CN200988128Y - 键合头装置 - Google Patents
键合头装置 Download PDFInfo
- Publication number
- CN200988128Y CN200988128Y CNU2006202010988U CN200620201098U CN200988128Y CN 200988128 Y CN200988128 Y CN 200988128Y CN U2006202010988 U CNU2006202010988 U CN U2006202010988U CN 200620201098 U CN200620201098 U CN 200620201098U CN 200988128 Y CN200988128 Y CN 200988128Y
- Authority
- CN
- China
- Prior art keywords
- pivoted arm
- housed
- bonding
- transducer
- moving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006202010988U CN200988128Y (zh) | 2006-12-22 | 2006-12-22 | 键合头装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2006202010988U CN200988128Y (zh) | 2006-12-22 | 2006-12-22 | 键合头装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN200988128Y true CN200988128Y (zh) | 2007-12-12 |
Family
ID=38939172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2006202010988U Expired - Fee Related CN200988128Y (zh) | 2006-12-22 | 2006-12-22 | 键合头装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN200988128Y (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102343477A (zh) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | 一种键合头装置 |
CN102343476A (zh) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | 键合头装置 |
CN102569111A (zh) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | 用于引线键合的压板 |
CN102751206A (zh) * | 2012-07-17 | 2012-10-24 | 贵州振华风光半导体有限公司 | 一种加固集成电路内引线键合力的方法 |
CN106449447A (zh) * | 2016-11-21 | 2017-02-22 | 北京中电科电子装备有限公司 | 一种自动送线与断线装置及方法 |
CN116160105A (zh) * | 2023-04-18 | 2023-05-26 | 宁波尚进自动化科技有限公司 | 键合焊接装置及包含其的压焊设备 |
-
2006
- 2006-12-22 CN CNU2006202010988U patent/CN200988128Y/zh not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102343477A (zh) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | 一种键合头装置 |
CN102343476A (zh) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | 键合头装置 |
CN102343477B (zh) * | 2010-08-02 | 2014-02-19 | 北京中电科电子装备有限公司 | 一种键合头装置 |
CN102569111A (zh) * | 2011-12-27 | 2012-07-11 | 三星半导体(中国)研究开发有限公司 | 用于引线键合的压板 |
CN102751206A (zh) * | 2012-07-17 | 2012-10-24 | 贵州振华风光半导体有限公司 | 一种加固集成电路内引线键合力的方法 |
CN102751206B (zh) * | 2012-07-17 | 2015-01-21 | 贵州振华风光半导体有限公司 | 一种加固集成电路内引线键合力的方法 |
CN106449447A (zh) * | 2016-11-21 | 2017-02-22 | 北京中电科电子装备有限公司 | 一种自动送线与断线装置及方法 |
CN106449447B (zh) * | 2016-11-21 | 2019-03-08 | 北京中电科电子装备有限公司 | 一种自动送线与断线装置及方法 |
CN116160105A (zh) * | 2023-04-18 | 2023-05-26 | 宁波尚进自动化科技有限公司 | 键合焊接装置及包含其的压焊设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: CETC Beijing Electronic Equipment Co., Ltd. Assignor: No.45 Inst., China Electronic science and Technology Group Corp. Contract fulfillment period: 2007.3.1 to 2014.12.29 Contract record no.: 2009990000523 Denomination of utility model: Rotating lead bonding joint device Granted publication date: 20071212 License type: Exclusive license Record date: 20090518 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.3.1 TO 2014.12.29; CHANGE OF CONTRACT Name of requester: BEIJING ZHONGDIAN SCIENCE ELECTRONIC EQUIPMENT CO. Effective date: 20090518 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071212 Termination date: 20111222 |