CN201051493Y

CN201051493Y - An industrial installation device for placing silicon slice

Info

Publication number: CN201051493Y
Application number: CNU2007200697891U
Authority: CN
Inventors: 郭里辉
Original assignee: TAIYUAN GREEN ENERGY CO Ltd SHANGHAI JIAOTONG UNIV
Current assignee: TAIYUAN GREEN ENERGY CO Ltd SHANGHAI JIAOTONG UNIV
Priority date: 2007-05-14
Filing date: 2007-05-14
Publication date: 2008-04-23
Anticipated expiration: 2017-05-14

Abstract

The utility model relates to frock equipment for silicon chips to be placed, and is characterized in that the utility model comprises a working plate and a supporting table, the fixed supporting table which is corresponding to the middle of latch hooks which are distributed all-round each frame in a silicon chip transfer device is arranged on the working plate, the utility model is placed below a silicon chip carrier plate for dropping the supporting table at the middle of the latch hook of each frame in the silicon chip carrier plate to be centrally positioned as much as possible, because the supporting table is higher than hooks, operators gradually place silicon chips on each supporting table, after each supporting table is filled, the silicon chip carrier plate is uplifted, the silicon chips which are already placed on the supporting table of the utility model are transferred to the latch hooks of the silicon chip carrier plate, because the contact face of the supporting table and the placed silicon chips is larger than that of the hooks and the placed silicon chips, the damaged rate of the placed silicon chips is smaller, and the utilization is convenient. The utility model has the advantages of enhancing the working efficiency and reducing the brokenness of silicon chips.

Description

A kind of tooling device of placing silicon chip

Technical field

The utility model relates to a kind of tooling device of placing silicon chip, can be used for helping silicon chip transfer in process of production, be specially adapted to reduce the silicon chip fragment rate of being introduced in the transferring silicon chip process in the crystal-silicon solar cell production, belong to silicon chip processing unit (plant) technical field.

Background technology

On present solar cell market, monocrystalline, polycrystalline silicon solar cell have occupied the market share more than 90%, and this class solar cell is produced on the monocrystalline or polycrystalline silicon substrate that is called as silicon chip.In the production process of solar cell, often need many pieces of silicon chips are placed on the support plate abreast, again support plate is sent into processes equipment, the silicon chip that is carried is processed.

As shown in Figure 1, for a kind of many pieces of silicon chips are placed into the structural representation of a support plate abreast, this support plate is made up of the framework 03 and the body hook 04 of accepting that supports silicon chip.The framework of support plate can be made by metal or nonmetallic dielectric material, the profile of two wherein adjacent frames as shown in Figure 2, space in the frame is set for placing silicon chip, be provided with in the inboard of each frame and accept body hook 04, in order to accept the silicon chip of putting into the frame space, why accepting silicon chip with hook 04, is because the machined surface of silicon chip is contacted with hook 04.Adopt hook structure, can reduce the silicon chip machined surface and be linked up with 04 area that is blocked herein.

In the actual production operating process, hand-held tweezers of operating personnel or vacuum WAND are put into each framework 03 with silicon chip, accepting body hook 04 holds the silicon chip of being put into, owing to accept on the body hook 04 less with the contact area of silicon chip, the fulcrum that supports silicon chip is limited, at dress, unload in the operation of silicon chip, cause the silicon chip fragmentation easily, and, along with solar cell is produced desired silicon area and is constantly increased, silicon wafer thickness constantly reduces, directly on this support plate, adorn, unloading silicon chip will be difficult to satisfy extensive, the high-speed production solar cell, the requirement that keeps low silicon chip percentage of damage simultaneously.

In the solar cell production process, obtaining low silicon chip percentage of damage is the necessary condition that obtains profit.

Summary of the invention

The purpose of this utility model provides a kind of minimizing silicon chip percentage of damage, reduces production costs, improves the tooling device of the placement silicon chip of solar cell online production efficient.

For realizing above purpose, the technical solution of the utility model provides a kind of tooling device of placing silicon chip, it is characterized in that, form by working plate and brace table, on working plate, be provided with the silicon chip transfer device in pairing fixed support platform in the middle of the hook around each framework.

The thickness of described working plate is 5mm-15mm, and material is metal plate or insulating material flat board; Described fixed support table top is long-pending littler than silicon chip, and thickness is 3mm-8mm, is higher than the hook of silicon chip transfer device.

The utility model be placed on the silicon chip support plate below, and brace table is fallen within the middle of the hook of each frame of silicon chip support plate, placed in the middle as far as possible, because brace table is than hook height, the operator is put into silicon chip on each brace table one by one, after piling each brace table, the silicon chip support plate is lifted, all originally just were transferred on the silicon chip support plate hook at the silicon chip on the utility model brace table, owing to the contact-making surface of brace table with the silicon chip that is placed, more much bigger with the contact-making surface of the silicon chip that is placed than hook, silicon chip impaired probability in placement is just much smaller, and makes things convenient for manyly.

The utility model has the advantages that and to enhance productivity, reduce the silicon chip fragmentation.

Description of drawings

Fig. 1 is the schematic top plan view of silicon chip carrying board structure;

Fig. 2 is the generalized section of two adjacent frames of silicon chip support plate;

Fig. 3 is a kind of tooling device structural representation of placing silicon chip;

Fig. 4 is a kind of generalized section of placing two adjacent supports platforms of tooling device of silicon chip;

Fig. 5 is placed on schematic top plan view on the utility model with the silicon chip support plate;

Silicon chip support plate and mutual alignment of the present utility model concern generalized section between two frames of Fig. 6.

Embodiment

The utility model is described in further detail below in conjunction with drawings and Examples.

Embodiment

Shown in Fig. 3,4, for a kind of tooling device structural representation of placing silicon chip, form by working plate 01 and brace table 02, on working plate 01, be provided with the silicon chip transfer device in link up with 04 around each framework 03 in the middle of pairing fixed support platform 02.

Working plate 01 employing thickness is that the smooth aluminium sheet of 8mm is a base plate, brace table 02 adopts long, wide, height is respectively 90mm, 90mm, the polytetrafluoroethylene piece of 120mm, this material has certain anti-400 ℃ of hot propertiess, be difficult for the silicon chip of being accepted is formed contamination, be easy to processing, brace table 2 is arranged on the aluminum soleplate with matrix form, and fixed, the surface of thrust at the silicon chip brace table must not be arranged after fixedly finishing, to avoid damage to accepted silicon chip, with the silicon chip support plate is object of reference, makes each brace table 02 place hook 04 centre of each frame 03 of silicon chip support plate.

During work, the silicon chip support plate is placed on the utility model, shown in Fig. 5,6, the height of brace table 02 is accepted the height of body hook 04 a little more than the silicon chip support plate, when the operator puts into frame with silicon chip, silicon chip is accepted brace table 02, and be not directly drop on the silicon chip support plate accept body hook 04 above, owing to the contact-making surface of brace table 02 with the silicon chip that is placed, body hook 04 is much bigger with the contact-making surface of the silicon chip that is placed than accepting, and silicon chip impaired probability in placement is just much smaller.After finishing silicon chip and putting into frame, the parallel end of silicon chip support plate is risen, be placed on the silicon chip on the silicon chip brace table 02 in the frame just dropped on automatically the silicon chip support plate accept body hook 04 above, silicon chip is put into the operation of silicon chip support plate and is finished.

Claims

1. a tooling device of placing silicon chip is characterized in that, is made up of working plate (01) and brace table (02), on working plate (01), be provided with the silicon chip transfer device in each framework (03) link up with pairing fixed support platform (02) in the middle of (04) all around.

2. a kind of tooling device of placing silicon chip according to claim 1 is characterized in that the thickness of described working plate (01) is 5mm-15mm, and material is metal plate or insulating material flat board.

3. a kind of tooling device of placing silicon chip according to claim 1 is characterized in that described fixed support platform (02) area is littler than silicon chip, and thickness is 3mm-8mm, is higher than the hook (04) of silicon chip transfer device.