CN201112798Y - 36 wire ceramic four-side lead wire flat packaging integrated circuit aging testing socket - Google Patents
36 wire ceramic four-side lead wire flat packaging integrated circuit aging testing socket Download PDFInfo
- Publication number
- CN201112798Y CN201112798Y CN 200720109306 CN200720109306U CN201112798Y CN 201112798 Y CN201112798 Y CN 201112798Y CN 200720109306 CN200720109306 CN 200720109306 CN 200720109306 U CN200720109306 U CN 200720109306U CN 201112798 Y CN201112798 Y CN 201112798Y
- Authority
- CN
- China
- Prior art keywords
- socket
- contact
- lead
- integrated circuit
- contact piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 20
- 230000032683 aging Effects 0.000 title claims abstract description 15
- 239000000919 ceramic Substances 0.000 title abstract description 6
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title 1
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 10
- 229920006351 engineering plastic Polymers 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 claims description 4
- 230000008676 import Effects 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 4
- 238000004377 microelectronic Methods 0.000 abstract description 3
- 229910000906 Bronze Inorganic materials 0.000 abstract description 2
- 238000005299 abrasion Methods 0.000 abstract description 2
- 239000010974 bronze Substances 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 238000010791 quenching Methods 0.000 abstract description 2
- 238000002474 experimental method Methods 0.000 abstract 2
- 244000089486 Phragmites australis subsp australis Species 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 230000000171 quenching effect Effects 0.000 abstract 1
- 238000011056 performance test Methods 0.000 description 4
- 244000273256 Phragmites communis Species 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to a microelectronic component aging experiment socket, in particular to a socket that can conduct high-temperature aging experiments and tests for the reliability of 36-wire ceramic quad flat packaging integrate circuit components. The socket adopts the technical proposal that the socket is designed into three parts, namely a socket body, a contact piece and an adapter according to the size requirements and structural design of 36-wire ceramic quad flat packaging integrate circuit components; the socket body comprises a base, a cover and a clasp; the socket body is made through high-temperature injection forming with imported high-temperature-resistant special engineering plastics; the socket body is used for positioning, installing and pressing tested components; when the clasp is stressed and meshed with the base, the tested components are pressed tightly against the contact piece; the contact piece is sheet-formed by beryllium-bronze through 300 DEG C high-temperature quenching treatment and surface gold plating; the pitch of the contact piece is 1mm; the contact piece is formed by four axial-symmetrical reeds and is arranged on the four grooves of the socket body base; the adapter comprises a circuit board and a lead; the socket can conduct slot testing after being switched to the lead through the circuit board. The socket has the advantages of small contact resistance, good consistency, zero insertion-withdrawal force, surface abrasion resistance and convenient use, and greatly improves the reliability and service life of the socket.
Description
Technical field
The utility model relates to a kind of microelectronic component aging test socket, especially the socket that can carry out high-temperature circulation test and test to the reliability of 36 lines potteries, four limits lead-in wire flat-pack integrated circuit components and parts.
Background technology
At present, in China reliability engineering field, what domestic aging test socket series of products bulk material adopted is non-high-temperature resistant unskilled labor engineering plastics, when measured device is tested, aging working temperature only is-25 ℃～+ 85 ℃, and the aging operating time is of short duration, and the socket contact surfaces is silver-plated, simple in structure, exist and measured device between a little less than big, the anti-environment of contact resistance, consistency is not high and mechanical endurance is long significant deficiency.In China microelectronic component reliability field, pottery four limits lead-in wire flat-pack integrated circuit components and parts high-end technology product, because of the isolated plant of no high temperature ageing reliability test, can not satisfy test request to the device performance index, cause accident resulting from poor quality of projects easily.
Summary of the invention
For overcoming existing aging test socket in the deficiency aspect contact resistance, high temperature resistant and consistency and useful life, the utility model provides a kind of aging test socket.This socket can not only expand the operating temperature range that wears out to-65 ℃～+ 150 ℃ from-25 ℃～+ 85 ℃, once aging stream time reaches 1000h (150 ℃), connect-disconnect life is more than 20000 times, and tested device is being carried out in high-temperature circulation test and the performance test process, have that contact resistance is little, high conformity, reliability height, ZIF, surface abrasion resistance and advantage easy to use, the reliability and the useful life of having improved socket greatly.
The technical scheme that the utility model technical solution problem is adopted is: structural design and dimensional requirement according to 36 lines pottery, four limits lead-in wire flat-pack integrated circuit components and parts become three big part, i.e. socket, contact, adapters with jack design.Socket is made up of seat, lid and hook, select the extraordinary high-temperature engineering plastics of high temperature resistant type of import for use, manufacture jack body through the high-temperature injection molding technology thereof, the location and installation that is used for tested device, socket can play hold down gag simultaneously, when the stressed downward upset of hook is meshed with seat, make lid produce displacement, thereby make tested device compress contact.Contact is with the beryllium-bronze material punch forming, gold-plated through 300 ℃ of quench hots processing and the hard gold layer of plating technical face, the pitch of contact has only 1mm, is made up of the four sides reed of axial symmetry, and with the corresponding mode of tested device lead-out wire, be installed on the four sides groove of socket seat.This utility model can be directly used in the high-temperature circulation test and the performance test of ceramic four limits lead-in wire flat-pack integrated circuit components and parts.Adapter is made up of wiring board and lead-in wire, and socket can carry out the slot test after transferring by wiring board and lead-in wire.This flip-shell mechanism is designed to contact the structure of ZIF, wearing and tearing electrodeposited coating when having avoided the contact plug, influence electrical contact performance, thoroughly solved big, the anti-environment of contact resistance in high-temperature circulation test and performance test process a little less than, the consistency difference and mechanical endurance long technological difficulties.This utility model adopts the two sides symmetric form on structural design, socket four sides reed is relative two sides symmetry, and the reed number difference of two adjacent surfaces, this structure is applicable to special ceramics four limits lead-in wires flat-pack integrated circuit components and parts, and satisfies the requirements of the different lead-in wires of tested device.
The beneficial effects of the utility model are: can satisfy 36 lines lead-in wire flat-pack integrated circuit components and parts high-temperature circulation test of similar ceramic four limits with other and performance test, filled up domestic blank, substitute import, for country has saved foreign exchange, for the user has saved cost, can obtain bigger economic benefit and social benefit.
Description of drawings
The utility model is described in further detail below in conjunction with accompanying drawing and example.
Fig. 1 is a contour structures of the present utility model vertical section structural map.
Fig. 2 is the utility model appearance structure vertical view.
56 forward foot in a step reeds of Fig. 11 hook, 2 little torsion spring 3 lid 4 big torsion springs, 7 rear foot reeds
89 wiring board 10 lead-in wires
Embodiment
In Fig. 1, the first step: contact is forward foot in a step reed 6 and rear foot reed 7 by axial symmetry, packs in the seat 8 of socket with the corresponding mode of tested device lead-out wire; Hook 1, axle 5 and little torsion spring 2 are packed into and covered in 3; Second step: the lid 3 that the first step is installed, big torsion spring 4 and axle 5 are packed in the seat 8; The 3rd step: the 10 usefulness soldering tin that will go between are connected on the wiring board 9, and the socket that second step was installed is welded on the circuit 9 again.
In this scheme, socket is used for tested device mounting location, also plays a part hold down gag simultaneously, and when the stressed downward upset of hook was meshed with seat, tested device compressed contact automatically; Contact by gold-plated reed by with corresponding, automatic fastening of tested device lead-out wire and ZIF structure be installed on socket the seat in; Socket by wiring board and wire bonds after applicable to DIP type slot.
Claims (3)
1. one kind is applicable to 36 lines pottery, four limits lead-in wire flat-pack integrated circuit aging test socket, it is characterized in that: it is made up of socket and two part unifications of contact, socket is made up of seat, lid and hook, socket also plays a part tightening device simultaneously, socket is selected the extraordinary high-temperature engineering plastics of the high temperature resistant type of import for use, form through the manufacturing of high-temperature injection molding technology thereof, contact corresponding with tested device lead-out wire and be installed on socket the seat in.
2. 36 lines pottery according to claim 1, four limits lead-in wire flat-pack integrated circuit aging test socket, it is characterized in that: socket and contact are a unified integral body, contact is rearranged on four sides by 36 lines of axial symmetry, the gold-plated reed of 1mm spacing, is installed on respectively in 4 grooves of seat.
3. according to right 1 described 36 lines pottery four limits lead-in wire flat-pack integrated circuit aging test socket, it is characterized in that: the locking device of socket is made up of seat, hook, with the flip-shell structure contact is designed to bales catch locking type, ZIF structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720109306 CN201112798Y (en) | 2007-05-10 | 2007-05-10 | 36 wire ceramic four-side lead wire flat packaging integrated circuit aging testing socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200720109306 CN201112798Y (en) | 2007-05-10 | 2007-05-10 | 36 wire ceramic four-side lead wire flat packaging integrated circuit aging testing socket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201112798Y true CN201112798Y (en) | 2008-09-10 |
Family
ID=39964546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200720109306 Expired - Fee Related CN201112798Y (en) | 2007-05-10 | 2007-05-10 | 36 wire ceramic four-side lead wire flat packaging integrated circuit aging testing socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201112798Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646889A (en) * | 2012-04-01 | 2012-08-22 | 中国电子科技集团公司第四十研究所 | Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm |
| CN103176114A (en) * | 2011-12-20 | 2013-06-26 | 夏普株式会社 | Pre-heating device |
| CN105552636A (en) * | 2016-02-05 | 2016-05-04 | 中国电子科技集团公司第四十研究所 | Modular embedded integrated circuit socket |
| CN114236417A (en) * | 2021-12-02 | 2022-03-25 | 中国空间技术研究院 | Power supply device aging junction temperature monitoring device |
-
2007
- 2007-05-10 CN CN 200720109306 patent/CN201112798Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103176114A (en) * | 2011-12-20 | 2013-06-26 | 夏普株式会社 | Pre-heating device |
| CN103176114B (en) * | 2011-12-20 | 2016-03-30 | 夏普株式会社 | Pre-burning device |
| CN102646889A (en) * | 2012-04-01 | 2012-08-22 | 中国电子科技集团公司第四十研究所 | Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm |
| CN105552636A (en) * | 2016-02-05 | 2016-05-04 | 中国电子科技集团公司第四十研究所 | Modular embedded integrated circuit socket |
| CN114236417A (en) * | 2021-12-02 | 2022-03-25 | 中国空间技术研究院 | Power supply device aging junction temperature monitoring device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG CHANGXING ELETRONICS FACTORY CO., LTD. Free format text: FORMER OWNER: CAO HONGGUO Effective date: 20090710 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090710 Address after: No. 86, Zhen Huai Road, Huai village, Zhejiang, Changxing County Province, 313119 Patentee after: Zhejiang Changxing Electronic Factory Co., Ltd. Address before: Room 108, Xinjie electronics factory, Changxing County, Zhejiang Province, 313119 Patentee before: Cao Hongguo |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080910 Termination date: 20100510 |