CN102646889A - Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm - Google Patents
Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm Download PDFInfo
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- CN102646889A CN102646889A CN201210097658XA CN201210097658A CN102646889A CN 102646889 A CN102646889 A CN 102646889A CN 201210097658X A CN201210097658X A CN 201210097658XA CN 201210097658 A CN201210097658 A CN 201210097658A CN 102646889 A CN102646889 A CN 102646889A
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Abstract
The invention discloses a ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm. The CQFP series aging test socket comprises an installation plate and a cover plate which are movably hinged through a hinge shaft. The CQFP series aging test socket is characterized in that a torsion spring is sheathed on the hinge shaft, a clamping block which is in clamping fit with the installation plate is arranged at the end part of the cover plate, contact pieces with quantity being equal to the quantity of leads of a package are installed on the installation plate, the upper end of each contact piece is a contact end, the lower end of each contact piece is a welding end, the two sides of the middle part of each contact piece are respectively provided with a press fitting part and each press fitting part is provided with a barb. The back surface of the cover plate of the CQFP series aging test socket is provided with teeth, wherein the quantity of the teeth is equal to the quantity of the contact pieces and the width of the teeth is less than the slot width of the installation plate and is more than the width of the leads of the package. The teeth are used for providing enough pressure to the leads of the package through the contact pieces. The upper surface and the lower surface of the cover plate are provided with a plurality of process slots. The CQFP series aging test socket can be used for the aging test of the package both before forming and after forming, and is easy to machine and assemble. The structure of the CQFP series aging test socket is a novel structure which is designed according to the structural characteristics of the package, the package is convenient to place and position and the package can be well protected during testing.
Description
Technical field
The present invention relates to ageing test jack field, specifically belong to the CQFP series ageing test jack that pitch is not less than 0.8mm.
Background technology
Domestic about pitch greater than, the CQFP series packing forms that equals 0.8mm for tape insulation does not connect muscle, be elongated " one " shape before its lead-in wire moulding, be " L " shape after the moulding.According to the requirement of technique of integrated circuit packaging, ic package all should carry out the ageing test before and after the moulding, and at present domestic generally have two kinds of structure types about the required socket of this type of encapsulation, both before the moulding with moulding after the version of test jack different.What adopt before the moulding is that packaging part is fixed on earlier in the two-piece type protective device, is placed on the contact chip again, and with carrying out the ageing test after the cover plate locking, it is pretty troublesome that the user feels in use; Though be designed with positioner in the socket that adopts after the moulding, because positioner is smaller, and its effect can only keep apart each contact chip, and giving the structure of the package leads application of force on the pressing plate is the plane, has the situation of loose contact to take place when the user uses.And the user will purchase two kinds of sockets, supply moulding before and after the ageing test use, increased cost.
The most frequently used material of the socket of present domestic research and development is polyphenylene sulfide (PPS); This material can only can continuous firing under the situation that does not receive external force under 260 ℃ high temperature; But because its heat distortion temperature is low; Have only 115 ℃,, cause socket to lose efficacy if therefore at high temperature stressed part will be out of shape.
Summary of the invention
The purpose of this invention is to provide the CQFP series ageing test jack that a kind of pitch is not less than 0.8mm, can be used for the ageing test before the packaging part moulding, also can be used for the ageing test after the packaging part moulding, be convenient to processing, be convenient to assembling.The structure of this invention is the brand new that designs voluntarily according to the design feature that encapsulates, and is convenient to placement, the location of packaging part, and tamper seal piece installing well in process of the test.
Technical scheme of the present invention is following:
Pitch is not less than the CQFP series ageing test jack of 0.8mm, includes the mounting panel, the cover plate that are movably hinged through hinge, is set with torsion spring on the hinge; The end of cover plate is provided with the fixture block that fastens with mounting panel; The contact chip that equates with package leads quantity is installed on the mounting panel, and each contact chip upper end is a contact jaw, and the lower end is a welding ends; The both sides at middle part have press-fitting portion respectively, and press-fitting portion has pawl.
The identical groove of testing with ageing of package leads number is arranged on the said mounting panel, be designed with three square holes of fixed installation contact chip in each groove.
The outer wall of described cover plate has a plurality of grooves.
The present invention is according to the design feature of CQFP packaging part and the actual demand of ageing test; Every kind of pitch be not less than 0.8mm CQFP series ageing test jack footprint design a kind of socket of structure; Can be used for the preceding ageing test of packaging part moulding; Also can be used for the ageing test after the packaging part moulding, not only convenient but also can reduce purchase cost concerning the user.The contact chip of this invention has adopted optimal design, is convenient to processing, is convenient to assembling.The structure of this invention is the brand new that designs voluntarily according to the design feature that encapsulates, and is convenient to placement, the location of packaging part, and tamper seal piece installing well in process of the test.
The present invention is made up of mechanical driving mechanism, retaining mechanism and contact chip.Mechanical driving mechanism is made up of parts such as cover plate, plastic clip hook structure, torsion spring and axles; The plastic clip hook structure is by being connected with spring through axle between fixture block and the cover plate; Retaining mechanism by mechanical driving mechanism through axle, torsion spring is connected with mounting panel, owing to being designed with torsion spring, makes cover plate and the angle that can open 95 °～100 ° of formation after mounting panel is connected naturally, be convenient to the user and place packaging part.What this invention was adopted is flip-shell ZIF structure.This structure is convenient and swift in use, does not need specific purpose tool, can well protect IC-components again simultaneously, and its characteristics of being convenient to insert fast and extract is very important in test-ageing.
Contact chip of the present invention is a general part, and both the pitch contact chip that is not less than the CQFP series ageing test jack of 0.8mm all used this contact chip.Contact chip is the crucial conductive pieces of this invention, and its structural design will take into full account the contact reliability of product, the feasibility of assembling and the operability of welding.Contact chip is designed to two kinds of versions, thickness is 0.35mm for this reason.The structure and the size of the contact jaw of these two kinds of contact chips are in full accord, through the correctness of design of Simulation and Theoretical Calculation checking structural design, to guarantee the reliability of contact; The welding ends of two kinds of contact chips is for being staggered front to back arrangement, and the welding ends pitch is 2 times of packaging part pitch, and array pitch is 5.08, because the pitch of welding ends has been increased, has guaranteed the operability of welding; Assembling for ease guarantees that contact chip is seated the consistency of back contact jaw, the contact chip of this invention is press-fitted the position and is improved to two places of balance by a place, and each contact chip has all increased a policy hangnail structure with the mounting panel close-fitting.
The identical groove of testing with ageing of package leads number is arranged on the mounting panel of this practicality, be designed with three square holes of fixed installation contact chip in each groove.The positioner that the present invention adopts utilizes the groove of mounting panel; Contact chip is installed in the groove of mounting panel; The lead-in wire of packaging part directly is placed on the contact site of contact chip, because there is certain distance H on the contact site of contact chip and the groove top of mounting panel, its design height is the thickness of 0.9mm greater than package leads; Can guarantee that packaging part well is positioned in the groove, and can guarantee that lead-in wire is indeformable in process of the test.The installation of the present invention and contact chip is press-fitted the position and increases to two places (two square holes).
The back side of cover plate of the present invention, promptly be designed with the contact chip number with one side that contact chip combines equate, width is less than the mounting panel well width, but greater than the tooth of package leads width.After fixture block on the cover plate and the mounting panel fastening; The lead-in wire that tooth on the lid is given packaging part through contact chip is with enough pressure; This structure both can tamper seal piece installing well in the socket course of work, and the lead-in wire of packaging part is contacted with the contact chip of socket reliably.The socket of this class formation is applicable to the ageing test before or after the packaging part moulding.
In order to prevent the plastic part its surface compressed, influence outward appearance, working of plastics has all designed several fabrication holes.
Continuous high temperature still can be worked reliably and do not lost efficacy when making product satisfy ageing, and the working of plastics in this invention selects heat distortion temperature to be higher than the polyether sulfone (PES) and the PEI (PEI) of working temperature.
Advantage and effect that the present invention is compared with prior art had are following:
The present invention organically combines positioner and mounting panel, and retaining mechanism and cover plate become one, and be convenient to use; Through the optimal design of contact chip, make product have contact reliably, be easy to the product assembling; Through selecting new material for use, make that this product ability continuous firing is indeformable in 150 ℃ hot environment.This invention can be used for the ageing test that pitch is not less than the CQFP series encapsulated moulding front and back of 0.8mm.This product user has used on the machine many batches, and is all very satisfied to the outward appearance and the performance of product.Through using checking, this performance of products has satisfied instructions for use.Key index of the present invention is contact resistance, insulation resistance, mechanical endurance, high temperature service life etc.All items all according to the target requirement of army of enterprise, is tested, and test result is qualified.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is the structural representation of contact chip of the present invention.
Embodiment
Referring to accompanying drawing; Pitch is not less than the CQFP series ageing test jack of 0.8mm; Include the mounting panel 1, the cover plate 2 that are movably hinged through hinge; Being designed with the contact chip number of cover plate 2 equates, width is less than the mounting panel well width, but greater than the tooth 11 of package leads width, its effect be give packaging part through contact chip lead-in wire with enough pressure; The upper and lower surfaces of cover plate 2 has a plurality of grooves 10; Be set with torsion spring 3 on the hinge, the end of cover plate is provided with the fixture block 4 that fastens with mounting panel, and contact chip 5 is installed on the mounting panel; Contact chip 5 upper ends are contact jaw 6; The lower end is a welding ends 7, and the both sides at middle part have press-fitting portion 8 respectively, and press-fitting portion 8 has pawl 9.
Claims (3)
1. pitch is not less than the CQFP series ageing test jack of 0.8mm, includes the mounting panel, the cover plate that are movably hinged through hinge, it is characterized in that: be set with torsion spring on the hinge; The end of cover plate is provided with the fixture block that fastens with mounting panel; The contact chip that equates with package leads quantity is installed on the mounting panel, and each contact chip upper end is a contact jaw, and the lower end is a welding ends; The both sides at middle part have press-fitting portion respectively, and press-fitting portion has pawl.
2. pitch according to claim 1 is not less than the CQFP series ageing test jack of 0.8mm; It is characterized in that: the identical groove of testing with ageing of package leads number is arranged on the said mounting panel, be designed with three square holes of fixed installation contact chip in each groove.
3. pitch according to claim 1 is not less than the CQFP series ageing test jack of 0.8mm, and it is characterized in that: the outer wall of described cover plate has a plurality of grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210097658XA CN102646889A (en) | 2012-04-01 | 2012-04-01 | Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210097658XA CN102646889A (en) | 2012-04-01 | 2012-04-01 | Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102646889A true CN102646889A (en) | 2012-08-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210097658XA Pending CN102646889A (en) | 2012-04-01 | 2012-04-01 | Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102646889A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103323631A (en) * | 2013-06-28 | 2013-09-25 | 中国电子科技集团公司第四十研究所 | CQFP package part aging test socket with floating carriages |
| CN104865422A (en) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第四十研究所 | Rotary hand wheel type ageing testing socket without insertion and extraction force |
| CN105552636A (en) * | 2016-02-05 | 2016-05-04 | 中国电子科技集团公司第四十研究所 | Modular embedded integrated circuit socket |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6412480A (en) * | 1987-07-07 | 1989-01-17 | Nec Corp | High frequency socket |
| CN201112798Y (en) * | 2007-05-10 | 2008-09-10 | 曹宏国 | 36 wire ceramic four-side lead wire flat packaging integrated circuit aging testing socket |
| CN201112801Y (en) * | 2007-05-10 | 2008-09-10 | 曹宏国 | 160 wire ceramic four-side lead wire sheet type carrier aging testing socket |
| CN201876477U (en) * | 2010-08-02 | 2011-06-22 | 曹金学 | Aging test socket of 100-wire 0.5-pitch ceramic quad flat pack (CQFP) device |
| CN202651470U (en) * | 2012-04-01 | 2013-01-02 | 中国电子科技集团公司第四十研究所 | CQFP series aging test socket with pitch no less than 0.8mm |
-
2012
- 2012-04-01 CN CN201210097658XA patent/CN102646889A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6412480A (en) * | 1987-07-07 | 1989-01-17 | Nec Corp | High frequency socket |
| CN201112798Y (en) * | 2007-05-10 | 2008-09-10 | 曹宏国 | 36 wire ceramic four-side lead wire flat packaging integrated circuit aging testing socket |
| CN201112801Y (en) * | 2007-05-10 | 2008-09-10 | 曹宏国 | 160 wire ceramic four-side lead wire sheet type carrier aging testing socket |
| CN201876477U (en) * | 2010-08-02 | 2011-06-22 | 曹金学 | Aging test socket of 100-wire 0.5-pitch ceramic quad flat pack (CQFP) device |
| CN202651470U (en) * | 2012-04-01 | 2013-01-02 | 中国电子科技集团公司第四十研究所 | CQFP series aging test socket with pitch no less than 0.8mm |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103323631A (en) * | 2013-06-28 | 2013-09-25 | 中国电子科技集团公司第四十研究所 | CQFP package part aging test socket with floating carriages |
| CN103323631B (en) * | 2013-06-28 | 2016-06-15 | 中国电子科技集团公司第四十研究所 | CQFP packaging part ageing test jack with floating bracket |
| CN104865422A (en) * | 2015-06-12 | 2015-08-26 | 中国电子科技集团公司第四十研究所 | Rotary hand wheel type ageing testing socket without insertion and extraction force |
| CN105552636A (en) * | 2016-02-05 | 2016-05-04 | 中国电子科技集团公司第四十研究所 | Modular embedded integrated circuit socket |
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Application publication date: 20120822 |