CN201084730Y

CN201084730Y - LED encapsulation structure

Info

Publication number: CN201084730Y
Application number: CNU2007201717360U
Authority: CN
Inventors: 宋文洲
Original assignee: HENGGANG GUANGTAI ELECTRONIC FACTORY LONGGANG DISTRICT SHENZHEN; KINGBRIGHT ELECTRONICS Co Ltd
Current assignee: HENGGANG GUANGTAI ELECTRONIC FACTORY LONGGANG DISTRICT SHENZHEN; KINGBRIGHT ELECTRONICS Co Ltd
Priority date: 2007-09-06
Filing date: 2007-09-06
Publication date: 2008-07-09
Anticipated expiration: 2017-09-06

Abstract

The utility model provides a light emitting diode (LED) encapsulation structure, comprising a circuit substrate, wherein, a first metal layer, a second metal layer and a third metal layer are arranged on both sides of the circuit substrate respectively; one or more LED chips are arranged on the circuit substrate; a blind hole is arranged at the bottom of the circuit substrate and connected electrically with the second metal layer. The utility model has the advantages of facilitating welding due to the blind hole arranged at the bottom of the circuit substrate and improving the electric connection and welding performance. The utility model is suitable for LEDs.

Description

A kind of package structure for LED

Technical field

The utility model belongs to light-emitting diode, relates in particular to a kind of package structure for LED.

Background technology

Tradition sees also Fig. 1, as shown in the figure when making LED package, be respectively arranged with metal level 2,3,5 in substrate 1 both sides, and extend at metal level 3 and to be connected with an extension 4, this extension 4 can be connected, the enough voltage sources that provide light-emitting diode to use with the external world.Tradition all need be used the mode of welding, and metal level 2,3,5 is put an action of welding with electric connection respectively, just the voltage source of outside can be transferred to light-emitting diode chip for backlight unit and use.

Above-mentioned welding action usually because the board structure design is bad, causes the weld undercapacity, be easy to that substrate and circuit board are peeled off in use for some time, or in rocking, come off, cause the loose contact of circuit at last or open circuit, make whole group led failure.

The utility model content

Technical problem to be solved in the utility model is to provide a kind of package structure for LED, is intended to solve the problem that encapsulating structure of the prior art exists electric connection and welding performance difference.

The utility model is to realize like this, a kind of package structure for LED, have a circuit substrate, be respectively arranged with the first metal layer, second metal level, the 3rd metal level in the both sides of this circuit substrate, one or more light-emitting diode chip for backlight unit are arranged on the circuit substrate; Bottom at described circuit substrate is provided with blind hole, and the described blind hole and second metal level electrically connect.

In the utility model, need during use this encapsulation main body directly is welded on the circuit board to electrically connect, make light-emitting diode chip for backlight unit luminous, in the circuit substrate bottom blind hole is set and helps welding, thereby reach the effect of improving electric connection and welding performance.

Description of drawings

Fig. 1 is the schematic perspective view of prior art.

Fig. 2 is the schematic perspective view of the utility model one preferred embodiment.

Fig. 3 is the schematic perspective view of another embodiment of the utility model.

Fig. 4 is that illustration is implemented in the welding of the utility model package structure for LED.

Embodiment

In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.

See also Fig. 2, the utility model package structure for LED comprises: encapsulation main body 10, circuit substrate 101, light-emitting diode chip for backlight unit 12 and the first metal layer 102, second metal level 103, the 3rd metal level 106.

This circuit substrate 101 is positioned on the encapsulation main body 10, and metal level 102,103,106 lays respectively at the both sides of circuit substrate 101, this metal level the 102,103, the 106th, utilize metal lightly, thin characteristic again, circuit substrate 101 both sides are coated and fixed; Be provided with blind hole 11 in the bottom of circuit substrate 101, this blind hole 11 electrically connects by the connecting portion 104 and second metal level 103, and reaches the effect in transmission voltage source together by the metal level 102,103,106 of both sides.Described light-emitting diode chip for backlight unit 12 is arranged on this circuit substrate 101; above light-emitting diode chip for backlight unit 12, be provided with colloid 14; utilize this colloid 14 that these light-emitting diode chip for backlight unit 12 covering protections, and this blind hole 11 can be arranged at this circuit substrate 101 bottoms in the mode of semicircular bodies, half cuboid or semiellipse body.

Please consult Fig. 3 more simultaneously, be another embodiment of the utility model package structure for LED, as shown in the figure, this blind hole 11 is that the mode with half cuboid 105 is arranged at this circuit substrate 101 bottoms, at these blind hole 11 internal layers, in the mode of electroplating, electroplate a metal level in blind hole inside, make the conductivity of this blind hole better.

See also Fig. 4, be the utility model package structure for LED welding embodiment, as shown in the figure, on a circuit board 16,, circuit board 16 and metal level 102,103,106 and blind hole 11 are welded together, this encapsulation main body 10 can firmly be arranged on this circuit board 16 by tin ball 18 with the mode of encapsulation main body 10 of the present utility model with welding, and can not come off because of rocking easily of external force, very convenient, manufacturing cost is not high yet, is fit to very much industry and produces in a large number.

The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection range of the present utility model.

Claims

1. a package structure for LED has a circuit substrate, is respectively arranged with the first metal layer, second metal level, the 3rd metal level in the both sides of this circuit substrate, and one or more light-emitting diode chip for backlight unit are arranged on the circuit substrate; It is characterized in that, be provided with blind hole in the bottom of described circuit substrate, the described blind hole and second metal level electrically connect.

2. package structure for LED as claimed in claim 1 is characterized in that, covers above described light-emitting diode chip for backlight unit and is provided with colloid.

3. package structure for LED as claimed in claim 1 is characterized in that, described blind hole is arranged at described circuit substrate bottom with semicircular bodies, half cuboid or semiellipse body.

4. as any described package structure for LED in the claim 1 to 3, it is characterized in that described blind hole internal electrical is coated with metal level.