915 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 030024 NO.115, HEPING SOUTH ROAD, TAIYUAN CITY, SHANXI PROVINCE TO: 030032 NO.5, TANGHUAI ROAD, TAIYUAN ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE, TAIYUAN CITY, SHANXI PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20100915 Address after: 030032 Shanxi city of Taiyuan province Taiyuan economic and Technological Development Zone Tang Cassia Road No. 5 Patentee after: SHANXI BRANCH OF NEW ENERGY COMPANY Address before: 030024 Taiyuan Heping Road, Shanxi, No. 115 Patentee before: China Electronic Technology Group Corporation No.2 Research Institute |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080917 |